MY124033A - Multi layer ceramic electronic parts having pillar-likeceramic portions - Google Patents
Multi layer ceramic electronic parts having pillar-likeceramic portionsInfo
- Publication number
- MY124033A MY124033A MYPI20001229A MYPI20001229A MY124033A MY 124033 A MY124033 A MY 124033A MY PI20001229 A MYPI20001229 A MY PI20001229A MY PI20001229 A MYPI20001229 A MY PI20001229A MY 124033 A MY124033 A MY 124033A
- Authority
- MY
- Malaysia
- Prior art keywords
- portions
- laminated body
- electronic parts
- ceramic
- ceramic electronic
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B18/00—Layered products essentially comprising ceramics, e.g. refractory products
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/42—Piezoelectric device making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/43—Electric condenser making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/43—Electric condenser making
- Y10T29/435—Solid dielectric type
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
Abstract
A MULTI LAYER CERAMIC ELECTRONIC PARTS, COMPRISES: A LAMINATED BODY (3) IN WHICH A CERAMIC LAYER (1a,1b) AND INTERNAL ELECTRODES (2a,2b) AND ARE LAMINATED ONE ANOTHER; AND EXTERNAL ELECTRODES (2,2) AND BEING PROVIDED AT END PORTIONS OF THE LAMINATED BODY (3),THE INTERNAL ELECTRODES AND REACH TO EITHER ONE OF AT LEAST A PAIR OF EDGES OF THE CERAMIC LAYER OPPOSE TO EACH OTHER, THEREBY LEADING OUT THE INTERNAL ELECTRODES (2a,2b) AND TO END SURFACES OF THE LAMINATED BODY (3) AND CONNECTING THE INTERNAL ELECTRODES (2,2).PILLAR-LIKE CERAMIC PORTIONS, BEING CONTINUOUS IN A DIRECTION OF THICKNESS OF A CONDUCTOR FILM (21) FORMING THE EXTERNAL ELECTRODES AND, ARE SCATTERED ON THE CONDUCTOR FILM. AND, THE CERAMIC PORTIONS (22) OF THE EXTERNAL ELECTRODES (2,2) ARE SO FORMED THAT THEY ARE CONTINUOUS FROM AN INNER SURFACE OF THE CONDUCTOR FILM OF THE EXTERNAL ELECTRODES (2,2) WHERE THEY CLOSELY CONTACT WITH A SURFACE ON THE LAMINATED BODY (3) UP TO AN UPPER SURFACE THEREOF. WITHIN THIS MULTI LAYER CERAMIC ELECTRONIC PARTS, THE CRACKS DUE TO HEAT-SHOCK CAN BE PREVENTED FROM OCCURING WITHIN THE LAMINATED BODY (3), AND ALSO THE PROPERTY IN SOLDERING OF THE EXTERNAL ELECTRODE AND CAN BE KEPT IN GOOD CONDITION.(FIG 2 (a) & (b) )
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8529099 | 1999-03-29 | ||
JP29500199A JP3535998B2 (en) | 1999-03-29 | 1999-10-18 | Multilayer ceramic electronic components |
Publications (1)
Publication Number | Publication Date |
---|---|
MY124033A true MY124033A (en) | 2006-06-30 |
Family
ID=26426307
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI20001229A MY124033A (en) | 1999-03-29 | 2000-03-28 | Multi layer ceramic electronic parts having pillar-likeceramic portions |
Country Status (7)
Country | Link |
---|---|
US (2) | US6349026B1 (en) |
JP (1) | JP3535998B2 (en) |
KR (1) | KR100585549B1 (en) |
CN (1) | CN1197102C (en) |
HK (1) | HK1029218A1 (en) |
MY (1) | MY124033A (en) |
TW (1) | TW452805B (en) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3535998B2 (en) * | 1999-03-29 | 2004-06-07 | 太陽誘電株式会社 | Multilayer ceramic electronic components |
JP3722275B2 (en) * | 2000-06-15 | 2005-11-30 | Tdk株式会社 | Metal particle-containing composition, conductive paste and method for producing the same |
US7206187B2 (en) * | 2004-08-23 | 2007-04-17 | Kyocera Corporation | Ceramic electronic component and its manufacturing method |
JP5056485B2 (en) * | 2008-03-04 | 2012-10-24 | 株式会社村田製作所 | Multilayer electronic component and manufacturing method thereof |
JP5463195B2 (en) * | 2010-04-22 | 2014-04-09 | 日本特殊陶業株式会社 | Ceramic electronic components and wiring boards |
JP2012004189A (en) * | 2010-06-14 | 2012-01-05 | Namics Corp | Multilayer ceramic capacitor |
JP5605053B2 (en) * | 2010-07-26 | 2014-10-15 | 株式会社村田製作所 | Manufacturing method of multilayer ceramic electronic component |
JP5273122B2 (en) * | 2010-10-25 | 2013-08-28 | Tdk株式会社 | Electronic component and method for manufacturing electronic component |
