HK1152144A1 - Electronic device and method for connecting electronic circuit board - Google Patents
Electronic device and method for connecting electronic circuit boardInfo
- Publication number
- HK1152144A1 HK1152144A1 HK11106035.1A HK11106035A HK1152144A1 HK 1152144 A1 HK1152144 A1 HK 1152144A1 HK 11106035 A HK11106035 A HK 11106035A HK 1152144 A1 HK1152144 A1 HK 1152144A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- circuit board
- electronic device
- electronic circuit
- electronic
- connecting electronic
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B5/00—Near-field transmission systems, e.g. inductive or capacitive transmission systems
- H04B5/70—Near-field transmission systems, e.g. inductive or capacitive transmission systems specially adapted for specific purposes
- H04B5/79—Near-field transmission systems, e.g. inductive or capacitive transmission systems specially adapted for specific purposes for data transfer in combination with power transfer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F38/00—Adaptations of transformers or inductances for specific applications or functions
- H01F38/14—Inductive couplings
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
- H02J50/10—Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling
- H02J50/12—Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling of the resonant type
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
- H02J50/70—Circuit arrangements or systems for wireless supply or distribution of electric power involving the reduction of electric, magnetic or electromagnetic leakage fields
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
- H02J50/80—Circuit arrangements or systems for wireless supply or distribution of electric power involving the exchange of data, concerning supply or distribution of electric power, between transmitting devices and receiving devices
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B5/00—Near-field transmission systems, e.g. inductive or capacitive transmission systems
- H04B5/20—Near-field transmission systems, e.g. inductive or capacitive transmission systems characterised by the transmission technique; characterised by the transmission medium
- H04B5/24—Inductive coupling
- H04B5/26—Inductive coupling using coils
- H04B5/263—Multiple coils at either side
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B5/00—Near-field transmission systems, e.g. inductive or capacitive transmission systems
- H04B5/20—Near-field transmission systems, e.g. inductive or capacitive transmission systems characterised by the transmission technique; characterised by the transmission medium
- H04B5/24—Inductive coupling
- H04B5/26—Inductive coupling using coils
- H04B5/266—One coil at each side, e.g. with primary and secondary coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B5/00—Near-field transmission systems, e.g. inductive or capacitive transmission systems
- H04B5/70—Near-field transmission systems, e.g. inductive or capacitive transmission systems specially adapted for specific purposes
