HK1204710A1 - Stacked integrated component devices with energization - Google Patents

Stacked integrated component devices with energization

Info

Publication number
HK1204710A1
HK1204710A1 HK15105110.7A HK15105110A HK1204710A1 HK 1204710 A1 HK1204710 A1 HK 1204710A1 HK 15105110 A HK15105110 A HK 15105110A HK 1204710 A1 HK1204710 A1 HK 1204710A1
Authority
HK
Hong Kong
Prior art keywords
energization
integrated component
component devices
stacked integrated
stacked
Prior art date
Application number
HK15105110.7A
Other languages
English (en)
Chinese (zh)
Inventor
Randall B Pugh
Frederick A Flitsch
Daniel B Otts
James Daniel Riall
Adam Toner
Original Assignee
Johnson & Johnson Vision Care
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Johnson & Johnson Vision Care filed Critical Johnson & Johnson Vision Care
Publication of HK1204710A1 publication Critical patent/HK1204710A1/xx

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00—Producing optical elements, e.g. lenses or prisms
    • B29D11/00009—Production of simple or compound lenses
    • B29D11/00038—Production of contact lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00—Producing optical elements, e.g. lenses or prisms
    • B29D11/0074—Production of other optical elements not provided for in B29D11/00009- B29D11/0073
    • B29D11/00807—Producing lenses combined with electronics, e.g. chips
    • B29D11/00817—Producing electro-active lenses or lenses with energy receptors, e.g. batteries or antennas
    • B29D11/00826—Producing electro-active lenses or lenses with energy receptors, e.g. batteries or antennas with energy receptors for wireless energy transmission
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/04—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
    • G02B1/041—Lenses
    • G02B1/043—Contact lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02C—SPECTACLES; SUNGLASSES OR GOGGLES INSOFAR AS THEY HAVE THE SAME FEATURES AS SPECTACLES; CONTACT LENSES
    • G02C7/00—Optical parts
    • G02C7/02—Lenses; Lens systems ; Methods of designing lenses
    • G02C7/04—Contact lenses for the eyes
    • G—PHYSICS
    • G02—OPTICS
    • G02C—SPECTACLES; SUNGLASSES OR GOGGLES INSOFAR AS THEY HAVE THE SAME FEATURES AS SPECTACLES; CONTACT LENSES
    • G02C7/00—Optical parts
    • G02C7/02—Lenses; Lens systems ; Methods of designing lenses
    • G02C7/08—Auxiliary lenses; Arrangements for varying focal length
    • G02C7/081—Ophthalmic lenses with variable focal length
    • G02C7/083—Electrooptic lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02C—SPECTACLES; SUNGLASSES OR GOGGLES INSOFAR AS THEY HAVE THE SAME FEATURES AS SPECTACLES; CONTACT LENSES
    • G02C7/00—Optical parts
    • G02C7/02—Lenses; Lens systems ; Methods of designing lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45139—Silver (Ag) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48145—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/146—Mixed devices
    • H01L2924/1461—MEMS
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Ophthalmology & Optometry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Health & Medical Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Eyeglasses (AREA)
  • Prostheses (AREA)
  • Battery Mounting, Suspending (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Electric Double-Layer Capacitors Or The Like (AREA)
HK15105110.7A 2012-01-26 2015-05-29 Stacked integrated component devices with energization HK1204710A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/358,656 US9698129B2 (en) 2011-03-18 2012-01-26 Stacked integrated component devices with energization
PCT/US2013/023190 WO2013112868A1 (en) 2012-01-26 2013-01-25 Stacked integrated component devices with energization

Publications (1)

Publication Number Publication Date
HK1204710A1 true HK1204710A1 (en) 2015-11-27

Family

ID=47750040

Family Applications (1)

Application Number Title Priority Date Filing Date
HK15105110.7A HK1204710A1 (en) 2012-01-26 2015-05-29 Stacked integrated component devices with energization

Country Status (13)

Country Link
US (1) US9698129B2 (lt)
EP (1) EP2807674A1 (lt)
JP (1) JP6121448B2 (lt)
KR (1) KR20140116952A (lt)
CN (1) CN104205331B (lt)
AU (1) AU2013211974B2 (lt)
BR (1) BR112014018348A8 (lt)
CA (1) CA2862667A1 (lt)
HK (1) HK1204710A1 (lt)
RU (1) RU2624606C2 (lt)
SG (1) SG11201404173UA (lt)
TW (1) TWI622157B (lt)
WO (1) WO2013112868A1 (lt)

