HK1169967A1 - 低溫燒結性銀納米粒子組合物及使用該組合物而形成的電子物品 - Google Patents

低溫燒結性銀納米粒子組合物及使用該組合物而形成的電子物品

Info

Publication number
HK1169967A1
HK1169967A1 HK12110704.2A HK12110704A HK1169967A1 HK 1169967 A1 HK1169967 A1 HK 1169967A1 HK 12110704 A HK12110704 A HK 12110704A HK 1169967 A1 HK1169967 A1 HK 1169967A1
Authority
HK
Hong Kong
Prior art keywords
composition
low
electronic component
component formed
silver nanoparticle
Prior art date
Application number
HK12110704.2A
Other languages
English (en)
Inventor
格雷戈里‧
‧雅布隆斯基
邁克爾‧
‧馬斯特羅彼得羅
佐藤王高
三好宏昌
藤田英史
Original Assignee
同和電子科技有限公司
珀凱姆聯合有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 同和電子科技有限公司, 珀凱姆聯合有限公司 filed Critical 同和電子科技有限公司
Publication of HK1169967A1 publication Critical patent/HK1169967A1/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/06—Alloys based on silver
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B22F1/054—Nanosized particles
    • B22F1/0545—Dispersions or suspensions of nanosized particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B22F1/102—Metallic powder coated with organic material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/02—Compacting only
    • B22F3/04—Compacting only by applying fluid pressure, e.g. by cold isostatic pressing [CIP]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/10—Sintering only
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/12—Both compacting and sintering
    • B22F3/14—Both compacting and sintering simultaneously
    • B22F3/15—Hot isostatic pressing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F5/00—Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product
    • B22F5/04—Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product of turbine blades
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F5/00—Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product
    • B22F5/08—Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product of toothed articles, e.g. gear wheels; of cam discs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F5/00—Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product
    • B22F5/10—Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product of articles with cavities or holes, not otherwise provided for in the preceding subgroups
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F5/00—Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product
    • B22F5/12—Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product of wires
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/16—Making metallic powder or suspensions thereof using chemical processes
    • B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
    • B22F9/24—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C24/00—Coating starting from inorganic powder
    • C23C24/08—Coating starting from inorganic powder by application of heat or pressure and heat
    • C23C24/082—Coating starting from inorganic powder by application of heat or pressure and heat without intermediate formation of a liquid in the layer
    • C23C24/085—Coating with metallic material, i.e. metals or metal alloys, optionally comprising hard particles, e.g. oxides, carbides or nitrides
    • C23C24/087—Coating with metal alloys or metal elements only
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C24/00—Coating starting from inorganic powder
    • C23C24/08—Coating starting from inorganic powder by application of heat or pressure and heat
    • C23C24/10—Coating starting from inorganic powder by application of heat or pressure and heat with intermediate formation of a liquid phase in the layer
    • C23C24/103—Coating with metallic material, i.e. metals or metal alloys, optionally comprising hard particles, e.g. oxides, carbides or nitrides
    • C23C24/106—Coating with metal alloys or metal elements only
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2301/00—Metallic composition of the powder or its coating
    • B22F2301/25—Noble metals, i.e. Ag Au, Ir, Os, Pd, Pt, Rh, Ru
    • B22F2301/255—Silver or gold
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2304/00—Physical aspects of the powder
    • B22F2304/05—Submicron size particles
    • B22F2304/054—Particle size between 1 and 100 nm
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24893—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including particulate material
    • Y10T428/24909—Free metal or mineral containing

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Nanotechnology (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Inorganic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Composite Materials (AREA)
  • General Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fluid Mechanics (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Conductive Materials (AREA)
  • Powder Metallurgy (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Non-Insulated Conductors (AREA)
HK12110704.2A 2010-08-27 2012-10-25 低溫燒結性銀納米粒子組合物及使用該組合物而形成的電子物品 HK1169967A1 (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2010/064556 WO2012026033A1 (ja) 2010-08-27 2010-08-27 低温焼結性銀ナノ粒子組成物および該組成物を用いて形成された電子物品

Publications (1)

Publication Number Publication Date
HK1169967A1 true HK1169967A1 (zh) 2013-02-15

Family

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HK12110704.2A HK1169967A1 (zh) 2010-08-27 2012-10-25 低溫燒結性銀納米粒子組合物及使用該組合物而形成的電子物品

Country Status (10)