- H04B5/72—Near-field transmission systems, e.g. inductive or capacitive transmission systems specially adapted for specific purposes for local intradevice communication
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Near-Field Transmission Systems (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008134266A JP4698702B2 (ja) | 2008-05-22 | 2008-05-22 | 電子機器 |
PCT/JP2009/054711 WO2009142053A1 (ja) | 2008-05-22 | 2009-03-12 | 電子機器、電子回路基板の接続方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1152144A1 true HK1152144A1 (en) | 2012-02-17 |
Family
ID=41339992
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK11106035.1A HK1152144A1 (en) | 2008-05-22 | 2011-06-14 | Electronic device and method for connecting electronic circuit board |
Country Status (7)
Country | Link |
---|---|
US (1) | US8643219B2 (ja) |
EP (3) | EP2284849B1 (ja) |
JP (1) | JP4698702B2 (ja) |
CN (1) | CN102037526B (ja) |
AU (1) | AU2009250645B2 (ja) |
HK (1) | HK1152144A1 (ja) |
WO (1) | WO2009142053A1 (ja) |
Families Citing this family (112)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010140297A1 (ja) * | 2009-06-04 | 2010-12-09 | 日本電気株式会社 | 半導体装置及び信号伝達方法 |
JP4669560B1 (ja) * | 2009-12-11 | 2011-04-13 | エンパイア テクノロジー ディベロップメント エルエルシー | 非接触式の情報管理・充電システム、携帯通信端末および非接触式の情報・電力伝送ユニット |
KR20120119927A (ko) * | 2010-05-11 | 2012-11-01 | 삼성전자주식회사 | 무선 충전이 가능한 3d 안경 및 무선전력전송 시스템 |
JP5598118B2 (ja) * | 2010-06-28 | 2014-10-01 | 株式会社リコー | 電子機器および画像形成装置 |
IT1400748B1 (it) | 2010-06-30 | 2013-07-02 | St Microelectronics Srl | Apparato per il trasferimento wireless di energia fra due dispositivi e contemporaneo trasferimento di dati. |
EP2617207A2 (en) * | 2010-09-17 | 2013-07-24 | Cascade Microtech, Inc. | Systems and methods for non-contact power and data transfer in electronic devices |
JP5608026B2 (ja) * | 2010-09-24 | 2014-10-15 | Necトーキン株式会社 | 非接触電力伝送および通信システム |
US20120203620A1 (en) | 2010-11-08 | 2012-08-09 | Douglas Howard Dobyns | Techniques For Wireless Communication Of Proximity Based Marketing |
WO2012101729A1 (ja) | 2011-01-26 | 2012-08-02 | パナソニック株式会社 | 非接触充電モジュール及び非接触充電機器 |
WO2012116054A2 (en) * | 2011-02-22 | 2012-08-30 | Steele Daniel W | Wireless automated vehicle energizing system |
JP5711572B2 (ja) * | 2011-03-02 | 2015-05-07 | 日東電工株式会社 | アイソレータ用回路基板、アイソレータおよびそれらの製造方法 |
US20120228955A1 (en) * | 2011-03-07 | 2012-09-13 | Advantest Corporation | Transmission coil for wireless power transmission |
JP5677875B2 (ja) * | 2011-03-16 | 2015-02-25 | 日立マクセル株式会社 | 非接触電力伝送システム |
US8929809B2 (en) | 2011-03-22 | 2015-01-06 | Radeum, Inc. | Techniques for wireless communication of proximity based content |
US8880100B2 (en) | 2011-03-23 | 2014-11-04 | Radium, Inc. | Proximity based social networking |
FR2974259B1 (fr) * | 2011-04-18 | 2013-06-07 | Commissariat Energie Atomique | Recepteur alimente par une interface sans fil de type inductif |
US20120274148A1 (en) * | 2011-04-27 | 2012-11-01 | Samsung Electro-Mechanics Co., Ltd. | Contactless power transmission device and electronic device having the same |
JP5708270B2 (ja) * | 2011-06-03 | 2015-04-30 | 株式会社村田製作所 | 送電装置、受電装置、及び電力伝送システム |