Families Citing this family (84)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7668325B2 (en) 2005-05-03 2010-02-23 Earlens Corporation Hearing system having an open chamber for housing components and reducing the occlusion effect
DK2208367T3 (da) 2007-10-12 2017-11-13 Earlens Corp Multifunktionssystem og fremgangsmåde til integreret lytning og kommunikation med støjannullering og feedback-håndtering
CN102124757B (zh) 2008-06-17 2014-08-27 依耳乐恩斯公司 传输音频信号及利用其刺激目标的系统、装置和方法
US9675443B2 (en) 2009-09-10 2017-06-13 Johnson & Johnson Vision Care, Inc. Energized ophthalmic lens including stacked integrated components
BRPI0918994A2 (pt) 2008-09-22 2017-06-13 SoundBeam LLC dispositivo, e, método para transmitir um sinal de áudio para um usuário.
US9475709B2 (en) 2010-08-25 2016-10-25 Lockheed Martin Corporation Perforated graphene deionization or desalination
WO2012088187A2 (en) 2010-12-20 2012-06-28 SoundBeam LLC Anatomically customized ear canal hearing apparatus
US8950862B2 (en) 2011-02-28 2015-02-10 Johnson & Johnson Vision Care, Inc. Methods and apparatus for an ophthalmic lens with functional insert layers
US9698129B2 (en) 2011-03-18 2017-07-04 Johnson & Johnson Vision Care, Inc. Stacked integrated component devices with energization
US9889615B2 (en) 2011-03-18 2018-02-13 Johnson & Johnson Vision Care, Inc. Stacked integrated component media insert for an ophthalmic device
US10451897B2 (en) 2011-03-18 2019-10-22 Johnson & Johnson Vision Care, Inc. Components with multiple energization elements for biomedical devices
US9110310B2 (en) * 2011-03-18 2015-08-18 Johnson & Johnson Vision Care, Inc. Multiple energization elements in stacked integrated component devices
US9804418B2 (en) 2011-03-21 2017-10-31 Johnson & Johnson Vision Care, Inc. Methods and apparatus for functional insert with power layer
US9006889B2 (en) * 2011-11-11 2015-04-14 Skyworks Solutions, Inc. Flip chip packages with improved thermal performance
US8857983B2 (en) 2012-01-26 2014-10-14 Johnson & Johnson Vision Care, Inc. Ophthalmic lens assembly having an integrated antenna structure
US9610546B2 (en) 2014-03-12 2017-04-04 Lockheed Martin Corporation Separation membranes formed from perforated graphene and methods for use thereof
US9744617B2 (en) 2014-01-31 2017-08-29 Lockheed Martin Corporation Methods for perforating multi-layer graphene through ion bombardment
US9834809B2 (en) 2014-02-28 2017-12-05 Lockheed Martin Corporation Syringe for obtaining nano-sized materials for selective assays and related methods of use
US10980919B2 (en) 2016-04-14 2021-04-20 Lockheed Martin Corporation Methods for in vivo and in vitro use of graphene and other two-dimensional materials
US10418143B2 (en) 2015-08-05 2019-09-17 Lockheed Martin Corporation Perforatable sheets of graphene-based material
US10376845B2 (en) 2016-04-14 2019-08-13 Lockheed Martin Corporation Membranes with tunable selectivity
US10653824B2 (en) 2012-05-25 2020-05-19 Lockheed Martin Corporation Two-dimensional materials and uses thereof
EP3225385A1 (en) * 2013-01-09 2017-10-04 Johnson & Johnson Vision Care Inc. Method of forming a multi-piece insert device with seal for ophthalmic devices and a multi-piece insert device with glue seal for ophthalmic devices
WO2014164621A1 (en) 2013-03-12 2014-10-09 Lockheed Martin Corporation Method for forming filter with uniform aperture size
US9329410B2 (en) 2013-03-15 2016-05-03 Johnson & Johnson Vision Care, Inc. Ophthalmic lenses with colorant patterned inserts
US9164297B2 (en) 2013-03-15 2015-10-20 Johnson & Johnson Vision Care, Inc. Ophthalmic devices with stabilization features
US9316848B2 (en) 2013-03-15 2016-04-19 Johnson & Johnson Vision Care, Inc. Ophthalmic devices with stabilization features
US9307654B2 (en) 2013-03-15 2016-04-05 Johnson & Johnson Vision Care, Inc. Method of forming a patterned multi-piece insert for an ophthalmic lens
US9406969B2 (en) * 2013-03-15 2016-08-02 Johnson & Johnson Vision Care, Inc. Methods and apparatus to form three-dimensional biocompatible energization elements
FR3005562A1 (fr) * 2013-05-15 2014-11-21 Ophtimalia Capteur passif flexible pour lentille de contact
US9572918B2 (en) 2013-06-21 2017-02-21 Lockheed Martin Corporation Graphene-based filter for isolating a substance from blood
US9901247B2 (en) 2013-06-28 2018-02-27 Verily Life Sciences Llc Methods for adhering a substrate to a polymer layer
US9801560B2 (en) * 2013-08-27 2017-10-31 Johnson & Johnson Vision Care, Inc. Ophthalmic lens with a neural frequency detection system
US9636050B1 (en) 2013-11-07 2017-05-02 Verily Life Sciences Llc Methods and apparatus for forming a channel through a polymer layer using a protrusion
US20150148648A1 (en) * 2013-11-22 2015-05-28 Johnson & Johnson Vision Care, Inc. Ophthalmic lens with intraocular pressure monitoring system
US10039447B2 (en) * 2013-12-23 2018-08-07 Verily Life Sciences Llc Molded electronic structures in body-mountable devices
US9455423B2 (en) * 2014-01-24 2016-09-27 Verily Life Sciences Llc Battery
CN105940479A (zh) 2014-01-31 2016-09-14 洛克希德马丁公司 使用宽离子场穿孔二维材料
CA2938305A1 (en) 2014-01-31 2015-08-06 Lockheed Martin Corporation Processes for forming composite structures with a two-dimensional material using a porous, non-sacrificial supporting layer
CA2942496A1 (en) 2014-03-12 2015-09-17 Lockheed Martin Corporation Separation membranes formed from perforated graphene
US10034103B2 (en) 2014-03-18 2018-07-24 Earlens Corporation High fidelity and reduced feedback contact hearing apparatus and methods
