HK1015531A1 - A semiconductor device and a substrate. - Google Patents

A semiconductor device and a substrate.

Info

Publication number
HK1015531A1
HK1015531A1 HK99100360A HK99100360A HK1015531A1 HK 1015531 A1 HK1015531 A1 HK 1015531A1 HK 99100360 A HK99100360 A HK 99100360A HK 99100360 A HK99100360 A HK 99100360A HK 1015531 A1 HK1015531 A1 HK 1015531A1
Authority
HK
Hong Kong
Prior art keywords
substrate
semiconductor device
semiconductor
Prior art date
Application number
HK99100360A
Other languages
English (en)
Inventor
Yasuhide Ohashi
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Publication of HK1015531A1 publication Critical patent/HK1015531A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/494—Connecting portions
    • H01L2224/4943—Connecting portions the connecting portions being staggered
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Thermistors And Varistors (AREA)
HK99100360A 1997-02-27 1999-01-28 A semiconductor device and a substrate. HK1015531A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP4439197 1997-02-27
JP28216997A JP3577913B2 (ja) 1997-02-27 1997-10-15 半導体装置、およびこれを具備する電子機器

Publications (1)

Publication Number Publication Date
HK1015531A1 true HK1015531A1 (en) 1999-10-15

Family

ID=26384287

Family Applications (1)

Application Number Title Priority Date Filing Date
HK99100360A HK1015531A1 (en) 1997-02-27 1999-01-28 A semiconductor device and a substrate.

Country Status (7)

Country Link
US (1) US6608368B2 (ja)
JP (1) JP3577913B2 (ja)
KR (1) KR100505837B1 (ja)
CN (1) CN1171307C (ja)
HK (1) HK1015531A1 (ja)
SG (1) SG65738A1 (ja)
TW (1) TW462099B (ja)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7157790B2 (en) * 2002-07-31 2007-01-02 Microchip Technology Inc. Single die stitch bonding
US7326594B2 (en) * 2002-07-31 2008-02-05 Microchip Technology Incorporated Connecting a plurality of bond pads and/or inner leads with a single bond wire
WO2004029858A1 (en) * 2002-09-25 2004-04-08 Koninklijke Philips Electronics N.V. Connector for chip-card
JP4177233B2 (ja) * 2003-01-28 2008-11-05 富士通メディアデバイス株式会社 弾性表面波デバイス及びその製造方法
EP1487015B1 (en) * 2003-06-10 2011-05-04 STMicroelectronics Srl Semiconductor electronic device and method of manufacturing thereof
KR100574954B1 (ko) * 2003-11-15 2006-04-28 삼성전자주식회사 중앙부 패드와 재 배선된 패드에서 와이어 본딩된집적회로 칩패키지
JP4628687B2 (ja) * 2004-03-09 2011-02-09 ルネサスエレクトロニクス株式会社 半導体装置
JP4013071B2 (ja) * 2004-09-06 2007-11-28 セイコーエプソン株式会社 半導体装置
KR100987479B1 (ko) * 2005-12-19 2010-10-13 삼성전자주식회사 반도체 칩 및 이를 이용한 반도체 칩 패키지
JP4540697B2 (ja) 2007-08-31 2010-09-08 Ｏｋｉセミコンダクタ株式会社 半導体装置
JP4472737B2 (ja) * 2007-08-31 2010-06-02 Ｏｋｉセミコンダクタ株式会社 半導体装置、半導体素子及び基板
KR100951667B1 (ko) * 2008-08-19 2010-04-07 주식회사 하이닉스반도체 패드를 포함하는 반도체 메모리 장치
KR101680115B1 (ko) * 2010-02-26 2016-11-29 삼성전자 주식회사 반도체칩, 필름 및 그를 포함하는 탭 패키지
KR101367090B1 (ko) * 2011-12-28 2014-02-25 주식회사 실리콘웍스 소스드라이버 집적회로 및 상기 소스드라이버 집적회로를 구비하는 디스플레이 장치
KR102232435B1 (ko) * 2014-02-12 2021-03-29 삼성디스플레이 주식회사 구동 칩 및 이를 포함하는 표시 장치
WO2016159320A1 (ja) * 2015-03-31 2016-10-06 浜松ホトニクス株式会社 半導体装置及びその製造方法
CN105575947B (zh) * 2015-12-31 2019-05-10 上海天马微电子有限公司 一种显示基板、显示装置以及显示装置的身份识别方法

