HK1205592A1 - 半導體器件和電子器件 - Google Patents

半導體器件和電子器件

Info

Publication number
HK1205592A1
HK1205592A1 HK15105949.4A HK15105949A HK1205592A1 HK 1205592 A1 HK1205592 A1 HK 1205592A1 HK 15105949 A HK15105949 A HK 15105949A HK 1205592 A1 HK1205592 A1 HK 1205592A1
Authority
HK
Hong Kong
Prior art keywords
electronic device
semiconductor device
semiconductor
electronic
Prior art date
Application number
HK15105949.4A
Other languages
English (en)
Inventor
武藤晃
小池信也
小辻雅揮
成田幸弘
Original Assignee
Renesas Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Electronics Corp filed Critical Renesas Electronics Corp
Publication of HK1205592A1 publication Critical patent/HK1205592A1/zh

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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Inverter Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
HK15105949.4A 2013-06-14 2015-06-23 半導體器件和電子器件 HK1205592A1 (zh)

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KR20140145994A (ko) 2014-12-24
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EP2814058A3 (en) 2015-05-06
US9704979B2 (en) 2017-07-11
US10453946B2 (en) 2019-10-22
EP2814058A2 (en) 2014-12-17
EP2814058B1 (en) 2020-09-30
CN110299341A (zh) 2019-10-01
CN110299341B (zh) 2022-11-04
JP6130238B2 (ja) 2017-05-17
US20170287818A1 (en) 2017-10-05
US20140367739A1 (en) 2014-12-18
JP2015002229A (ja) 2015-01-05
US20180261690A1 (en) 2018-09-13

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