US10232531B1 (en) 2014-07-08 2019-03-19 Verily Life Sciences Llc Methods and apparatus for forming a polymer layer around a structure using a plurality of protrusions
EP3169396B1 (en) 2014-07-14 2021-04-21 Earlens Corporation Sliding bias and peak limiting for optical hearing devices
US9793522B2 (en) * 2014-08-13 2017-10-17 Verily Life Sciences Llc Sealed solid state battery
US10361404B2 (en) 2014-08-21 2019-07-23 Johnson & Johnson Vision Care, Inc. Anodes for use in biocompatible energization elements
US9383593B2 (en) 2014-08-21 2016-07-05 Johnson & Johnson Vision Care, Inc. Methods to form biocompatible energization elements for biomedical devices comprising laminates and placed separators
US9941547B2 (en) 2014-08-21 2018-04-10 Johnson & Johnson Vision Care, Inc. Biomedical energization elements with polymer electrolytes and cavity structures
US10361405B2 (en) 2014-08-21 2019-07-23 Johnson & Johnson Vision Care, Inc. Biomedical energization elements with polymer electrolytes
US10627651B2 (en) 2014-08-21 2020-04-21 Johnson & Johnson Vision Care, Inc. Methods and apparatus to form biocompatible energization primary elements for biomedical devices with electroless sealing layers
US9923177B2 (en) * 2014-08-21 2018-03-20 Johnson & Johnson Vision Care, Inc. Biocompatibility of biomedical energization elements
US9793536B2 (en) 2014-08-21 2017-10-17 Johnson & Johnson Vision Care, Inc. Pellet form cathode for use in a biocompatible battery
US9577259B2 (en) * 2014-08-21 2017-02-21 Johnson & Johnson Vision Care, Inc. Cathode mixture for use in a biocompatible battery
CA2900271A1 (en) * 2014-08-21 2016-02-21 Johnson & Johnson Vision Care, Inc. Components with multiple energization elements for biomedical devices
US10381687B2 (en) 2014-08-21 2019-08-13 Johnson & Johnson Vision Care, Inc. Methods of forming biocompatible rechargable energization elements for biomedical devices
US9715130B2 (en) 2014-08-21 2017-07-25 Johnson & Johnson Vision Care, Inc. Methods and apparatus to form separators for biocompatible energization elements for biomedical devices
US9599842B2 (en) * 2014-08-21 2017-03-21 Johnson & Johnson Vision Care, Inc. Device and methods for sealing and encapsulation for biocompatible energization elements
EA201790508A1 (ru) 2014-09-02 2017-08-31 Локхид Мартин Корпорейшн Мембраны гемодиализа и гемофильтрации на основе двумерного мембранного материала и способы их применения
US9907498B2 (en) 2014-09-04 2018-03-06 Verily Life Sciences Llc Channel formation
US10314691B2 (en) * 2014-10-24 2019-06-11 Verily Life Sciences Llc Intra-ocular device
US9808608B2 (en) 2014-11-16 2017-11-07 International Business Machines Corporation Helical coil delivery device for active agent
US9924276B2 (en) 2014-11-26 2018-03-20 Earlens Corporation Adjustable venting for hearing instruments
US9588356B2 (en) * 2014-12-22 2017-03-07 Intel Corporation Battery structure for eyewear apparatus
JP2018530499A (ja) 2015-08-06 2018-10-18 ロッキード・マーチン・コーポレーション グラフェンのナノ粒子変性及び穿孔
US11241334B2 (en) * 2015-09-24 2022-02-08 Visionage Therapies, Llc Sonic and ultrasonic contact lens apparatus
US20170095202A1 (en) 2015-10-02 2017-04-06 Earlens Corporation Drug delivery customized ear canal apparatus
WO2017116791A1 (en) 2015-12-30 2017-07-06 Earlens Corporation Light based hearing systems, apparatus and methods
US10492010B2 (en) 2015-12-30 2019-11-26 Earlens Corporations Damping in contact hearing systems
US11350226B2 (en) 2015-12-30 2022-05-31 Earlens Corporation Charging protocol for rechargeable hearing systems
US10345620B2 (en) 2016-02-18 2019-07-09 Johnson & Johnson Vision Care, Inc. Methods and apparatus to form biocompatible energization elements incorporating fuel cells for biomedical devices
SG11201808961QA (en) 2016-04-14 2018-11-29 Lockheed Corp Methods for in situ monitoring and control of defect formation or healing
WO2017180141A1 (en) 2016-04-14 2017-10-19 Lockheed Martin Corporation Selective interfacial mitigation of graphene defects
JP2019511451A (ja) 2016-04-14 2019-04-25 ロッキード・マーチン・コーポレーション 浮遊法を用いてグラフェンシートを大判転写用に処理する方法
WO2017180139A1 (en) 2016-04-14 2017-10-19 Lockheed Martin Corporation Two-dimensional membrane structures having flow passages
CN109952771A (zh) 2016-09-09 2019-06-28 伊尔兰斯公司 接触式听力系统、设备和方法
WO2018093733A1 (en) 2016-11-15 2018-05-24 Earlens Corporation Improved impression procedure
US20180197829A1 (en) * 2017-01-09 2018-07-12 Qorvo Us, Inc. Three-dimensional integrated circuit assembly with active interposer
WO2019041169A1 (zh) * 2017-08-30 2019-03-07 晶硕光学股份有限公司 具有元件保护功能的隐形眼镜
US11029538B2 (en) * 2017-10-25 2021-06-08 Coopervision International Limited Contact lenses having an ion-impermeable portion and related methods
WO2019173470A1 (en) 2018-03-07 2019-09-12 Earlens Corporation Contact hearing device and retention structure materials
US10848152B2 (en) * 2018-03-15 2020-11-24 Analog Devices Global Unlimited Company Optically isolated micromachined (MEMS) switches and related methods comprising a light transmitting adhesive layer between an optical receiver and a light source
WO2019199680A1 (en) 2018-04-09 2019-10-17 Earlens Corporation Dynamic filter
US11350522B2 (en) * 2019-03-26 2022-05-31 Sony Corporation Microwave antenna apparatus
DE102019207196B4 (de) * 2019-05-16 2020-12-24 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Nasschemisch hergestelltes polymeres Lithiumphosphoroxynitrid (LiPON), Verfahren zu dessen Herstellung, Verwendungen hiervon sowie Batterie
TWI807333B (zh) * 2021-03-19 2023-07-01 美律實業股份有限公司 電子裝置

