JP4265505B2 - 電子機器の放熱構造 - Google Patents
電子機器の放熱構造 Download PDFInfo
- Publication number
- JP4265505B2 JP4265505B2 JP2004232651A JP2004232651A JP4265505B2 JP 4265505 B2 JP4265505 B2 JP 4265505B2 JP 2004232651 A JP2004232651 A JP 2004232651A JP 2004232651 A JP2004232651 A JP 2004232651A JP 4265505 B2 JP4265505 B2 JP 4265505B2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- duct
- housing
- heat sink
- electronic device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000017525 heat dissipation Effects 0.000 title claims description 17
- 238000001816 cooling Methods 0.000 claims description 20
- 238000005192 partition Methods 0.000 claims description 7
- 230000005855 radiation Effects 0.000 claims description 7
- 206010037660 Pyrexia Diseases 0.000 claims description 2
- 238000007599 discharging Methods 0.000 claims description 2
- 239000000428 dust Substances 0.000 description 9
- 230000000694 effects Effects 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20909—Forced ventilation, e.g. on heat dissipaters coupled to components
- H05K7/20918—Forced ventilation, e.g. on heat dissipaters coupled to components the components being isolated from air flow, e.g. hollow heat sinks, wind tunnels or funnels
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
1d 電子部品収容室
3 プリント基板
4 電子部品
5 ダクト
6 吸気孔
7 排気孔
8 冷却ファン
10 ヒートシンク
10a 筒状部
10b 通路
10c 放熱フィン
12 発熱部品
Claims (1)
- 内部に設けられた電子部品収容室内に発熱部品が収容された筐体と、前記発熱部品から発生する熱を放熱するヒートシンクとを備えた電子機器の放熱構造であって、前記電子部品収容室の左右と上部の3辺を囲むように仕切り壁を設けて、前記筐体の両側板及び上面板と前記仕切り壁の間に形成された気密構造のダクトと、前記ダクトの一方の側板の下部に形成されて前記ダクト内に外気を吸入する吸気孔と、前記ダクトの他方の側板の下部に形成されて前記ダクト内の空気を排出する排気孔と、前記ダクトの途中に設けられた冷却ファンと、前記ダクト内に設けられ、かつ内部が放熱フィンにより複数の通路に区画された多角筒状のヒートシンクとを備え、前記ヒートシンクの外側面に前記発熱部品を取り付けたことを特徴とする電子機器の放熱構造。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004232651A JP4265505B2 (ja) | 2004-08-09 | 2004-08-09 | 電子機器の放熱構造 |
ES05016792T ES2361631T3 (es) | 2004-08-09 | 2005-08-02 | Estructura termoradiante para un equipo electrónico. |
EP20050016792 EP1628514B1 (en) | 2004-08-09 | 2005-08-02 | Heat radiating structure for electronic equipment |
TW94126653A TWI264991B (en) | 2004-08-09 | 2005-08-08 | Heat dissipation structure of electronic device |
CN 200510089763 CN1735330B (zh) | 2004-08-09 | 2005-08-09 | 电子设备的散热结构 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004232651A JP4265505B2 (ja) | 2004-08-09 | 2004-08-09 | 電子機器の放熱構造 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006054215A JP2006054215A (ja) | 2006-02-23 |
JP4265505B2 true JP4265505B2 (ja) | 2009-05-20 |
Family
ID=35427995
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004232651A Expired - Fee Related JP4265505B2 (ja) | 2004-08-09 | 2004-08-09 | 電子機器の放熱構造 |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP1628514B1 (ja) |
JP (1) | JP4265505B2 (ja) |
CN (1) | CN1735330B (ja) |
ES (1) | ES2361631T3 (ja) |