EP3425651A3 (en) | 2011-06-14 | 2019-01-16 | Panasonic Corporation | Communication apparatus |
KR101815323B1 (ko) * | 2011-09-08 | 2018-01-05 | 삼성전자주식회사 | 복수의 무선 전력 수신기로부터 무선 전력 공급기에 신호를 송신하는 방법 및 장치 |
FR2980055B1 (fr) * | 2011-09-12 | 2013-12-27 | Valeo Systemes Thermiques | Dispositif de transmission de puissance inductif |
US10204734B2 (en) | 2011-11-02 | 2019-02-12 | Panasonic Corporation | Electronic device including non-contact charging module and near field communication antenna |
EP2775632A4 (en) * | 2011-11-02 | 2015-07-01 | Panasonic Corp | COIL FOR CONTACTLESS WIRELESS COMMUNICATION, TRANSMISSION COIL, MOBILE WIRELESS TERMINAL |
US20140306656A1 (en) * | 2011-12-07 | 2014-10-16 | Panasonic Corporation | Non-contact charging module and portable terminal provided with same |
US9727511B2 (en) | 2011-12-30 | 2017-08-08 | Bedrock Automation Platforms Inc. | Input/output module with multi-channel switching capability |
US10834820B2 (en) | 2013-08-06 | 2020-11-10 | Bedrock Automation Platforms Inc. | Industrial control system cable |
US11967839B2 (en) | 2011-12-30 | 2024-04-23 | Analog Devices, Inc. | Electromagnetic connector for an industrial control system |
US9467297B2 (en) | 2013-08-06 | 2016-10-11 | Bedrock Automation Platforms Inc. | Industrial control system redundant communications/control modules authentication |
US9191203B2 (en) | 2013-08-06 | 2015-11-17 | Bedrock Automation Platforms Inc. | Secure industrial control system |
US10834094B2 (en) | 2013-08-06 | 2020-11-10 | Bedrock Automation Platforms Inc. | Operator action authentication in an industrial control system |
US8971072B2 (en) | 2011-12-30 | 2015-03-03 | Bedrock Automation Platforms Inc. | Electromagnetic connector for an industrial control system |
US8862802B2 (en) * | 2011-12-30 | 2014-10-14 | Bedrock Automation Platforms Inc. | Switch fabric having a serial communications interface and a parallel communications interface |
US12061685B2 (en) | 2011-12-30 | 2024-08-13 | Analog Devices, Inc. | Image capture devices for a secure industrial control system |
US9437967B2 (en) | 2011-12-30 | 2016-09-06 | Bedrock Automation Platforms, Inc. | Electromagnetic connector for an industrial control system |
US9600434B1 (en) | 2011-12-30 | 2017-03-21 | Bedrock Automation Platforms, Inc. | Switch fabric having a serial communications interface and a parallel communications interface |
JP2013169122A (ja) | 2012-02-17 | 2013-08-29 | Panasonic Corp | 非接触充電モジュール及びそれを備えた携帯端末 |
AT512504B1 (de) * | 2012-03-22 | 2013-09-15 | Seibersdorf Labor Gmbh | Vorrichtung und Verfahren zur Bestimmung der Kapazität |
CN102680123A (zh) * | 2012-05-30 | 2012-09-19 | 西安交通大学 | 一种保持架温度及应力在线监测系统及其方法 |
JP6112383B2 (ja) | 2012-06-28 | 2017-04-12 | パナソニックIpマネジメント株式会社 | 携帯端末 |
JP6008237B2 (ja) | 2012-06-28 | 2016-10-19 | パナソニックIpマネジメント株式会社 | 携帯端末 |
KR20140011069A (ko) * | 2012-07-17 | 2014-01-28 | 한국전자통신연구원 | 무선 전력 전송 장치 |
US9654184B2 (en) * | 2012-07-20 | 2017-05-16 | WIPQTUS Inc. | Transmitter to receiver communication link in a wireless power system |
US9805863B2 (en) | 2012-07-27 | 2017-10-31 | Thoratec Corporation | Magnetic power transmission utilizing phased transmitter coil arrays and phased receiver coil arrays |
