HK1153558A1 - 具有單面布線及雙面附接的柔性電路 - Google Patents
具有單面布線及雙面附接的柔性電路Info
- Publication number
- HK1153558A1 HK1153558A1 HK11107619.3A HK11107619A HK1153558A1 HK 1153558 A1 HK1153558 A1 HK 1153558A1 HK 11107619 A HK11107619 A HK 11107619A HK 1153558 A1 HK1153558 A1 HK 1153558A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- sided
- attach
- flex circuit
- routing
- double
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0416—Control or interface arrangements specially adapted for digitisers
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0416—Control or interface arrangements specially adapted for digitisers
- G06F3/04164—Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
- H05K2201/053—Tails
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Theoretical Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Human Computer Interaction (AREA)
- Manufacturing & Machinery (AREA)
- Computer Networks & Wireless Communication (AREA)
- Position Input By Displaying (AREA)
- Structure Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Combinations Of Printed Boards (AREA)
- Push-Button Switches (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/122,441 US8456851B2 (en) | 2008-05-16 | 2008-05-16 | Flex circuit with single sided routing and double sided attach |
PCT/US2009/043592 WO2009140258A1 (en) | 2008-05-16 | 2009-05-12 | Flex circuit with single sided routing and double sided attach |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1153558A1 true HK1153558A1 (zh) | 2012-03-30 |
Family
ID=40886444
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK11107619.3A HK1153558A1 (zh) | 2008-05-16 | 2011-07-22 | 具有單面布線及雙面附接的柔性電路 |
Country Status (7)
Country | Link |
---|---|
US (2) | US8456851B2 (zh) |
EP (2) | EP2277102B1 (zh) |
JP (1) | JP5118100B2 (zh) |
KR (1) | KR101376459B1 (zh) |
CN (2) | CN101581995B (zh) |
HK (1) | HK1153558A1 (zh) |
WO (1) | WO2009140258A1 (zh) |
Families Citing this family (58)
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US8456851B2 (en) * | 2008-05-16 | 2013-06-04 | Apple Inc. | Flex circuit with single sided routing and double sided attach |
EP2446808A4 (en) * | 2009-06-25 | 2013-01-02 | Olympus Medical Systems Corp | IMAGE CAPTURE UNIT |
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JP5455034B2 (ja) * | 2009-12-09 | 2014-03-26 | ホシデン株式会社 | フレキシブル配線基板 |
KR101083084B1 (ko) * | 2009-12-14 | 2011-11-16 | (주)필스 | 전극 접속 부재 및 필름형 스피커 |
TWI450237B (zh) * | 2010-01-14 | 2014-08-21 | Wintek Corp | 觸控顯示裝置 |
KR101703503B1 (ko) * | 2010-07-13 | 2017-02-08 | (주)멜파스 | 회로기판을 이용하여 터치센서 칩에 감지 신호를 전달하는 접촉 감지 패널 및 접촉 감지 장치 |
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-
2008
- 2008-05-16 US US12/122,441 patent/US8456851B2/en active Active
-
2009
- 2009-05-12 EP EP09747342.5A patent/EP2277102B1/en active Active
- 2009-05-12 EP EP15164081.0A patent/EP2930598A1/en not_active Withdrawn
- 2009-05-12 KR KR1020107028185A patent/KR101376459B1/ko active IP Right Grant
- 2009-05-12 WO PCT/US2009/043592 patent/WO2009140258A1/en active Application Filing
- 2009-05-15 CN CN200910139062XA patent/CN101581995B/zh active Active
- 2009-05-15 CN CN2009201496009U patent/CN201540549U/zh not_active Expired - Lifetime
- 2009-05-15 JP JP2009136681A patent/JP5118100B2/ja active Active
-
2011
- 2011-01-05 US US12/985,274 patent/US8549738B2/en active Active
- 2011-07-22 HK HK11107619.3A patent/HK1153558A1/zh unknown
Also Published As
Publication number | Publication date |
---|---|
US20110094670A1 (en) | 2011-04-28 |
US8456851B2 (en) | 2013-06-04 |
CN101581995B (zh) | 2013-03-27 |
CN101581995A (zh) | 2009-11-18 |
US20090283300A1 (en) | 2009-11-19 |
EP2930598A1 (en) | 2015-10-14 |
US8549738B2 (en) | 2013-10-08 |
JP2010009594A (ja) | 2010-01-14 |
JP5118100B2 (ja) | 2013-01-16 |
CN201540549U (zh) | 2010-08-04 |
KR101376459B1 (ko) | 2014-03-19 |
WO2009140258A1 (en) | 2009-11-19 |
KR20110020826A (ko) | 2011-03-03 |
EP2277102B1 (en) | 2016-11-02 |
EP2277102A1 (en) | 2011-01-26 |
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