TW (1) | TWI264991B (ja) |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080174960A1 (en) * | 2007-01-22 | 2008-07-24 | Themis Computer | Clamshell enclosure for electronic circuit assemblies |
FI121949B (fi) * | 2007-04-23 | 2011-06-15 | Epec Oy | Menetelmä ja järjestely laitekotelon jäähdyttämiseksi |
CN102742374B (zh) * | 2008-02-06 | 2014-11-26 | 松下电器产业株式会社 | 电气设备 |
WO2010064299A1 (ja) * | 2008-12-02 | 2010-06-10 | 株式会社日立製作所 | 演算処理装置 |
EP2424054A4 (en) * | 2009-04-20 | 2014-04-02 | Mitsubishi Electric Corp | HOUSING UNIT OF AN ELECTRONIC APPARATUS |
IT1394746B1 (it) * | 2009-07-14 | 2012-07-13 | Infor System S R L | Sistema per l installazione di moduli fotovoltaici in condizioni di sicurezza elettrica e relativo metodo di installazione. |
JP4693925B2 (ja) | 2009-09-30 | 2011-06-01 | 株式会社東芝 | 電子機器 |
JP5706149B2 (ja) | 2010-02-26 | 2015-04-22 | パナソニックIpマネジメント株式会社 | 電気装置 |
JP2011188671A (ja) * | 2010-03-10 | 2011-09-22 | Daihen Corp | 電源装置 |
JP2011192809A (ja) | 2010-03-15 | 2011-09-29 | Omron Corp | パワーコンディショナー装置およびこの装置に使用するモジュール基板構造 |
US8472194B2 (en) * | 2010-05-05 | 2013-06-25 | Custom Sensors & Technologies, Inc. | Solid state switching device with integral heatsink |
JP5747633B2 (ja) * | 2010-08-02 | 2015-07-15 | 富士電機株式会社 | 電子機器 |
JP5496018B2 (ja) * | 2010-08-20 | 2014-05-21 | 株式会社日立国際電気 | 多段積電子装置用冷却装置 |
JP5127902B2 (ja) * | 2010-09-21 | 2013-01-23 | レノボ・シンガポール・プライベート・リミテッド | 電子機器の放熱装置および電子機器 |
WO2012144538A1 (ja) * | 2011-04-18 | 2012-10-26 | 株式会社ソニー・コンピュータエンタテインメント | 電子機器 |
JP5684047B2 (ja) * | 2011-05-23 | 2015-03-11 | 株式会社三社電機製作所 | 電気装置 |
GB2503407B (en) * | 2011-10-10 | 2015-12-09 | Control Tech Ltd | Barrier device |
JP5515129B1 (ja) * | 2013-05-23 | 2014-06-11 | 山佐株式会社 | 遊技機の基板ケース及び遊技機 |
EP2879476B1 (en) * | 2013-11-29 | 2016-06-29 | ABB Technology Oy | Electric apparatus |
CN104765432A (zh) * | 2014-01-02 | 2015-07-08 | 鸿富锦精密电子(天津)有限公司 | 服务器组合 |
JP6116519B2 (ja) * | 2014-05-02 | 2017-04-19 | 三菱電機株式会社 | 増幅装置 |
JP6595781B2 (ja) * | 2015-03-19 | 2019-10-23 | 株式会社エンビジョンAescジャパン | ポータブル電源装置 |
JP2018160552A (ja) * | 2017-03-23 | 2018-10-11 | 新電元工業株式会社 | 放熱構造 |
JP6269882B1 (ja) * | 2017-03-31 | 2018-01-31 | 富士電機株式会社 | 屋外盤 |
CN110636737A (zh) * | 2018-06-25 | 2019-12-31 | 中兴通讯股份有限公司 | 通信设备的散热装置 |
KR102671866B1 (ko) | 2019-01-17 | 2024-05-31 | 엘에스일렉트릭(주) | 인버터용 방열모듈 |
CN112449559B (zh) * | 2020-11-27 | 2024-09-17 | 佛山市青松科技股份有限公司 | 一种户外led显示屏散热器 |
CN112911851A (zh) * | 2020-12-28 | 2021-06-04 | 青岛鼎信通讯股份有限公司 | 一种通风良好的分布式有源不平衡补偿装置的户外机箱 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4520425A (en) * | 1982-08-12 | 1985-05-28 | Mitsubishi Denki Kabushiki Kaisha | Control apparatus with improved structure for cooling circuit elements |
DE68920513T2 (de) * | 1988-08-31 | 1995-05-04 | Hitachi Ltd | Wechselrichtervorrichtung. |