EP2878062A4 (en) | 2012-07-27 | 2016-04-20 | Thoratec Corp | RESONANT COILS AND RESONANT TRANSMISSION SYSTEMS |
WO2014018972A1 (en) | 2012-07-27 | 2014-01-30 | Thoratec Corporation | Computer modeling for resonant power transfer systems |
EP2878061B1 (en) | 2012-07-27 | 2023-10-25 | Tc1 Llc | Thermal management for implantable wireless power transfer systems |
US9287040B2 (en) | 2012-07-27 | 2016-03-15 | Thoratec Corporation | Self-tuning resonant power transfer systems |
US10383990B2 (en) | 2012-07-27 | 2019-08-20 | Tc1 Llc | Variable capacitor for resonant power transfer systems |
US9825471B2 (en) | 2012-07-27 | 2017-11-21 | Thoratec Corporation | Resonant power transfer systems with protective algorithm |
US10525181B2 (en) | 2012-07-27 | 2020-01-07 | Tc1 Llc | Resonant power transfer system and method of estimating system state |
WO2014038265A1 (ja) * | 2012-09-05 | 2014-03-13 | ルネサスエレクトロニクス株式会社 | 非接触充電装置およびそれを用いる非接触給電システム |
JP6073098B2 (ja) * | 2012-09-27 | 2017-02-01 | シャープ株式会社 | フレキシブル配線基板および情報処理装置 |
KR102036637B1 (ko) * | 2012-11-13 | 2019-10-25 | 엘지전자 주식회사 | Nfc용 코일부 및 무선 충전용 코일부를 구비하는 무선 전력 수신장치의 수신코일 |
US9208982B2 (en) * | 2012-12-03 | 2015-12-08 | Broadcom Corporation | Systems and methods for distributing power to integrated circuit dies |
US10090884B2 (en) * | 2013-01-11 | 2018-10-02 | Koninklijke Philips N.V. | Wireless inductive power transfer |
JP6102359B2 (ja) * | 2013-03-08 | 2017-03-29 | 株式会社オートネットワーク技術研究所 | 電気接続装置 |
US9680310B2 (en) | 2013-03-15 | 2017-06-13 | Thoratec Corporation | Integrated implantable TETS housing including fins and coil loops |
EP2984731B8 (en) | 2013-03-15 | 2019-06-26 | Tc1 Llc | Malleable tets coil with improved anatomical fit |
JP6159610B2 (ja) * | 2013-07-19 | 2017-07-05 | 日東電工株式会社 | 回路基板及びそれを備えた携帯機器 |
US10613567B2 (en) | 2013-08-06 | 2020-04-07 | Bedrock Automation Platforms Inc. | Secure power supply for an industrial control system |
ES2676700T3 (es) * | 2013-11-08 | 2018-07-24 | Nokia Technologies Oy | Disposición de una bobina de comunicación y una bobina de carga de inducción |
EP3072210B1 (en) | 2013-11-11 | 2023-12-20 | Tc1 Llc | Resonant power transfer systems with communications |
US9855437B2 (en) | 2013-11-11 | 2018-01-02 | Tc1 Llc | Hinged resonant power transfer coil |
WO2015070200A1 (en) | 2013-11-11 | 2015-05-14 | Thoratec Corporation | Resonant power transfer systems with communications |
JP2015100232A (ja) * | 2013-11-20 | 2015-05-28 | 日新電機株式会社 | 非接触給電システム |
JP6474968B2 (ja) | 2013-12-26 | 2019-02-27 | ホシデン株式会社 | 雄コネクタ、雌コネクタ及び雄コネクタと雌コネクタと接続構造 |
WO2015134871A1 (en) | 2014-03-06 | 2015-09-11 | Thoratec Corporation | Electrical connectors for implantable devices |
CN111293495B (zh) | 2014-07-07 | 2022-05-24 | 基岩自动化平台公司 | 工业控制系统电缆 |
US9838082B2 (en) | 2014-08-29 | 2017-12-05 | Freelinc Technologies | Proximity boundary based communication |
EP4213298A1 (en) | 2014-09-22 | 2023-07-19 | Tc1 Llc | Antenna designs for communication between a wirelessly powered implant to an external device outside the body |