Family Cites Families (173)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US754804A (en) 1903-12-07 1904-03-15 Charles A Pratt Speed-regulating magnetic clutch.
US3291296A (en) 1964-10-26 1966-12-13 Lemkelde Russell Pipe nipple holder
US3375136A (en) * 1965-05-24 1968-03-26 Army Usa Laminated thin film flexible alkaline battery
US4268132A (en) 1979-09-24 1981-05-19 Neefe Charles W Oxygen generating contact lens
US4592944A (en) 1982-05-24 1986-06-03 International Business Machines Corporation Method for providing a top seal coating on a substrate containing an electrically conductive pattern and coated article
US4601545A (en) 1984-05-16 1986-07-22 Kern Seymour P Variable power lens system
US4787903A (en) 1985-07-24 1988-11-29 Grendahl Dennis T Intraocular lens
DE3727945A1 (de) * 1986-08-22 1988-02-25 Ricoh Kk Fluessigkristallelement
US5219497A (en) 1987-10-30 1993-06-15 Innotech, Inc. Method for manufacturing lenses using thin coatings
US4873029A (en) 1987-10-30 1989-10-10 Blum Ronald D Method for manufacturing lenses
US4816031A (en) 1988-01-29 1989-03-28 Pfoff David S Intraocular lens system
US5227805A (en) * 1989-10-26 1993-07-13 Motorola, Inc. Antenna loop/battery spring
US5112703A (en) 1990-07-03 1992-05-12 Beta Power, Inc. Electrochemical battery cell having a monolithic bipolar flat plate beta" al
US6322589B1 (en) 1995-10-06 2001-11-27 J. Stuart Cumming Intraocular lenses with fixated haptics
EP0918248A3 (en) * 1993-04-07 1999-06-30 Ttp Group Plc Switchable lens
JPH0837190A (ja) 1994-07-22 1996-02-06 Nec Corp 半導体装置
US5478420A (en) 1994-07-28 1995-12-26 International Business Machines Corporation Process for forming open-centered multilayer ceramic substrates
US5596567A (en) 1995-03-31 1997-01-21 Motorola, Inc. Wireless battery charging system
US5682210A (en) 1995-12-08 1997-10-28 Weirich; John Eye contact lens video display system
JPH10209185A (ja) 1997-01-24 1998-08-07 Matsushita Electric Works Ltd 半導体パッケージの搬送方法
US6217171B1 (en) 1998-05-26 2001-04-17 Novartis Ag Composite ophthamic lens
US20070285385A1 (en) 1998-11-02 2007-12-13 E Ink Corporation Broadcast system for electronic ink signs
DE19858172A1 (de) 1998-12-16 2000-06-21 Campus Micro Technologies Gmbh Implantat zur Messung des Augeninnendrucks
US6477410B1 (en) 2000-05-31 2002-11-05 Biophoretic Therapeutic Systems, Llc Electrokinetic delivery of medicaments
US6986579B2 (en) 1999-07-02 2006-01-17 E-Vision, Llc Method of manufacturing an electro-active lens
US6619799B1 (en) 1999-07-02 2003-09-16 E-Vision, Llc Optical lens system with electro-active lens having alterably different focal lengths
US6851805B2 (en) 1999-07-02 2005-02-08 E-Vision, Llc Stabilized electro-active contact lens
US7404636B2 (en) 1999-07-02 2008-07-29 E-Vision, Llc Electro-active spectacle employing modal liquid crystal lenses
JP3557130B2 (ja) 1999-07-14 2004-08-25 新光電気工業株式会社 半導体装置の製造方法
US6364482B1 (en) 1999-11-03 2002-04-02 Johnson & Johnson Vision Care, Inc. Contact lens useful for avoiding dry eye
US6355501B1 (en) 2000-09-21 2002-03-12 International Business Machines Corporation Three-dimensional chip stacking assembly
JP4172566B2 (ja) * 2000-09-21 2008-10-29 Ｔｄｋ株式会社 セラミック多層基板の表面電極構造及び表面電極の製造方法
JP3854054B2 (ja) 2000-10-10 2006-12-06 株式会社東芝 半導体装置
US6795250B2 (en) 2000-12-29 2004-09-21 Lenticlear Lenticular Lens, Inc. Lenticular lens array
US6748994B2 (en) 2001-04-11 2004-06-15 Avery Dennison Corporation Label applicator, method and label therefor
US6769767B2 (en) * 2001-04-30 2004-08-03 Qr Spex, Inc. Eyewear with exchangeable temples housing a transceiver forming ad hoc networks with other devices
US6811805B2 (en) 2001-05-30 2004-11-02 Novatis Ag Method for applying a coating
US6638304B2 (en) 2001-07-20 2003-10-28 Massachusetts Eye & Ear Infirmary Vision prosthesis
US6885818B2 (en) 2001-07-30 2005-04-26 Hewlett-Packard Development Company, L.P. System and method for controlling electronic devices
EP1304193A3 (de) 2001-10-10 2004-12-01 imt robot AG Verfahren zum automatisierten Auflegen von Objekten auf einen Träger
EP1316419A3 (en) 2001-11-30 2004-01-28 General Electric Company Weatherable multilayer articles and method for their preparation
US6599778B2 (en) 2001-12-19 2003-07-29 International Business Machines Corporation Chip and wafer integration process using vertical connections
AU2002364251A1 (en) * 2001-12-31 2003-09-04 The Government Of The United States Of America As Represented By The Secretary Of The Department Of Health And Human Services, Centers For Disease Control And Prevention Strain detection in rock bolts
US7763069B2 (en) 2002-01-14 2010-07-27 Abbott Medical Optics Inc. Accommodating intraocular lens with outer support structure
KR100878519B1 (ko) * 2002-01-19 2009-01-13 삼성전자주식회사 광디스크 제조 방법
ITMI20020403A1 (it) 2002-02-28 2003-08-28 Ausimont Spa Dispersioni acquose a base di ptfe
