HK1004184A1 - Ducted opposing bonded fin heat sink blower multi-microprocessor cooling system. - Google Patents

Ducted opposing bonded fin heat sink blower multi-microprocessor cooling system.

Info

Publication number
HK1004184A1
HK1004184A1 HK98103488A HK98103488A HK1004184A1 HK 1004184 A1 HK1004184 A1 HK 1004184A1 HK 98103488 A HK98103488 A HK 98103488A HK 98103488 A HK98103488 A HK 98103488A HK 1004184 A1 HK1004184 A1 HK 1004184A1
Authority
HK
Hong Kong
Prior art keywords
ducted
heat sink
cooling system
fin heat
microprocessor cooling
Prior art date
Application number
HK98103488A
Other languages
English (en)
Inventor
Daryl J Nelson
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Publication of HK1004184A1 publication Critical patent/HK1004184A1/xx

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
HK98103488A 1994-06-30 1998-04-24 Ducted opposing bonded fin heat sink blower multi-microprocessor cooling system. HK1004184A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US26943194A 1994-06-30 1994-06-30
PCT/US1995/006769 WO1996001035A1 (fr) 1994-06-30 1995-05-25 Systeme de refroidissement de microprocesseurs comportant une soufflerie et un dissipateur thermique pourvu de conduits et d'ailettes incorporees et opposees

Publications (1)

Publication Number Publication Date
HK1004184A1 true HK1004184A1 (en) 1998-11-20

Family

ID=23027217

Family Applications (1)

Application Number Title Priority Date Filing Date
HK98103488A HK1004184A1 (en) 1994-06-30 1998-04-24 Ducted opposing bonded fin heat sink blower multi-microprocessor cooling system.

Country Status (10)

Country Link
US (1) US5912802A (fr)
EP (1) EP0803173B1 (fr)
JP (1) JPH10502217A (fr)
CN (1) CN1095318C (fr)
AU (1) AU2605595A (fr)
BR (1) BR9508153A (fr)
DE (1) DE69533338T2 (fr)
HK (1) HK1004184A1 (fr)
TW (1) TW265430B (fr)
WO (1) WO1996001035A1 (fr)

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Also Published As

Publication number Publication date
EP0803173A4 (fr) 1997-12-10
CN1155370A (zh) 1997-07-23
BR9508153A (pt) 1997-12-23
US5912802A (en) 1999-06-15
DE69533338T2 (de) 2005-09-08
TW265430B (en) 1995-12-11
AU2605595A (en) 1996-01-25
EP0803173B1 (fr) 2004-08-04
DE69533338D1 (de) 2004-09-09
CN1095318C (zh) 2002-11-27
JPH10502217A (ja) 1998-02-24
WO1996001035A1 (fr) 1996-01-11
EP0803173A1 (fr) 1997-10-29

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20100525