JP2016073059A (ja) * | 2014-09-29 | 2016-05-09 | セイコーインスツル株式会社 | 非接触電力伝送装置、非接触電力伝送装置を搭載した電子機器、非接触電力伝送装置の製造方法 |
EP3204989B1 (en) | 2014-10-06 | 2019-08-21 | Tc1 Llc | Multiaxial connector for implantable devices |
US20160126639A1 (en) * | 2014-10-14 | 2016-05-05 | Samsung Electro-Mechanics Co., Ltd. | Coil structure and wireless power receiving apparatus including the same |
JP6512799B2 (ja) * | 2014-11-27 | 2019-05-15 | キヤノン株式会社 | 給電装置、制御方法及びプログラム |
NL1041080B1 (en) * | 2014-12-04 | 2016-10-11 | Univ Delft Tech | An inductive power transfer system, a method and a computer program product. |
US10164685B2 (en) | 2014-12-31 | 2018-12-25 | Freelinc Technologies Inc. | Spatially aware wireless network |
JP6438773B2 (ja) * | 2015-01-13 | 2018-12-19 | ローム株式会社 | ワイヤレス受電装置、電子機器、ワイヤレス送電装置からの最大送信電力の検出方法 |
EP3283145B1 (en) | 2015-04-16 | 2024-08-28 | Sanofi-Aventis Deutschland GmbH | Sensor and sensor assembly for capacitive determination of a filling level |
CN107847678A (zh) | 2015-07-31 | 2018-03-27 | 赛诺菲-安万特德国有限公司 | 传感器、药筒和药物输送装置 |
US11007322B2 (en) | 2015-07-31 | 2021-05-18 | Sanofi-Aventis Deutschland Gmbh | Sensor, cartridge and drug delivery device |
DK3328467T3 (da) | 2015-07-31 | 2022-06-20 | Sanofi Aventis Deutschland | Sensor, patron og lægemiddeladministrationsanordning |
US11020529B2 (en) * | 2015-07-31 | 2021-06-01 | Sanofi-Aventis Deutschland Gmbh | Sensor for a drug delivery device |
US10148126B2 (en) | 2015-08-31 | 2018-12-04 | Tc1 Llc | Wireless energy transfer system and wearables |
EP3902100A1 (en) | 2015-10-07 | 2021-10-27 | Tc1 Llc | Resonant power transfer systems having efficiency optimization based on receiver impedance |
US11227825B2 (en) * | 2015-12-21 | 2022-01-18 | Intel Corporation | High performance integrated RF passives using dual lithography process |
JP6622649B2 (ja) * | 2015-12-21 | 2019-12-18 | ホシデン株式会社 | 非接触通信モジュール |
WO2017110273A1 (ja) * | 2015-12-21 | 2017-06-29 | ホシデン株式会社 | 非接触通信モジュール |
US10797523B2 (en) * | 2016-02-17 | 2020-10-06 | Fuji Corporation | Non-contact power supply device |
US11018528B2 (en) * | 2016-04-06 | 2021-05-25 | Hitachi, Ltd. | Wireless power transmission/reception system, power conversion device including the same, and power conversion method |
EP4084271A1 (en) | 2016-09-21 | 2022-11-02 | Tc1 Llc | Systems and methods for locating implanted wireless power transmission devices |
US20180131412A1 (en) * | 2016-11-10 | 2018-05-10 | Integrated Device Technology, Inc. | Methods for increasing data communication bandwidth between wireless power devices |
US10571487B2 (en) | 2016-11-30 | 2020-02-25 | Formfactor Beaverton, Inc. | Contact engines, probe head assemblies, probe systems, and associated methods for on-wafer testing of the wireless operation of a device under test |
WO2018101315A1 (ja) * | 2016-12-02 | 2018-06-07 | 株式会社村田製作所 | Rfidタグ |
US11197990B2 (en) | 2017-01-18 | 2021-12-14 | Tc1 Llc | Systems and methods for transcutaneous power transfer using microneedles |
US11095137B2 (en) * | 2017-03-09 | 2021-08-17 | Amosense Co., Ltd. | Wireless power transmission device for vehicle |
