EP3026764A4 - Verfahren zur herstellung eines anisotropen leitfähigen elements und verfahren zur herstellung einer anisotropen leitfähigen bondingverkapselung - Google Patents
Verfahren zur herstellung eines anisotropen leitfähigen elements und verfahren zur herstellung einer anisotropen leitfähigen bondingverkapselungInfo
- Publication number
- EP3026764A4 EP3026764A4 EP14830337.3A EP14830337A EP3026764A4 EP 3026764 A4 EP3026764 A4 EP 3026764A4 EP 14830337 A EP14830337 A EP 14830337A EP 3026764 A4 EP3026764 A4 EP 3026764A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- fabrication
- anisotropic conductive
- bonding package
- conductive member
- conductive bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/04—Anodisation of aluminium or alloys based thereon
- C25D11/18—After-treatment, e.g. pore-sealing
- C25D11/24—Chemical after-treatment
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/006—Nanostructures, e.g. using aluminium anodic oxidation templates [AAO]
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/04—Anodisation of aluminium or alloys based thereon
- C25D11/045—Anodisation of aluminium or alloys based thereon for forming AAO templates
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/04—Anodisation of aluminium or alloys based thereon
- C25D11/18—After-treatment, e.g. pore-sealing
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/04—Anodisation of aluminium or alloys based thereon
- C25D11/18—After-treatment, e.g. pore-sealing
- C25D11/20—Electrolytic after-treatment
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
- C25D5/50—After-treatment of electroplated surfaces by heat-treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/04—Anodisation of aluminium or alloys based thereon
- C25D11/06—Anodisation of aluminium or alloys based thereon characterised by the electrolytes used
- C25D11/10—Anodisation of aluminium or alloys based thereon characterised by the electrolytes used containing organic acids
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/04—Anodisation of aluminium or alloys based thereon
- C25D11/16—Pretreatment, e.g. desmutting
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Nanotechnology (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Non-Insulated Conductors (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Environmental & Geological Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013151603 | 2013-07-22 | ||
PCT/JP2014/069239 WO2015012234A1 (ja) | 2013-07-22 | 2014-07-18 | 異方導電性部材の製造方法および異方導電性接合パッケージの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
EP3026764A1 EP3026764A1 (de) | 2016-06-01 |
EP3026764A4 true EP3026764A4 (de) | 2016-11-16 |
Family
ID=52393273
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP14830337.3A Withdrawn EP3026764A4 (de) | 2013-07-22 | 2014-07-18 | Verfahren zur herstellung eines anisotropen leitfähigen elements und verfahren zur herstellung einer anisotropen leitfähigen bondingverkapselung |
Country Status (6)
Country | Link |
---|---|
US (1) | US20160138180A1 (de) |
EP (1) | EP3026764A4 (de) |
JP (2) | JP6030241B2 (de) |
KR (1) | KR101795538B1 (de) |
CN (1) | CN105431987A (de) |