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5735361A (en) 1980-08-12 1982-02-25 Nec Corp Film carrier lead
JPS5939930A (ja) 1982-08-27 1984-03-05 Nissan Motor Co Ltd タ−ボチヤ−ジヤ
JPS601968A (ja) 1983-06-17 1985-01-08 Matsushita Electric Ind Co Ltd 半導体装置
JPS6318335A (ja) 1986-07-10 1988-01-26 Tokuyama Soda Co Ltd エレクトロクロミツクデイスプレイ素子
US4801999A (en) * 1987-07-15 1989-01-31 Advanced Micro Devices, Inc. Integrated circuit lead frame assembly containing voltage bussing and distribution to an integrated circuit die using tape automated bonding with two metal layers
US4967261A (en) * 1987-07-30 1990-10-30 Mitsubishi Denki Kabushiki Kaisha Tape carrier for assembling an IC chip on a substrate
JPH01289276A (ja) * 1988-05-17 1989-11-21 Mitsubishi Electric Corp 半導体装置
JP2567961B2 (ja) * 1989-12-01 1996-12-25 株式会社日立製作所 半導体装置及びリ−ドフレ−ム
JP3293135B2 (ja) * 1990-04-24 2002-06-17 セイコーエプソン株式会社 回路セル・アレイを備えた半導体装置
KR930003275B1 (ko) * 1990-05-03 1993-04-24 삼성전자 주식회사 고해상도를 위한 감열 기록소자
JPH04287936A (ja) * 1991-01-10 1992-10-13 Nec Corp 半導体集積回路
JP2518569B2 (ja) 1991-09-19 1996-07-24 三菱電機株式会社 半導体装置
JP2509422B2 (ja) * 1991-10-30 1996-06-19 三菱電機株式会社 半導体装置及びその製造方法
US5212402A (en) * 1992-02-14 1993-05-18 Motorola, Inc. Semiconductor device with integral decoupling capacitor
JPH06140535A (ja) * 1992-10-27 1994-05-20 Mitsubishi Electric Corp テープキャリアパッケージ型半導体装置
JPH06244240A (ja) * 1993-02-19 1994-09-02 Texas Instr Japan Ltd 半導体装置
JPH077037A (ja) * 1993-06-16 1995-01-10 Hitachi Ltd 半導体集積回路装置
JP3228846B2 (ja) 1995-02-20 2001-11-12 アルプス電気株式会社 フィルムキャリアの電極パターン
JPH08316270A (ja) * 1995-05-23 1996-11-29 Hitachi Ltd テープキャリアおよびそれを用いた半導体装置
JP3383475B2 (ja) 1995-06-12 2003-03-04 株式会社日立製作所 半導体装置およびその製造に用いるリードフレーム
JP2663928B2 (ja) * 1995-08-30 1997-10-15 日本電気株式会社 Ｔａｂテープ及びｔａｂテープを用いた半導体装置

Also Published As

Publication number Publication date
KR100505837B1 (ko) 2005-11-11
SG65738A1 (en) 1999-06-22
JP3577913B2 (ja) 2004-10-20
US20020020899A1 (en) 2002-02-21
KR19980071873A (ko) 1998-10-26
CN1192578A (zh) 1998-09-09
CN1171307C (zh) 2004-10-13
JPH10303246A (ja) 1998-11-13
US6608368B2 (en) 2003-08-19
TW462099B (en) 2001-11-01

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20100227