Country Link
US (1) US8673049B2 (zh)
EP (1) EP2610023B1 (zh)
JP (1) JP5632852B2 (zh)
KR (3) KR20130050906A (zh)
CN (1) CN102510783B (zh)
AU (1) AU2010349580B2 (zh)
CA (1) CA2759785A1 (zh)
HK (1) HK1169967A1 (zh)
SG (1) SG178823A1 (zh)
WO (1) WO2012026033A1 (zh)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011202265A (ja) * 2010-03-26 2011-10-13 Dowa Electronics Materials Co Ltd 低温焼結性金属ナノ粒子組成物および該組成物を用いて形成された電子物品
JP5850784B2 (ja) * 2012-03-29 2016-02-03 Ｄｏｗａエレクトロニクス株式会社 ブースターアンテナおよびその製造方法
US10358680B2 (en) * 2012-09-11 2019-07-23 Duke University Nano-plasmonic molecular probes for plasmonics coupling interference
US20140084070A1 (en) * 2012-09-25 2014-03-27 Infineon Technologies Ag Chip card and method for manufacturing a chip card
US20140170427A1 (en) * 2012-12-13 2014-06-19 Carestream Health, Inc. Anticorrosion agents for transparent conductive film
EP2942784A4 (en) * 2013-02-01 2016-08-24 Dowa Electronics Materials Co SILVER FILM AND METHOD FOR THE PRODUCTION THEREOF
JP6090664B2 (ja) * 2013-03-28 2017-03-08 三菱マテリアル株式会社 貴金属焼結体用の粘土状組成物
TWI632207B (zh) * 2013-07-01 2018-08-11 德商漢高智慧財產控股公司 奈米粒子墨水組成物、方法及應用
EP2821164A1 (en) * 2013-07-04 2015-01-07 Agfa-Gevaert A metallic nanoparticle dispersion
CN105339113B (zh) * 2013-07-04 2018-09-18 爱克发-格法特公司 金属纳米颗粒分散体
KR102172950B1 (ko) * 2013-08-16 2020-11-03 헨켈 아이피 앤드 홀딩 게엠베하 서브마이크론 은 입자 잉크 조성물, 방법 및 응용
CN105593796B (zh) 2013-09-30 2019-01-04 3M创新有限公司 用于图案化的纳米线透明导体上的印刷导电图案的保护性涂层
EP3062945B1 (en) * 2013-11-01 2019-12-04 Council of Scientific and Industrial Research;an Indian Reg. body incorporated under Reg. of Societies Act (Act XXI of 1860) A process for the preparation of metal nanoparticles
US9773989B2 (en) * 2013-12-03 2017-09-26 National University Corporation Yamagata University Method for producing metal thin film and conductive structure
JP6355240B2 (ja) * 2014-05-19 2018-07-11 Ｄｏｗａエレクトロニクス株式会社 銀微粒子分散液
US10785877B2 (en) 2014-07-28 2020-09-22 Heraeus Deutschland GmbH & Co. KG Method for producing a silver sintering agent having silver oxide surfaces and use of said agent in methods for joining components by pressure sintering
JP6486053B2 (ja) * 2014-10-03 2019-03-20 株式会社コムラテック 電子回路基板の製造方法
JP6592246B2 (ja) * 2015-01-27 2019-10-16 株式会社コムラテック 電子回路基板およびその製造方法
JP6471661B2 (ja) * 2015-09-24 2019-02-20 日信化学工業株式会社 高誘電率樹脂成形物、フィルム及び電気・電子部品
JP2017066485A (ja) 2015-09-30 2017-04-06 日東電工株式会社 シートおよび複合シート
JP6704322B2 (ja) 2015-09-30 2020-06-03 日東電工株式会社 シートおよび複合シート
TWI683322B (zh) * 2015-12-07 2020-01-21 日商哈利瑪化成股份有限公司 導電性糊劑之製造方法
KR102524435B1 (ko) * 2015-12-23 2023-04-24 헨켈 아게 운트 코. 카게아아 전도성 조성물을 위한 결합제로서의 중합체 에멀젼
CN105562712B (zh) * 2016-01-30 2018-10-23 北京印刷学院青岛研究院有限公司 一种富集水中纳米银颗粒的方法
JP6889568B2 (ja) * 2016-02-25 2021-06-18 三ツ星ベルト株式会社 インキ組成物及びそれを用いた画像形成方法
JP6920029B2 (ja) 2016-04-04 2021-08-18 日亜化学工業株式会社 金属粉焼結ペースト及びその製造方法、導電性材料の製造方法
CN108213455A (zh) * 2016-12-22 2018-06-29 富士康(昆山)电脑接插件有限公司 纳米金属溶胶的制备方法
TWI674302B (zh) * 2017-03-07 2019-10-11 日商同和電子科技有限公司 銀奈米線印墨之製造方法、銀奈米線印墨，以及透明導電塗膜
WO2018199144A1 (ja) * 2017-04-28 2018-11-01 株式会社ダイセル 電子デバイス製造用溶剤組成物
CN111819018B (zh) * 2018-01-26 2023-07-28 日清工程株式会社 微粒子的制造方法及微粒子
JPWO2022071300A1 (zh) * 2020-09-30 2022-04-07
CN114210996A (zh) * 2021-12-29 2022-03-22 上海腾烁电子材料有限公司 一种高烧结活性纳米银粉及其制备方法
CN114472891B (zh) * 2022-01-10 2023-11-24 江苏精研科技股份有限公司 一种高精密小模数齿轮高效成形方法
CN117673717B (zh) * 2024-01-30 2024-04-26 深圳市鸿富胜科技有限公司 微波感应天线