WO (1) | WO2015012234A1 (de) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107113984B (zh) * | 2014-12-19 | 2019-06-04 | 富士胶片株式会社 | 多层配线基板 |
CN110226264B (zh) * | 2017-02-09 | 2021-12-28 | 华为技术有限公司 | 金属壳体连接器 |
JP6773884B2 (ja) * | 2017-02-28 | 2020-10-21 | 富士フイルム株式会社 | 半導体デバイス、積層体ならびに半導体デバイスの製造方法および積層体の製造方法 |
EP3431637A1 (de) * | 2017-07-18 | 2019-01-23 | IMEC vzw | Poröse feststoffe und verfahren zur herstellung |
JP6976883B2 (ja) * | 2018-02-27 | 2021-12-08 | 富士フイルム株式会社 | 異方導電性部材、異方導電性部材の製造方法、接合体および電子デバイス |
KR102361397B1 (ko) * | 2019-01-21 | 2022-02-10 | (주)포인트엔지니어링 | 프로브 핀 기판 및 이를 이용한 프로브 카드 제조 방법 |
CN113423872B (zh) * | 2019-02-15 | 2024-06-04 | 富士胶片株式会社 | 阳极氧化处理方法及各向异性导电性部件的制造方法 |
CN110261020A (zh) * | 2019-06-18 | 2019-09-20 | 浙江工业大学 | 适用于测量非等轴残余应力的四压头组件 |
CN110317944B (zh) * | 2019-06-27 | 2021-07-13 | 中国科学院宁波材料技术与工程研究所 | 残余应力消除装置 |
KR102606892B1 (ko) * | 2021-06-15 | 2023-11-29 | (주)포인트엔지니어링 | 검사 소켓용 지지 플레이트, 검사 소켓용 소켓핀 및 이들을 구비하는 검사 소켓 |
CN115615591B (zh) * | 2022-08-16 | 2023-07-21 | 哈尔滨工业大学 | 基于多晶元空气耦合换能器的平面应力超声测量方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3120975A1 (de) * | 1981-05-26 | 1982-12-16 | Eberhard 7121 Freudental Keller | Verfahren zur herstelung eloxierter druckbleche |
JPH0277597A (ja) * | 1988-09-12 | 1990-03-16 | Nippon Mining Co Ltd | リフローめっき材の製造方法 |
JP2011202194A (ja) * | 2010-03-24 | 2011-10-13 | Fujifilm Corp | 金属充填微細構造体の製造方法 |
EP2399694A1 (de) * | 2009-02-17 | 2011-12-28 | FUJIFILM Corporation | Metallelement |
JP2013069629A (ja) * | 2011-09-26 | 2013-04-18 | Fujifilm Corp | 異方導電性部材およびその製造方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3154713B2 (ja) * | 1990-03-16 | 2001-04-09 | 株式会社リコー | 異方性導電膜およびその製造方法 |
JPH0547428A (ja) * | 1991-08-12 | 1993-02-26 | Ricoh Co Ltd | 異方性導電膜およびそれを用いた電子部品の接続方法 |
JP2004174630A (ja) * | 2002-11-26 | 2004-06-24 | Niigata Tlo:Kk | 超音波照射による残留引張応力除去と圧縮応力付与方法及びその装置 |
JP2007204802A (ja) | 2006-01-31 | 2007-08-16 | Fujifilm Corp | 構造体の製造方法 |
JP5043621B2 (ja) | 2007-03-27 | 2012-10-10 | 富士フイルム株式会社 | 異方導電性部材およびその製造方法 |
JP2009132974A (ja) * | 2007-11-30 | 2009-06-18 | Fujifilm Corp | 微細構造体 |
JP2009244244A (ja) * | 2008-03-14 | 2009-10-22 | Fujifilm Corp | プローブカード |
JP2012078222A (ja) * | 2010-10-01 | 2012-04-19 | Fujifilm Corp | 回路基板接続構造体および回路基板の接続方法 |
-
2014
- 2014-07-18 KR KR1020167001900A patent/KR101795538B1/ko active IP Right Grant
- 2014-07-18 CN CN201480041699.4A patent/CN105431987A/zh active Pending
- 2014-07-18 WO PCT/JP2014/069239 patent/WO2015012234A1/ja active Application Filing
- 2014-07-18 JP JP2015528275A patent/JP6030241B2/ja active Active
- 2014-07-18 EP EP14830337.3A patent/EP3026764A4/de not_active Withdrawn
-
2016
- 2016-01-21 US US15/003,154 patent/US20160138180A1/en not_active Abandoned
- 2016-09-01 JP JP2016170735A patent/JP6166826B2/ja active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3120975A1 (de) * | 1981-05-26 | 1982-12-16 | Eberhard 7121 Freudental Keller | Verfahren zur herstelung eloxierter druckbleche |
JPH0277597A (ja) * | 1988-09-12 | 1990-03-16 | Nippon Mining Co Ltd | リフローめっき材の製造方法 |
EP2399694A1 (de) * | 2009-02-17 | 2011-12-28 | FUJIFILM Corporation | Metallelement |
JP2011202194A (ja) * | 2010-03-24 | 2011-10-13 | Fujifilm Corp | 金属充填微細構造体の製造方法 |