KR20120073636A (en) * | 2010-12-27 | 2012-07-05 | 삼성전기주식회사 | Paste compound for termination electrode and multilayer ceramic capacitor comprising the same and manufacturing method thereof |
KR102089697B1 (en) * | 2014-04-30 | 2020-04-14 | 삼성전기주식회사 | paste for external electrode, multilayer ceramic electronic component and method of manufacturing the same |
TWI629696B (en) | 2015-06-04 | 2018-07-11 | 日商村田製作所股份有限公司 | Laminated ceramic electronic parts |
JP6477422B2 (en) * | 2015-10-30 | 2019-03-06 | 株式会社村田製作所 | Multilayer electronic component and manufacturing method thereof |
JP2017098445A (en) * | 2015-11-26 | 2017-06-01 | 太陽誘電株式会社 | Ceramic electronic component and method of manufacturing ceramic electronic component |
KR101762032B1 (en) * | 2015-11-27 | 2017-07-26 | 삼성전기주식회사 | Multi-layer ceramic electronic part and method for manufacturing the same |
JP6996945B2 (en) | 2017-11-07 | 2022-01-17 | 太陽誘電株式会社 | Multilayer ceramic capacitors |
JP7266969B2 (en) * | 2018-05-21 | 2023-05-01 | 太陽誘電株式会社 | Manufacturing method for multilayer ceramic electronic component |
KR20190121138A (en) * | 2018-08-06 | 2019-10-25 | 삼성전기주식회사 | Method for manufacturing multi-layered ceramic electronic componentthe |
JP7380619B2 (en) * | 2021-03-12 | 2023-11-15 | 株式会社村田製作所 | multilayer ceramic capacitor |
TWI762423B (en) * | 2021-09-29 | 2022-04-21 | 奇力新電子股份有限公司 | Inductive device |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2979892B2 (en) * | 1993-04-21 | 1999-11-15 | 株式会社村田製作所 | Electronic components |
JPH0737753A (en) * | 1993-07-16 | 1995-02-07 | Matsushita Electric Ind Co Ltd | Chip type component |
JPH07201636A (en) | 1993-12-30 | 1995-08-04 | Taiyo Yuden Co Ltd | Multilayer electronic device and its production |
JPH0864467A (en) * | 1994-08-25 | 1996-03-08 | Kyocera Corp | Composite ceramic capacitor |
JP2850200B2 (en) * | 1994-10-28 | 1999-01-27 | 株式会社トーキン | Multilayer ceramic electronic components |
JPH08162359A (en) * | 1994-12-08 | 1996-06-21 | Murata Mfg Co Ltd | Chip type ceramic electronic part |
JPH09260199A (en) * | 1996-03-25 | 1997-10-03 | Taiyo Yuden Co Ltd | Multilayer capacitor |
JPH09260197A (en) * | 1996-03-26 | 1997-10-03 | Taiyo Yuden Co Ltd | Laminated electronic part |
JP2998639B2 (en) * | 1996-06-20 | 2000-01-11 | 株式会社村田製作所 | Multilayer ceramic capacitors |
US6442813B1 (en) * | 1996-07-25 | 2002-09-03 | Murata Manufacturing Co., Ltd. | Method of producing a monolithic ceramic capacitor |
JP2000216046A (en) * | 1999-01-26 | 2000-08-04 | Murata Mfg Co Ltd | Laminated ceramic electronic component |
JP2000223351A (en) * | 1999-01-28 | 2000-08-11 | Murata Mfg Co Ltd | Multilayer ceramic capable |
JP3535998B2 (en) * | 1999-03-29 | 2004-06-07 | 太陽誘電株式会社 | Multilayer ceramic electronic components |
JP3596743B2 (en) * | 1999-08-19 | 2004-12-02 | 株式会社村田製作所 | Manufacturing method of multilayer ceramic electronic component and multilayer ceramic electronic component |
-
1999
- 1999-10-18 JP JP29500199A patent/JP3535998B2/en not_active Expired - Fee Related
-
2000
- 2000-03-06 TW TW089103982A patent/TW452805B/en not_active IP Right Cessation
- 2000-03-28 US US09/536,547 patent/US6349026B1/en not_active Expired - Fee Related
- 2000-03-28 KR KR1020000015827A patent/KR100585549B1/en not_active IP Right Cessation
- 2000-03-28 MY MYPI20001229A patent/MY124033A/en unknown
- 2000-03-29 CN CNB001052055A patent/CN1197102C/en not_active Expired - Fee Related
- 2000-11-29 HK HK00107640A patent/HK1029218A1/en not_active IP Right Cessation
-
2001
- 2001-11-08 US US10/008,874 patent/US6785941B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN1268757A (en) | 2000-10-04 |
US20020039273A1 (en) | 2002-04-04 |
US6349026B1 (en) | 2002-02-19 |
JP3535998B2 (en) | 2004-06-07 |
HK1029218A1 (en) | 2001-03-23 |
KR100585549B1 (en) | 2006-06-01 |
JP2000348964A (en) | 2000-12-15 |
KR20010006892A (en) | 2001-01-26 |
US6785941B2 (en) | 2004-09-07 |
TW452805B (en) | 2001-09-01 |
CN1197102C (en) | 2005-04-13 |
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