EP1849589A3 (en) 2002-03-04 2009-03-25 Johnson and Johnson Vision Care, Inc. Use of microwave energy to dissassemble, release, and hydrate contact lenses
US20030164563A1 (en) 2002-03-04 2003-09-04 Olin Calvin Use of microwave energy to disassemble, release, and hydrate contact lenses
AU2003231046B2 (en) 2002-04-25 2008-04-03 E-Vision, Llc Electro-active multi-focal spectacle lens
US6852254B2 (en) 2002-06-26 2005-02-08 Johnson & Johnson Vision Care, Inc. Methods for the production of tinted contact lenses
KR20050025624A (ko) 2002-08-09 2005-03-14 이-비젼 엘엘씨 전기-활성 콘택트 렌즈 시스템
US20040081860A1 (en) 2002-10-29 2004-04-29 Stmicroelectronics, Inc. Thin-film battery equipment
US6906436B2 (en) 2003-01-02 2005-06-14 Cymbet Corporation Solid state activity-activated battery device and method
BRPI0413590A (pt) 2003-08-15 2006-10-17 E Vision Llc sistema de lente eletroativa aperfeiçoada
US7581124B1 (en) 2003-09-19 2009-08-25 Xilinx, Inc. Method and mechanism for controlling power consumption of an integrated circuit
WO2005033782A2 (en) 2003-10-03 2005-04-14 Invisia Ltd. Multifocal lens
EP1760515A3 (en) 2003-10-03 2011-08-31 Invisia Ltd. Multifocal ophthalmic lens
US7557433B2 (en) 2004-10-25 2009-07-07 Mccain Joseph H Microelectronic device with integrated energy source
JP2007526517A (ja) 2004-03-05 2007-09-13 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 可変焦点レンズ
CN101057174A (zh) * 2004-04-13 2007-10-17 庄臣及庄臣视力保护公司 用于电活性液晶眼科设备的图案化电极
CA2467321A1 (en) 2004-05-14 2005-11-14 Paul J. Santerre Polymeric coupling agents and pharmaceutically-active polymers made therefrom
US8766435B2 (en) 2004-06-30 2014-07-01 Stmicroelectronics, Inc. Integrated circuit package including embedded thin-film battery
EP1622009A1 (en) 2004-07-27 2006-02-01 Texas Instruments Incorporated JSM architecture and systems
CN1989747B (zh) 2004-09-21 2011-06-08 株式会社日立制作所 节点装置、数据包控制装置、无线通信装置和发送控制方法
WO2006043611A1 (en) 2004-10-22 2006-04-27 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
EP3195831B1 (en) 2004-11-02 2023-09-13 e-Vision Smart Optics Inc. Electro-active lenses
US8778022B2 (en) 2004-11-02 2014-07-15 E-Vision Smart Optics Inc. Electro-active intraocular lenses
JP5064229B2 (ja) 2004-11-02 2012-10-31 イー・ビジョン・エルエルシー 複合レンズ
US20080058652A1 (en) 2004-11-04 2008-03-06 Payne Peter A Medical Devices
WO2006063836A1 (en) 2004-12-17 2006-06-22 Novartis Ag Colored contact lenses for enhancing a wearer’s natural eye color
CN101065844B (zh) 2005-01-04 2010-12-15 株式会社映煌 固体摄像装置及其制造方法
DE102005001148B3 (de) * 2005-01-10 2006-05-18 Siemens Ag Elektronikeinheit mit EMV-Schirmung
US8224007B2 (en) * 2005-01-20 2012-07-17 Oticon A/S Hearing aid with rechargeable battery and rechargeable battery
US7928591B2 (en) 2005-02-11 2011-04-19 Wintec Industries, Inc. Apparatus and method for predetermined component placement to a target platform
US7364945B2 (en) * 2005-03-31 2008-04-29 Stats Chippac Ltd. Method of mounting an integrated circuit package in an encapsulant cavity
JP4790297B2 (ja) * 2005-04-06 2011-10-12 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
US7976577B2 (en) 2005-04-14 2011-07-12 Acufocus, Inc. Corneal optic formed of degradation resistant polymer
US7163839B2 (en) 2005-04-27 2007-01-16 Spansion Llc Multi-chip module and method of manufacture
JP4492432B2 (ja) 2005-05-13 2010-06-30 株式会社デンソー 物理量センサ装置の製造方法
US7548040B2 (en) 2005-07-28 2009-06-16 Zerog Wireless, Inc. Wireless battery charging of electronic devices such as wireless headsets/headphones
DE102005038542A1 (de) 2005-08-16 2007-02-22 Forschungszentrum Karlsruhe Gmbh Künstliches Akkommodationssystem
WO2007037275A1 (ja) * 2005-09-28 2007-04-05 Matsushita Electric Industrial Co., Ltd. 電子回路接続構造体およびその製造方法
US20070090869A1 (en) * 2005-10-26 2007-04-26 Motorola, Inc. Combined power source and printed transistor circuit apparatus and method
US20070128420A1 (en) 2005-12-07 2007-06-07 Mariam Maghribi Hybrid composite for biological tissue interface devices
EP1973587B1 (en) 2005-12-12 2019-02-06 AllAccem, Inc. Methods and systems for preparing antimicrobial films and coatings
US20070159562A1 (en) 2006-01-10 2007-07-12 Haddock Joshua N Device and method for manufacturing an electro-active spectacle lens involving a mechanically flexible integration insert
KR101286258B1 (ko) 2006-02-21 2013-07-15 보르그워너 인코퍼레이티드 분할형 코어판 및 마찰판
US7794643B2 (en) 2006-03-24 2010-09-14 Ricoh Company, Ltd. Apparatus and method for molding object with enhanced transferability of transfer face and object made by the same
FR2899388B1 (fr) 2006-03-28 2008-12-05 Saint Gobain Substrat muni d'un element electroconducteur a fonction d'antenne
CN100456274C (zh) * 2006-03-29 2009-01-28 深圳迈瑞生物医疗电子股份有限公司 易于扩展的多cpu系统
JP4171922B2 (ja) 2006-04-12 2008-10-29 船井電機株式会社 ミュート装置、液晶ディスプレイテレビ、及びミュート方法