DE4015030C1 (ja) * | 1990-05-10 | 1991-11-21 | Bicc-Vero Elektronics Gmbh, 2800 Bremen, De | |
TW265430B (en) * | 1994-06-30 | 1995-12-11 | Intel Corp | Ducted opposing bonded fin heat sink blower multi-microprocessor cooling system |
DE20016013U1 (de) * | 2000-09-15 | 2001-11-08 | Siemens AG, 80333 München | Schaltschrank mit verbesserter Wärmeabführung |
-
2004
- 2004-08-09 JP JP2004232651A patent/JP4265505B2/ja not_active Expired - Fee Related
-
2005
- 2005-08-02 EP EP20050016792 patent/EP1628514B1/en not_active Not-in-force
- 2005-08-02 ES ES05016792T patent/ES2361631T3/es active Active
- 2005-08-08 TW TW94126653A patent/TWI264991B/zh not_active IP Right Cessation
- 2005-08-09 CN CN 200510089763 patent/CN1735330B/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN1735330A (zh) | 2006-02-15 |
TW200614907A (en) | 2006-05-01 |
EP1628514A3 (en) | 2008-07-23 |
CN1735330B (zh) | 2010-12-29 |
ES2361631T3 (es) | 2011-06-20 |
EP1628514B1 (en) | 2011-05-11 |
JP2006054215A (ja) | 2006-02-23 |
TWI264991B (en) | 2006-10-21 |
EP1628514A2 (en) | 2006-02-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4265505B2 (ja) | 電子機器の放熱構造 | |
US6411514B1 (en) | Power inverter with heat dissipating assembly | |
KR101694570B1 (ko) | 전자 장치용 수동 냉각식 인클로저 시스템 및 방법 | |
JP4655987B2 (ja) | 電子機器 | |
JP2008103576A (ja) | モータ制御装置 | |
JP2012119588A (ja) | 冷却機能付き制御装置 | |
US6215660B1 (en) | Electronic appliance with a thermoelectric heat-dissipating apparatus | |
JP4155234B2 (ja) | アーク溶接制御装置 | |
JP4720688B2 (ja) | 電子制御装置の冷却装置 | |
JP4093479B2 (ja) | 電源装置 | |
JP2000232288A (ja) | 電力変換装置 | |
WO2016185613A1 (ja) | 電子機器 | |
JP6570293B2 (ja) | 盤用冷却装置 | |
TWI527360B (zh) | Motor drive | |
CN107000102B (zh) | 焊接装置 | |
JP2003008274A (ja) | 電子機器装置 | |
CN219329947U (zh) | 一种风冷式电源 | |
JP2004140276A (ja) | 制御盤 | |
CN214315065U (zh) | 一种便携式快速散热的变频器 | |
JP2001044679A (ja) | 冷却ユニット | |
CN216310495U (zh) | 灯光设备 | |
CN217880228U (zh) | 一种用于计算机外部散热的装置 | |
JP4859765B2 (ja) | 電子機器の冷却構造 | |
TWI847698B (zh) | 太陽光逆變器散熱組裝結構 | |
CN216595838U (zh) | 一种灯光设备 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20060828 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20081008 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20081014 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20081107 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20090127 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20090209 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 4265505 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120227 Year of fee payment: 3 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120227 Year of fee payment: 3 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130227 Year of fee payment: 4 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140227 Year of fee payment: 5 |
|
LAPS | Cancellation because of no payment of annual fees |