US10879736B2 (en) * | 2017-03-16 | 2020-12-29 | Shenzhen Yichong Wireless Power Technology Co. Ltd | Wireless power transfer systems and methods using non-resonant power receiver |
CN110521081B (zh) * | 2017-03-16 | 2023-11-10 | 成都市易冲半导体有限公司 | 使用非谐振电能接收器的无线电能传输系统和方法 |
US20180269710A1 (en) * | 2017-03-16 | 2018-09-20 | Shenzhen Yichong Wireless Power Technology Co. Ltd. | Power transmitter coil in wireless charging system |
JP6755212B2 (ja) * | 2017-03-24 | 2020-09-16 | 株式会社豊田中央研究所 | スイッチ回路 |
JP6834698B2 (ja) * | 2017-03-31 | 2021-02-24 | Tdk株式会社 | 磁気結合装置およびこれを用いたワイヤレス電力伝送システム |
WO2018222758A1 (en) | 2017-05-30 | 2018-12-06 | Wireless Advanced Vehicle Electrification, Inc. | Single feed multi-pad wireless charging |
EP3735733B1 (en) | 2018-01-04 | 2024-01-17 | Tc1 Llc | Systems and methods for elastic wireless power transmission devices |
JP6519711B1 (ja) * | 2018-01-15 | 2019-05-29 | 凸版印刷株式会社 | 電子機器 |
TWI741129B (zh) * | 2018-01-16 | 2021-10-01 | 日商凸版印刷股份有限公司 | 電子機器 |
US11462943B2 (en) | 2018-01-30 | 2022-10-04 | Wireless Advanced Vehicle Electrification, Llc | DC link charging of capacitor in a wireless power transfer pad |
JP7027962B2 (ja) * | 2018-03-02 | 2022-03-02 | 三菱電機株式会社 | 照明器具 |
EP3611820A1 (en) | 2018-08-15 | 2020-02-19 | Koninklijke Philips N.V. | Device and method for wireless power transfer |
KR102645042B1 (ko) * | 2018-09-14 | 2024-03-08 | 현대자동차주식회사 | 가변구조형 전자파차폐필터와 이를 구비한 차량용 무선충전기 및 그 제어방법 |
CN112805926A (zh) | 2018-10-10 | 2021-05-14 | 西门子股份公司 | 用于通信的系统和模块 |
DE102019106716A1 (de) * | 2019-03-15 | 2020-09-17 | Balluff Gmbh | Vorrichtung zur induktiven Übertragung von elektrischer Energie und/oder von Daten und Verfahren zur Herstellung einer solchen Vorrichtung |
DE102019211399A1 (de) * | 2019-07-31 | 2021-02-04 | Würth Elektronik eiSos Gmbh & Co. KG | Spulen-Anordnung und Vorrichtung zur drahtlosen elektromagnetischen Energieübertragung |
KR20220135780A (ko) * | 2021-03-31 | 2022-10-07 | 삼성전자주식회사 | 무선 전력 수신, 무선 통신, 및 전기 자극을 수행하는 장치 및 방법 |
Family Cites Families (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2567219B2 (ja) * | 1985-07-03 | 1996-12-25 | 日本エルエスアイカード 株式会社 | 非接触方式による記憶基板とリ−ド・ライト装置間の書込み・読取り方法 |
DK0509125T3 (da) * | 1991-04-19 | 1995-05-29 | Siemens Ag | Indretning til kontaktløs data- og energitransmission samt fremgangsmåde til betjening heraf |
US5229652A (en) * | 1992-04-20 | 1993-07-20 | Hough Wayne E | Non-contact data and power connector for computer based modules |
US5434396A (en) * | 1992-11-10 | 1995-07-18 | Xicor Inc. | Wireless powering and communication system for communicating data between a host system and a stand-alone device |
JPH0766060A (ja) * | 1993-08-25 | 1995-03-10 | Tdk Corp | ロータリートランス |
JPH08241386A (ja) * | 1995-03-03 | 1996-09-17 | Hitachi Maxell Ltd | 非接触メモリカード及びこれに搭載可能な電磁結合装置 |
EP0982832A3 (en) * | 1996-08-07 | 2000-08-09 | Sumitomo Wiring Systems, Ltd. | Charging system for electric vehicle |
JPH10106867A (ja) * | 1996-08-07 | 1998-04-24 | Sumitomo Wiring Syst Ltd | 電気自動車用充電システム |
US6210771B1 (en) * | 1997-09-24 | 2001-04-03 | Massachusetts Institute Of Technology | Electrically active textiles and articles made therefrom |