JP4918373B2 (ja) * 2006-04-28 2012-04-18 オリンパス株式会社 積層実装構造体
JP4923704B2 (ja) 2006-04-28 2012-04-25 ソニー株式会社 光学素子の成形装置および成形方法
US8197539B2 (en) 2006-05-05 2012-06-12 University Of Southern California Intraocular camera for retinal prostheses
JP5011820B2 (ja) 2006-05-24 2012-08-29 オムロン株式会社 積層デバイス、およびその製造方法
JP2009540392A (ja) * 2006-06-12 2009-11-19 ジョンソン・アンド・ジョンソン・ビジョン・ケア・インコーポレイテッド 電気光学レンズのパワー消費を低減する方法
US7878650B2 (en) 2006-06-29 2011-02-01 Fritsch Michael H Contact lens materials, designs, substances, and methods
JP5014695B2 (ja) 2006-07-19 2012-08-29 カルソニックカンセイ株式会社 エキゾーストマニホールドの集合部構造
US20090204454A1 (en) 2006-08-28 2009-08-13 Frankie James Lagudi Online hosted customisable merchant directory with search function
AU2007289295A1 (en) * 2006-09-01 2008-03-06 Johnson & Johnson Vision Care, Inc. Electro-optic lenses employing resistive electrodes
US7839124B2 (en) 2006-09-29 2010-11-23 Semiconductor Energy Laboratory Co., Ltd. Wireless power storage device comprising battery, semiconductor device including battery, and method for operating the wireless power storage device
US7324287B1 (en) 2006-11-07 2008-01-29 Corning Incorporated Multi-fluid lenses and optical devices incorporating the same
TWI324380B (en) * 2006-12-06 2010-05-01 Princo Corp Hybrid structure of multi-layer substrates and manufacture method thereof
AR064985A1 (es) 2007-01-22 2009-05-06 E Vision Llc Lente electroactivo flexible
US8215770B2 (en) * 2007-02-23 2012-07-10 E-A Ophthalmics Ophthalmic dynamic aperture
US8446341B2 (en) 2007-03-07 2013-05-21 University Of Washington Contact lens with integrated light-emitting component
WO2008109867A2 (en) 2007-03-07 2008-09-12 University Of Washington Active contact lens
US20090091818A1 (en) 2007-10-05 2009-04-09 Haddock Joshua N Electro-active insert
JP2008227068A (ja) 2007-03-12 2008-09-25 Toshiba Corp 半導体装置およびその製造方法
WO2008112468A1 (en) 2007-03-12 2008-09-18 Pixeloptics, Inc. Electrical insulating layers, uv protection, and voltage spiking for electro-active diffractive optics
TWI335652B (en) * 2007-04-04 2011-01-01 Unimicron Technology Corp Stacked packing module
TW200842996A (en) * 2007-04-17 2008-11-01 Advanced Semiconductor Eng Method for forming bumps on under bump metallurgy
US7818698B2 (en) 2007-06-29 2010-10-19 Taiwan Semiconductor Manufacturing Company, Ltd. Accurate parasitic capacitance extraction for ultra large scale integrated circuits
US8317321B2 (en) 2007-07-03 2012-11-27 Pixeloptics, Inc. Multifocal lens with a diffractive optical power region
WO2009020648A1 (en) * 2007-08-09 2009-02-12 The Regents Of The University Of California Electroactive polymer actuation of implants
US7816031B2 (en) 2007-08-10 2010-10-19 The Board Of Trustees Of The Leland Stanford Junior University Nanowire battery methods and arrangements
US20090050267A1 (en) 2007-08-11 2009-02-26 Maverick Enterprises, Inc. Customizable item labeling system for use in manufacturing, packaging, product shipment-fulfillment, distribution, and on-site operations, adaptable for validation of variable-shaped items
DE102007048859A1 (de) 2007-10-11 2009-04-16 Robert Bosch Gmbh Intraokularlinse sowie System
US8608310B2 (en) 2007-11-07 2013-12-17 University Of Washington Through Its Center For Commercialization Wireless powered contact lens with biosensor
US20090175016A1 (en) * 2008-01-04 2009-07-09 Qimonda Ag Clip for attaching panels
US7844341B2 (en) 2008-01-15 2010-11-30 Cardiac Pacemakers, Inc. Implantable medical device with antenna
TWI511869B (zh) 2008-02-20 2015-12-11 Johnson & Johnson Vision Care 激能生醫裝置
EP2099165A1 (en) 2008-03-03 2009-09-09 Thomson Licensing Deterministic back-off method and apparatus for peer-to-peer communications
KR101141493B1 (ko) 2008-03-14 2012-05-03 스미토모 베이클라이트 가부시키가이샤 반도체소자 접착필름 형성용 수지 바니시, 반도체소자 접착필름, 및 반도체장치
CA2718521A1 (en) 2008-03-18 2009-09-24 Pixeloptics, Inc. Advanced electro-active optic device
US20090243125A1 (en) * 2008-03-26 2009-10-01 Pugh Randall B Methods and apparatus for ink jet provided energy receptor
US7931832B2 (en) * 2008-03-31 2011-04-26 Johnson & Johnson Vision Care, Inc. Ophthalmic lens media insert
US8523354B2 (en) 2008-04-11 2013-09-03 Pixeloptics Inc. Electro-active diffractive lens and method for making the same
US8361492B2 (en) 2008-04-29 2013-01-29 Ocugenics, LLC Drug delivery system and methods of use
FR2934056B1 (fr) * 2008-07-21 2011-01-07 Essilor Int Procede de transfert d'une portion de film fonctionnel
JP2010034254A (ja) 2008-07-29 2010-02-12 Mitsubishi Chemicals Corp 三次元ｌｓｉ
US8014166B2 (en) * 2008-09-06 2011-09-06 Broadpak Corporation Stacking integrated circuits containing serializer and deserializer blocks using through silicon via
US9296158B2 (en) * 2008-09-22 2016-03-29 Johnson & Johnson Vision Care, Inc. Binder of energized components in an ophthalmic lens
