HK1029218A1 - Multi layer ceramic electronic parts and manufacturing method thereof. - Google Patents

Multi layer ceramic electronic parts and manufacturing method thereof.

Info

Publication number
HK1029218A1
HK1029218A1 HK00107640A HK00107640A HK1029218A1 HK 1029218 A1 HK1029218 A1 HK 1029218A1 HK 00107640 A HK00107640 A HK 00107640A HK 00107640 A HK00107640 A HK 00107640A HK 1029218 A1 HK1029218 A1 HK 1029218A1
Authority
HK
Hong Kong
Prior art keywords
manufacturing
electronic parts
ceramic electronic
layer ceramic
multi layer
Prior art date
Application number
HK00107640A
Other languages
English (en)
Inventor
Toshiya Nakamura
Original Assignee
Taiyo Yuden Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Yuden Kk filed Critical Taiyo Yuden Kk
Publication of HK1029218A1 publication Critical patent/HK1029218A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B18/00—Layered products essentially comprising ceramics, e.g. refractory products
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/43—Electric condenser making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/43—Electric condenser making
    • Y10T29/435—Solid dielectric type
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
HK00107640A 1999-03-29 2000-11-29 Multi layer ceramic electronic parts and manufacturing method thereof. HK1029218A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP8529099 1999-03-29
JP29500199A JP3535998B2 (ja) 1999-03-29 1999-10-18 積層セラミック電子部品

Publications (1)

Publication Number Publication Date
HK1029218A1 true HK1029218A1 (en) 2001-03-23

Family

ID=26426307

Family Applications (1)

Application Number Title Priority Date Filing Date
HK00107640A HK1029218A1 (en) 1999-03-29 2000-11-29 Multi layer ceramic electronic parts and manufacturing method thereof.

Country Status (7)

Country Link
US (2) US6349026B1 (xx)
JP (1) JP3535998B2 (xx)
KR (1) KR100585549B1 (xx)
CN (1) CN1197102C (xx)
HK (1) HK1029218A1 (xx)
MY (1) MY124033A (xx)
TW (1) TW452805B (xx)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3535998B2 (ja) * 1999-03-29 2004-06-07 太陽誘電株式会社 積層セラミック電子部品
JP3722275B2 (ja) * 2000-06-15 2005-11-30 Ｔｄｋ株式会社 金属粒子含有組成物、導電ペースト及びその製造方法
US7206187B2 (en) * 2004-08-23 2007-04-17 Kyocera Corporation Ceramic electronic component and its manufacturing method
JP5056485B2 (ja) * 2008-03-04 2012-10-24 株式会社村田製作所 積層型電子部品およびその製造方法
JP5463195B2 (ja) * 2010-04-22 2014-04-09 日本特殊陶業株式会社 セラミック電子部品及び配線基板
JP2012004189A (ja) * 2010-06-14 2012-01-05 Namics Corp 積層セラミックコンデンサ
JP5605053B2 (ja) * 2010-07-26 2014-10-15 株式会社村田製作所 積層セラミック電子部品の製造方法
JP5273122B2 (ja) * 2010-10-25 2013-08-28 Ｔｄｋ株式会社 電子部品及び電子部品の製造方法
KR20120073636A (ko) * 2010-12-27 2012-07-05 삼성전기주식회사 외부전극용 도전성 페이스트 조성물, 이를 포함하는 적층 세라믹 커패시터 및 그 제조방법
KR102089697B1 (ko) * 2014-04-30 2020-04-14 삼성전기주식회사 외부전극용 페이스트, 적층 세라믹 전자부품 및 그 제조방법
TWI629696B (zh) * 2015-06-04 2018-07-11 日商村田製作所股份有限公司 Laminated ceramic electronic parts
JP6477422B2 (ja) * 2015-10-30 2019-03-06 株式会社村田製作所 積層型電子部品およびその製造方法
JP2017098445A (ja) * 2015-11-26 2017-06-01 太陽誘電株式会社 セラミック電子部品及びセラミック電子部品の製造方法
KR101762032B1 (ko) * 2015-11-27 2017-07-26 삼성전기주식회사 적층 세라믹 전자부품 및 그 제조 방법
JP6996945B2 (ja) 2017-11-07 2022-01-17 太陽誘電株式会社 積層セラミックコンデンサ
JP7266969B2 (ja) * 2018-05-21 2023-05-01 太陽誘電株式会社 積層セラミック電子部品の製造方法
KR102703772B1 (ko) * 2018-08-06 2024-09-04 삼성전기주식회사 적층 세라믹 전자부품의 제조방법
JP7380619B2 (ja) * 2021-03-12 2023-11-15 株式会社村田製作所 積層セラミックコンデンサ
TWI762423B (zh) * 2021-09-29 2022-04-21 奇力新電子股份有限公司 電感元件

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2979892B2 (ja) * 1993-04-21 1999-11-15 株式会社村田製作所 電子部品
JPH0737753A (ja) * 1993-07-16 1995-02-07 Matsushita Electric Ind Co Ltd チップ型部品
JPH07201636A (ja) 1993-12-30 1995-08-04 Taiyo Yuden Co Ltd 積層電子部品及びその製造方法
JPH0864467A (ja) * 1994-08-25 1996-03-08 Kyocera Corp 複合セラミックコンデンサ
JP2850200B2 (ja) * 1994-10-28 1999-01-27 株式会社トーキン 積層セラミック電子部品
JPH08162359A (ja) * 1994-12-08 1996-06-21 Murata Mfg Co Ltd チップ型セラミック電子部品
JPH09260199A (ja) * 1996-03-25 1997-10-03 Taiyo Yuden Co Ltd 積層コンデンサ
JPH09260197A (ja) * 1996-03-26 1997-10-03 Taiyo Yuden Co Ltd 積層電子部品
JP2998639B2 (ja) * 1996-06-20 2000-01-11 株式会社村田製作所 積層セラミックコンデンサ
US6442813B1 (en) * 1996-07-25 2002-09-03 Murata Manufacturing Co., Ltd. Method of producing a monolithic ceramic capacitor
JP2000216046A (ja) * 1999-01-26 2000-08-04 Murata Mfg Co Ltd 積層セラミック電子部品
JP2000223351A (ja) * 1999-01-28 2000-08-11 Murata Mfg Co Ltd 積層セラミックコンデンサ
JP3535998B2 (ja) * 1999-03-29 2004-06-07 太陽誘電株式会社 積層セラミック電子部品
JP3596743B2 (ja) * 1999-08-19 2004-12-02 株式会社村田製作所 積層セラミック電子部品の製造方法及び積層セラミック電子部品

Also Published As

Publication number Publication date
CN1268757A (zh) 2000-10-04
US6785941B2 (en) 2004-09-07
KR20010006892A (ko) 2001-01-26
US20020039273A1 (en) 2002-04-04
MY124033A (en) 2006-06-30
JP3535998B2 (ja) 2004-06-07
TW452805B (en) 2001-09-01
CN1197102C (zh) 2005-04-13
US6349026B1 (en) 2002-02-19
JP2000348964A (ja) 2000-12-15
KR100585549B1 (ko) 2006-06-01

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20090329