HK1201984A1 - 電子裝置 - Google Patents

電子裝置

Info

Publication number
HK1201984A1
HK1201984A1 HK15102306.8A HK15102306A HK1201984A1 HK 1201984 A1 HK1201984 A1 HK 1201984A1 HK 15102306 A HK15102306 A HK 15102306A HK 1201984 A1 HK1201984 A1 HK 1201984A1
Authority
HK
Hong Kong
Prior art keywords
electronic device
electronic
Prior art date
Application number
HK15102306.8A
Other languages
English (en)
Inventor
Shintaro Yamamichi
Hirokazu Honda
Masaki Watanabe
Junichi Arita
Norio Okada
Uenojun
Masashi Nishimoto
Michitaka Kimura
Tomohiro Nishiyama
Original Assignee
Renesas Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Electronics Corp filed Critical Renesas Electronics Corp
Publication of HK1201984A1 publication Critical patent/HK1201984A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04W—WIRELESS COMMUNICATION NETWORKS
    • H04W84/00—Network topologies
    • H04W84/18—Self-organising networks, e.g. ad-hoc networks or sensor networks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Arrangements For Transmission Of Measured Signals (AREA)
  • Transceivers (AREA)
HK15102306.8A 2013-05-02 2015-03-06 電子裝置 HK1201984A1 (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013097021A JP6045436B2 (ja) 2013-05-02 2013-05-02 電子装置

Publications (1)

Publication Number Publication Date
HK1201984A1 true HK1201984A1 (zh) 2015-09-11

Family

ID=51807277

Family Applications (1)

Application Number Title Priority Date Filing Date
HK15102306.8A HK1201984A1 (zh) 2013-05-02 2015-03-06 電子裝置

Country Status (4)

Country Link
US (1) US10098179B2 (zh)
JP (1) JP6045436B2 (zh)
CN (1) CN104134649B (zh)
HK (1) HK1201984A1 (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI693511B (zh) 2015-08-25 2020-05-11 美商莫仕有限公司 通信節點
CN109076266B (zh) 2016-03-01 2021-06-25 莫列斯有限公司 通信节点
US10056332B2 (en) * 2016-09-05 2018-08-21 Renesas Electronics Corporation Electronic device with delamination resistant wiring board
JP2018088629A (ja) 2016-11-29 2018-06-07 ソニーセミコンダクタソリューションズ株式会社 高周波モジュール、および通信装置
JP6615140B2 (ja) * 2017-03-10 2019-12-04 株式会社豊田中央研究所 データ収録装置
JP6958266B2 (ja) * 2017-11-10 2021-11-02 トヨタ自動車株式会社 データ収録装置
KR20210029538A (ko) 2019-09-06 2021-03-16 삼성전자주식회사 무선 통신 보드 및 이를 구비한 전자기기

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001267715A (ja) * 2000-03-16 2001-09-28 Sony Corp 電子回路装置および基板接続用弾性体
JP3519666B2 (ja) * 2000-03-30 2004-04-19 シャープ株式会社 Ｐｃカード型無線通信装置
JP2001284119A (ja) * 2000-03-31 2001-10-12 Victor Co Of Japan Ltd モータ、モータ用マグネット、モータ用マグネットの製造方法
US7247932B1 (en) * 2000-05-19 2007-07-24 Megica Corporation Chip package with capacitor
US6856007B2 (en) * 2001-08-28 2005-02-15 Tessera, Inc. High-frequency chip packages
JP2003188626A (ja) * 2001-12-19 2003-07-04 Murata Mfg Co Ltd モジュール一体型アンテナ
JP3575478B2 (ja) 2002-07-03 2004-10-13 ソニー株式会社 モジュール基板装置の製造方法、高周波モジュール及びその製造方法
CN1723587A (zh) * 2002-11-07 2006-01-18 碎云股份有限公司 含微型天线的集成电路封装
JP4065855B2 (ja) 2004-01-21 2008-03-26 株式会社日立製作所 生体および化学試料検査装置
JP2006080493A (ja) * 2004-08-12 2006-03-23 Ricoh Microelectronics Co Ltd 電極基板
JP4752369B2 (ja) * 2004-08-24 2011-08-17 ソニー株式会社 半導体装置および基板
CN101241910B (zh) * 2004-08-24 2012-07-11 索尼株式会社 半导体器件、基底、设备板、半导体器件制造方法和半导体芯片
JP5011820B2 (ja) 2006-05-24 2012-08-29 オムロン株式会社 積層デバイス、およびその製造方法
JP2008166428A (ja) * 2006-12-27 2008-07-17 Sanyo Electric Co Ltd 回路装置及びデジタル放送受信装置
ITTO20070325A1 (it) * 2007-05-11 2008-11-12 St Microelectronics Srl Isolatore galvanico integrato utilizzante trasmissione wireless
US8669480B2 (en) * 2007-05-17 2014-03-11 Ibiden Co., Ltd. Wiring board and method of manufacturing wiring board
US7868830B2 (en) * 2008-05-13 2011-01-11 The Boeing Company Dual beam dual selectable polarization antenna
EP2333828B1 (en) 2008-09-05 2019-11-20 Mitsubishi Electric Corporation High-frequency circuit package, and sensor module
JP5646830B2 (ja) * 2009-09-02 2014-12-24 ルネサスエレクトロニクス株式会社 半導体装置、半導体装置の製造方法、及びリードフレーム
US20110108974A1 (en) * 2009-11-06 2011-05-12 Mediatek Inc. Power and signal distribution of integrated circuits
JP2011165741A (ja) * 2010-02-05 2011-08-25 Renesas Electronics Corp 半導体装置およびその製造方法
JP5617354B2 (ja) * 2010-05-31 2014-11-05 株式会社竹屋 遊技機固定装置
US8963310B2 (en) * 2011-08-24 2015-02-24 Tessera, Inc. Low cost hybrid high density package
JP5590252B2 (ja) * 2011-11-09 2014-09-17 株式会社村田製作所 通信モジュール、コネクタ及びコネクタ付き通信モジュール

Also Published As

Publication number Publication date
JP6045436B2 (ja) 2016-12-14
CN104134649A (zh) 2014-11-05
US10098179B2 (en) 2018-10-09
JP2014220593A (ja) 2014-11-20
US20140329476A1 (en) 2014-11-06
CN104134649B (zh) 2018-06-29

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20230508