US20100076553A1 (en) 2008-09-22 2010-03-25 Pugh Randall B Energized ophthalmic lens
US9675443B2 (en) 2009-09-10 2017-06-13 Johnson & Johnson Vision Care, Inc. Energized ophthalmic lens including stacked integrated components
JP4764942B2 (ja) 2008-09-25 2011-09-07 シャープ株式会社 光学素子、光学素子ウエハ、光学素子ウエハモジュール、光学素子モジュール、光学素子モジュールの製造方法、電子素子ウエハモジュール、電子素子モジュールの製造方法、電子素子モジュールおよび電子情報機器
US8348424B2 (en) 2008-09-30 2013-01-08 Johnson & Johnson Vision Care, Inc. Variable focus ophthalmic device
US9427920B2 (en) 2008-09-30 2016-08-30 Johnson & Johnson Vision Care, Inc. Energized media for an ophthalmic device
US8092013B2 (en) 2008-10-28 2012-01-10 Johnson & Johnson Vision Care, Inc. Apparatus and method for activation of components of an energized ophthalmic lens
US9375885B2 (en) 2008-10-31 2016-06-28 Johnson & Johnson Vision Care, Inc. Processor controlled ophthalmic device
US9375886B2 (en) 2008-10-31 2016-06-28 Johnson & Johnson Vision Care Inc. Ophthalmic device with embedded microcontroller
US20110230963A1 (en) 2008-11-20 2011-09-22 Insight Innovations, Llc Biocompatible biodegradable intraocular implant system
JP5694947B2 (ja) 2008-12-11 2015-04-01 エムシー１０ インコーポレイテッドＭｃ１０，Ｉｎｃ． 医療用途のための伸張性電子部品を使用する装置
WO2010133317A1 (en) 2009-05-17 2010-11-25 Helmut Binder Lens with variable refraction power for the human eye
EP2254149B1 (en) 2009-05-22 2014-08-06 Unisantis Electronics Singapore Pte. Ltd. SRAM using vertical transistors with a diffusion layer for reducing leakage currents
US8784511B2 (en) 2009-09-28 2014-07-22 Stmicroelectronics (Tours) Sas Method for forming a thin-film lithium-ion battery
EP2306579A1 (fr) 2009-09-28 2011-04-06 STMicroelectronics (Tours) SAS Procédé de formation d'une batterie lithium-ion en couches minces
US8137148B2 (en) * 2009-09-30 2012-03-20 General Electric Company Method of manufacturing monolithic parallel interconnect structure
WO2011055660A1 (en) 2009-11-06 2011-05-12 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
SG181956A1 (en) 2010-01-05 2012-08-30 Sensimed Sa Intraocular pressure monitoring device
JP5209075B2 (ja) 2010-05-21 2013-06-12 有限会社 ナプラ 電子デバイス及びその製造方法
JP2013534847A (ja) 2010-06-20 2013-09-09 エレンザ， インコーポレイテッド 特定用途向け集積回路を備える眼科デバイスおよび方法
CN103154803A (zh) 2010-07-26 2013-06-12 伊兰扎公司 气密密封的植入式眼科器械以及制造该器械的方法
US8634145B2 (en) 2010-07-29 2014-01-21 Johnson & Johnson Vision Care, Inc. Liquid meniscus lens with concave torus-segment meniscus wall
US20120024295A1 (en) 2010-07-30 2012-02-02 Mihin Chiropractic Clinic, LLC Orthopedic device
KR101322695B1 (ko) * 2010-08-25 2013-10-25 주식회사 엘지화학 케이블형 이차전지
JP2013541360A (ja) 2010-09-07 2013-11-14 エレンザ， インコーポレイテッド 眼内インプラントに電力供給する薄ガラスウェハ上バッテリの設置及びシール
US8767309B2 (en) 2010-09-08 2014-07-01 Johnson & Johnson Vision Care, Inc. Lens with multi-convex meniscus wall
EP2640315B1 (en) 2010-11-15 2018-01-10 Elenza, Inc. Adaptive intraocular lens
US8950862B2 (en) 2011-02-28 2015-02-10 Johnson & Johnson Vision Care, Inc. Methods and apparatus for an ophthalmic lens with functional insert layers
US9698129B2 (en) 2011-03-18 2017-07-04 Johnson & Johnson Vision Care, Inc. Stacked integrated component devices with energization
US9889615B2 (en) 2011-03-18 2018-02-13 Johnson & Johnson Vision Care, Inc. Stacked integrated component media insert for an ophthalmic device
US9110310B2 (en) 2011-03-18 2015-08-18 Johnson & Johnson Vision Care, Inc. Multiple energization elements in stacked integrated component devices
US10451897B2 (en) 2011-03-18 2019-10-22 Johnson & Johnson Vision Care, Inc. Components with multiple energization elements for biomedical devices
US9102111B2 (en) 2011-03-21 2015-08-11 Johnson & Johnson Vision Care, Inc. Method of forming a functionalized insert with segmented ring layers for an ophthalmic lens
US9804418B2 (en) 2011-03-21 2017-10-31 Johnson & Johnson Vision Care, Inc. Methods and apparatus for functional insert with power layer
US9195075B2 (en) 2011-03-21 2015-11-24 Johnson & Johnson Vision Care, Inc. Full rings for a functionalized layer insert of an ophthalmic lens
EP2508935A1 (en) 2011-04-08 2012-10-10 Nxp B.V. Flexible eye insert and glucose measuring system
US9115505B2 (en) 2011-07-22 2015-08-25 Irwin Seating Company Nosemount seating system
BR112014018419A8 (pt) 2012-01-26 2017-07-11 Johnson & Johnson Vision Care Lente oftálmica energizada que inclui componentes integrados empilhados
US8857983B2 (en) 2012-01-26 2014-10-14 Johnson & Johnson Vision Care, Inc. Ophthalmic lens assembly having an integrated antenna structure
US20130215380A1 (en) 2012-02-22 2013-08-22 Randall B. Pugh Method of using full rings for a functionalized layer insert of an ophthalmic device
US9134546B2 (en) 2012-02-22 2015-09-15 Johnson & Johnson Vision Care, Inc. Ophthalmic lens with segmented ring layers in a functionalized insert