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5286417A (en) * 1991-12-06 1994-02-15 International Business Machines Corporation Method and composition for making mechanical and electrical contact
DE19959262A1 (de) * 1999-12-09 2001-06-21 Altoflex S A Leitfähiges pastöses Material und dessen Verwendung
CN1256177C (zh) * 2003-05-30 2006-05-17 中国科学院金属研究所 纳米金属粉体分散液及其制备方法
JP2005206931A (ja) * 2003-12-26 2005-08-04 Sumitomo Electric Ind Ltd 金属粉末の製造方法
JP2005200604A (ja) 2004-01-19 2005-07-28 Fujikura Ltd 粒子状銀化合物及びその利用
JP4641384B2 (ja) 2004-04-26 2011-03-02 バンドー化学株式会社 導電性インクおよびそれを用いた導電性被膜
CN1245152C (zh) 2004-04-30 2006-03-15 杨漓 一种纳米银水溶液制剂及其用途
JP5028695B2 (ja) * 2004-11-25 2012-09-19 Ｄｏｗａエレクトロニクス株式会社 銀粉およびその製造方法
WO2008099510A1 (ja) * 2007-02-15 2008-08-21 Dowa Electronics Materials Co., Ltd. 銀粒子粉末の製造法
US20070144305A1 (en) * 2005-12-20 2007-06-28 Jablonski Gregory A Synthesis of Metallic Nanoparticle Dispersions
CN101005755B (zh) 2006-12-12 2011-04-20 中国乐凯胶片集团公司 一种电磁波屏蔽膜及其制造方法
WO2008105456A1 (ja) * 2007-02-27 2008-09-04 Mitsubishi Materials Corporation 金属ナノ粒子分散液及びその製造方法並びに金属ナノ粒子の合成方法
JP5026303B2 (ja) * 2007-03-30 2012-09-12 Ｄｏｗａエレクトロニクス株式会社 銀粉の製造方法
EP3042727B1 (en) * 2007-10-24 2017-08-30 DOWA Electronics Materials Co., Ltd. Composition containing fine silver particles, production method thereof, method for producing fine silver particles, and paste having fine silver particles
JP5371247B2 (ja) 2008-01-06 2013-12-18 Ｄｏｗａエレクトロニクス株式会社 銀塗料およびその製造法
JP5431073B2 (ja) 2008-09-01 2014-03-05 三ツ星ベルト株式会社 導電性基材を製造する方法
JP5560458B2 (ja) 2008-10-17 2014-07-30 三菱マテリアル株式会社 金属ナノ粒子の合成方法
JP2011202265A (ja) 2010-03-26 2011-10-13 Dowa Electronics Materials Co Ltd 低温焼結性金属ナノ粒子組成物および該組成物を用いて形成された電子物品

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US20120177897A1 (en) 2012-07-12
CN102510783A (zh) 2012-06-20
US8673049B2 (en) 2014-03-18
SG178823A1 (en) 2012-05-30
KR20180056811A (ko) 2018-05-29
WO2012026033A1 (ja) 2012-03-01
KR20170063991A (ko) 2017-06-08
EP2610023B1 (en) 2017-09-27
AU2010349580B2 (en) 2014-06-26
CN102510783B (zh) 2015-07-22
JP5632852B2 (ja) 2014-11-26
CA2759785A1 (en) 2012-02-27
KR20130050906A (ko) 2013-05-16
EP2610023A1 (en) 2013-07-03
JPWO2012026033A1 (ja) 2013-10-28
EP2610023A4 (en) 2015-07-22

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