JP2013069629A (ja) * | 2011-09-26 | 2013-04-18 | Fujifilm Corp | 異方導電性部材およびその製造方法 |
Non-Patent Citations (2)
Title |
---|
DATABASE WPI Week 199017, 16 March 1990 Derwent World Patents Index; AN 1990-128608, XP002762582 * |
See also references of WO2015012234A1 * |
Also Published As
Publication number | Publication date |
---|---|
KR101795538B1 (ko) | 2017-11-08 |
JP6030241B2 (ja) | 2016-11-24 |
CN105431987A (zh) | 2016-03-23 |
WO2015012234A1 (ja) | 2015-01-29 |
US20160138180A1 (en) | 2016-05-19 |
JP2017022126A (ja) | 2017-01-26 |
JPWO2015012234A1 (ja) | 2017-03-02 |
EP3026764A1 (de) | 2016-06-01 |
KR20160023844A (ko) | 2016-03-03 |
JP6166826B2 (ja) | 2017-07-19 |
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Legal Events
Date | Code | Title | Description |
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PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
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17P | Request for examination filed |
Effective date: 20160122 |
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AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR |
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AX | Request for extension of the european patent |
Extension state: BA ME |
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RIC1 | Information provided on ipc code assigned before grant |
Ipc: C25D 11/24 20060101ALI20160615BHEP Ipc: C25D 1/00 20060101ALI20160615BHEP Ipc: H01R 11/01 20060101ALI20160615BHEP Ipc: C25D 11/20 20060101ALI20160615BHEP Ipc: H01B 13/00 20060101ALI20160615BHEP Ipc: C25D 11/04 20060101ALI20160615BHEP Ipc: C25D 3/38 20060101ALN20160615BHEP Ipc: C25D 11/10 20060101ALN20160615BHEP Ipc: C25D 11/16 20060101ALN20160615BHEP Ipc: C25D 11/18 20060101ALI20160615BHEP Ipc: H01B 5/16 20060101ALI20160615BHEP Ipc: C23C 18/16 20060101ALN20160615BHEP Ipc: C25D 5/50 20060101ALI20160615BHEP Ipc: H01R 43/00 20060101AFI20160615BHEP |
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DAX | Request for extension of the european patent (deleted) | ||
A4 | Supplementary search report drawn up and despatched |
Effective date: 20161014 |
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RIC1 | Information provided on ipc code assigned before grant |
Ipc: C25D 3/38 20060101ALN20161007BHEP Ipc: H01R 11/01 20060101ALI20161007BHEP Ipc: H01R 43/00 20060101AFI20161007BHEP Ipc: C25D 11/16 20060101ALN20161007BHEP Ipc: C25D 11/24 20060101ALI20161007BHEP Ipc: C25D 11/18 20060101ALI20161007BHEP Ipc: H01B 5/16 20060101ALI20161007BHEP Ipc: H01B 13/00 20060101ALI20161007BHEP Ipc: C25D 11/20 20060101ALI20161007BHEP Ipc: C25D 11/04 20060101ALI20161007BHEP Ipc: C25D 1/00 20060101ALI20161007BHEP Ipc: C25D 11/10 20060101ALN20161007BHEP Ipc: C25D 5/50 20060101ALI20161007BHEP Ipc: C23C 18/16 20060101ALN20161007BHEP |
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17Q | First examination report despatched |
Effective date: 20170913 |
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STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION HAS BEEN WITHDRAWN |
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18W | Application withdrawn |
Effective date: 20171228 |