Also Published As

Publication number Publication date
AU2013211974B2 (en) 2016-08-11
RU2014134641A (ru) 2016-03-20
SG11201404173UA (en) 2014-10-30
CN104205331B (zh) 2017-11-14
CA2862667A1 (en) 2013-08-01
JP2015512142A (ja) 2015-04-23
TWI622157B (zh) 2018-04-21
US20120236524A1 (en) 2012-09-20
CN104205331A (zh) 2014-12-10
EP2807674A1 (en) 2014-12-03
US9698129B2 (en) 2017-07-04
BR112014018348A2 (lt) 2017-06-20
TW201349440A (zh) 2013-12-01
RU2624606C2 (ru) 2017-07-04
BR112014018348A8 (pt) 2017-07-11
KR20140116952A (ko) 2014-10-06
AU2013211974A1 (en) 2014-09-11
WO2013112868A1 (en) 2013-08-01
JP6121448B2 (ja) 2017-04-26

Similar Documents

Publication Publication Date Title
HK1204710A1 (en) Stacked integrated component devices with energization
HK1204508A1 (en) Multiple energization elements in stacked integrated component devices
HK1209905A1 (en) Coil module
GB2501897B (en) Injection devices
AP00340S1 (en) Electronic devices
HK1201484A1 (en) Injection devices
EP2939281A4 (en) PIEZOELECTRIC DEVICES
HK1210867A1 (en) Rotary-operation-type electronic component
EP2861049A4 (en) COMPONENTS INTRODUCTION DEVICE
PL2805380T3 (pl) Element łączący
EP2824682A4 (en) ELECTRONIC COMPONENT
AP00380S1 (en) Electronic devices
GB201218393D0 (en) Injector device
EP2829164A4 (en) CONNECTIVE ELECTRONIC DEVICES
GB201219753D0 (en) Injection devices
AP00379S1 (en) Electronic devices
EP2926986A4 (en) STACKED COMPOSITE COMPONENT
GB201206474D0 (en) Common mode inductor device
EP2940864A4 (en) PIEZOELECTRIC COMPONENT
GB201221341D0 (en) Pallets
HK1206662A1 (en) Injector
GB201217423D0 (en) Electronic receipt
GB201214438D0 (en) Electronic devices
HK1206155A1 (en) Electronic component
AP00341S1 (en) Electronic devices