HK1098251A1 - Sawing and handler system for manufacturing semiconductor package - Google Patents

Sawing and handler system for manufacturing semiconductor package

Info

Publication number
HK1098251A1
HK1098251A1 HK07105545.2A HK07105545A HK1098251A1 HK 1098251 A1 HK1098251 A1 HK 1098251A1 HK 07105545 A HK07105545 A HK 07105545A HK 1098251 A1 HK1098251 A1 HK 1098251A1
Authority
HK
Hong Kong
Prior art keywords
sawing
semiconductor package
manufacturing semiconductor
handler system
handler
Prior art date
Application number
HK07105545.2A
Other languages
English (en)
Original Assignee
Hanmi Semiconductor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020040032326A external-priority patent/KR100574584B1/ko
Application filed by Hanmi Semiconductor Co Ltd filed Critical Hanmi Semiconductor Co Ltd
Publication of HK1098251A1 publication Critical patent/HK1098251A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67236—Apparatus for manufacturing or treating in a plurality of work-stations the substrates being processed being not semiconductor wafers, e.g. leadframes or chips

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Cleaning In General (AREA)
  • Cleaning By Liquid Or Steam (AREA)
HK07105545.2A 2004-05-07 2007-05-28 Sawing and handler system for manufacturing semiconductor package HK1098251A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020040032326A KR100574584B1 (ko) 2003-05-31 2004-05-07 반도체 패키지 제조공정용 절단 및 핸들러시스템
PCT/KR2004/003127 WO2005109492A1 (en) 2004-05-07 2004-11-30 Sawing and handler system for manufacturing semiconductor package

Publications (1)

Publication Number Publication Date
HK1098251A1 true HK1098251A1 (en) 2007-07-13

Family

ID=35320473

Family Applications (1)

Application Number Title Priority Date Filing Date
HK07105545.2A HK1098251A1 (en) 2004-05-07 2007-05-28 Sawing and handler system for manufacturing semiconductor package

Country Status (5)

Country Link
EP (1) EP1743368A4 (xx)
JP (1) JP2007536727A (xx)
CN (1) CN100470758C (xx)
HK (1) HK1098251A1 (xx)
WO (1) WO2005109492A1 (xx)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7829383B2 (en) 2004-08-23 2010-11-09 Rokko Systems Pte Ltd. Supply mechanism for the chuck of an integrated circuit dicing device
JP4869184B2 (ja) * 2006-08-28 2012-02-08 ハンミ セミコンダクター カンパニー リミテッド パッケージ固定用ジグアセンブリ
JP4944711B2 (ja) * 2006-08-28 2012-06-06 ハンミ セミコンダクター カンパニー リミテッド 半導体パッケージ固定アセンブリ
JP2010539583A (ja) * 2007-09-14 2010-12-16 ハンミ セミコンダクター カンパニー リミテッド メモリーカード加工装置
NL2001790C2 (nl) * 2008-07-11 2010-01-12 Fico Bv Inrichting en werkwijze voor het zagen van elektronische componenten.
WO2010009881A1 (en) * 2008-07-23 2010-01-28 Meyer Burger Ag Multi-wire cutting device with a revolving workpiece mount
SG183593A1 (en) * 2011-03-02 2012-09-27 Rokko Systems Pte Ltd Improved system for substrate processing
KR101414690B1 (ko) * 2013-04-22 2014-07-08 한미반도체 주식회사 반도체 스트립 절단장치
KR102267946B1 (ko) * 2014-11-04 2021-06-22 세메스 주식회사 반도체 패키지 및 반도체 스트립 이송 장치
KR101828381B1 (ko) * 2016-08-31 2018-02-12 (주)임펙 엔터프라이즈 복합 이송툴을 구비하는 기판절단장비 및 이를 이용한 기판 이송 방법
KR101863139B1 (ko) * 2017-10-23 2018-05-31 (주)임펙 엔터프라이즈 언로딩영역의 하부에 스크랩수집부가 설치된 기판절단장비
KR102019377B1 (ko) * 2017-11-24 2019-09-06 한미반도체 주식회사 반도체 자재 절단장치
CN110370468B (zh) * 2019-09-06 2020-07-24 浙江利恩工程设计咨询有限公司 一种多方位大理石切割装置
JP7377092B2 (ja) * 2019-12-16 2023-11-09 Ｔｏｗａ株式会社 統計データ生成方法、切断装置及びシステム
KR102617780B1 (ko) * 2020-11-19 2023-12-26 세메스 주식회사 반도체 스트립 절단 및 분류 설비에서 공기 분사 장치
KR20220072935A (ko) * 2020-11-25 2022-06-03 세메스 주식회사 반도체 스트립 절단 및 분류 설비에서 패키지 건조 장치
JP2022148886A (ja) 2021-03-24 2022-10-06 Ｔｏｗａ株式会社 加工装置、及び加工品の製造方法
JP7430154B2 (ja) * 2021-03-29 2024-02-09 Ｔｏｗａ株式会社 加工装置、及び加工品の製造方法
JP2023022562A (ja) * 2021-08-03 2023-02-15 Ｔｏｗａ株式会社 加工装置、及び加工品の製造方法
JP2023023057A (ja) * 2021-08-04 2023-02-16 Ｔｏｗａ株式会社 加工装置、及び加工品の製造方法
CN116727361A (zh) * 2023-08-16 2023-09-12 长园半导体设备(珠海)有限公司 去污装置及分选设备

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3232575B2 (ja) * 1990-10-16 2001-11-26 ソニー株式会社 半導体処理装置
US5427644A (en) * 1993-01-11 1995-06-27 Tokyo Seimitsu Co., Ltd. Method of manufacturing semiconductor wafer and system therefor
JP2917262B2 (ja) * 1993-01-11 1999-07-12 株式会社東京精密 半導体ウェーハの洗浄・乾燥装置
JP3116619B2 (ja) * 1993-01-11 2000-12-11 株式会社東京精密 半導体ウェーハの製造システム
JPH07171754A (ja) * 1993-12-20 1995-07-11 Disco Abrasive Syst Ltd 外観検査機能付きダイシング装置
JPH07240453A (ja) * 1994-02-28 1995-09-12 Seiko Seiki Co Ltd 半導体ウエハ加工装置
JPH07240452A (ja) * 1994-02-28 1995-09-12 Seiko Seiki Co Ltd 半導体ウエハ加工装置
JPH0831785A (ja) * 1994-07-12 1996-02-02 Sony Corp ウェーハの洗浄方法および装置
JP4339452B2 (ja) * 1999-07-09 2009-10-07 株式会社ディスコ Ｃｓｐ基板分割装置
JP2000232080A (ja) * 1999-02-10 2000-08-22 Disco Abrasive Syst Ltd 被加工物の分割システム及びペレットの移し替え装置
GB2370411B (en) * 2000-12-20 2003-08-13 Hanmi Co Ltd Handler system for cutting a semiconductor package device
JP3765265B2 (ja) * 2001-11-28 2006-04-12 株式会社東京精密 ダイシング装置
JP2003318137A (ja) * 2002-04-24 2003-11-07 Korea Semiconductor System Co Ltd 半導体パッケージの単数化方法
JP4315788B2 (ja) * 2003-11-26 2009-08-19 アピックヤマダ株式会社 半導体装置の製造方法及び製造装置

Also Published As

Publication number Publication date
CN100470758C (zh) 2009-03-18
EP1743368A1 (en) 2007-01-17
EP1743368A4 (en) 2009-01-28
WO2005109492A1 (en) 2005-11-17
JP2007536727A (ja) 2007-12-13
CN1954423A (zh) 2007-04-25

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