GB2337675B (en) * | 1998-05-22 | 2001-04-11 | Schlumberger Ltd | Oil well monitoring and control system communication network |
US6239879B1 (en) * | 1998-07-29 | 2001-05-29 | Hewlett-Packard Company | Non-contacting communication and power interface between a printing engine and peripheral systems attached to replaceable printer component |
JP2000276562A (ja) * | 1999-03-23 | 2000-10-06 | Oki Electric Ind Co Ltd | 非接触データ転送装置及びメモリカード |
JP2001033136A (ja) | 1999-07-19 | 2001-02-09 | Sharp Corp | 冷蔵庫 |
AU2000251049A1 (en) * | 2000-06-02 | 2001-12-17 | Yamatake Corporation | Electromagnetic induction coupling apparatus |
JP3488869B2 (ja) * | 2001-03-16 | 2004-01-19 | Tdk株式会社 | 平面コイルおよび平面トランス |
CN1240087C (zh) * | 2001-03-05 | 2006-02-01 | Tdk株式会社 | 平面线圈及平面变压器 |
JP2004088851A (ja) | 2002-08-23 | 2004-03-18 | Toritsu Tsushin Kogyo Kk | 電源装置 |
WO2004088851A1 (ja) | 2003-03-31 | 2004-10-14 | Fujitsu Limited | 信号伝送方法 |
JP4131544B2 (ja) * | 2004-02-13 | 2008-08-13 | 学校法人慶應義塾 | 電子回路 |
JP2005260122A (ja) * | 2004-03-15 | 2005-09-22 | Dainippon Printing Co Ltd | 非接触電力伝送モジュール |
JP2006173986A (ja) * | 2004-12-15 | 2006-06-29 | Keio Gijuku | 電子回路 |
JP4972306B2 (ja) * | 2004-12-21 | 2012-07-11 | オンセミコンダクター・トレーディング・リミテッド | 半導体装置及び回路装置 |
CA2511051A1 (en) * | 2005-06-28 | 2006-12-29 | Roger J. Soar | Contactless battery charging apparel |
EP1885019A1 (en) * | 2006-07-24 | 2008-02-06 | Schott Advanced Packaging Singapore Te. Ltd. | A method of fabricating a 3D RFID antenna and device manufactured therewith |
JP4014217B2 (ja) | 2006-08-07 | 2007-11-28 | ソニー・エリクソン・モバイルコミュニケーションズ株式会社 | 携帯通信端末 |
KR100836634B1 (ko) * | 2006-10-24 | 2008-06-10 | 주식회사 한림포스텍 | 무선 데이타 통신과 전력 전송이 가능한 무접점 충전장치,충전용 배터리팩 및 무접점 충전장치를 이용한 휴대용단말기 |
-
2008
- 2008-05-22 JP JP2008134266A patent/JP4698702B2/ja not_active Expired - Fee Related
-
2009
- 2009-03-12 EP EP09750415.3A patent/EP2284849B1/en not_active Not-in-force
- 2009-03-12 EP EP17189208.6A patent/EP3285271B1/en active Active
- 2009-03-12 WO PCT/JP2009/054711 patent/WO2009142053A1/ja active Application Filing
- 2009-03-12 CN CN2009801186096A patent/CN102037526B/zh not_active Expired - Fee Related
- 2009-03-12 AU AU2009250645A patent/AU2009250645B2/en not_active Ceased
- 2009-03-12 EP EP17189203.7A patent/EP3273455B1/en active Active
- 2009-03-12 US US12/989,583 patent/US8643219B2/en not_active Expired - Fee Related
-
2011
- 2011-06-14 HK HK11106035.1A patent/HK1152144A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP3285271A1 (en) | 2018-02-21 |
JP2009284657A (ja) | 2009-12-03 |
US20110043050A1 (en) | 2011-02-24 |
AU2009250645B2 (en) | 2013-02-21 |
EP3273455B1 (en) | 2019-08-28 |
EP2284849B1 (en) | 2018-07-25 |
JP4698702B2 (ja) | 2011-06-08 |
US8643219B2 (en) | 2014-02-04 |
EP3285271B1 (en) | 2019-08-21 |
EP2284849A4 (en) | 2017-06-21 |
EP2284849A1 (en) | 2011-02-16 |
WO2009142053A1 (ja) | 2009-11-26 |
CN102037526A (zh) | 2011-04-27 |
EP3273455A1 (en) | 2018-01-24 |
AU2009250645A1 (en) | 2009-11-26 |
CN102037526B (zh) | 2012-11-28 |
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PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20200315 |