TWI264991B - Heat dissipation structure of electronic device - Google Patents

Heat dissipation structure of electronic device

Info

Publication number
TWI264991B
TWI264991B TW94126653A TW94126653A TWI264991B TW I264991 B TWI264991 B TW I264991B TW 94126653 A TW94126653 A TW 94126653A TW 94126653 A TW94126653 A TW 94126653A TW I264991 B TWI264991 B TW I264991B
Authority
TW
Taiwan
Prior art keywords
duct
heat
heat dissipation
dissipation structure
sink
Prior art date
Application number
TW94126653A
Other languages
English (en)
Other versions
TW200614907A (en
Inventor
Tadahiko Ogawa
Seiji Oka
Original Assignee
Omron Tateisi Electronics Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omron Tateisi Electronics Co filed Critical Omron Tateisi Electronics Co
Publication of TW200614907A publication Critical patent/TW200614907A/zh
Application granted granted Critical
Publication of TWI264991B publication Critical patent/TWI264991B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20909—Forced ventilation, e.g. on heat dissipaters coupled to components
    • H05K7/20918—Forced ventilation, e.g. on heat dissipaters coupled to components the components being isolated from air flow, e.g. hollow heat sinks, wind tunnels or funnels
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
TW94126653A 2004-08-09 2005-08-08 Heat dissipation structure of electronic device TWI264991B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004232651A JP4265505B2 (ja) 2004-08-09 2004-08-09 電子機器の放熱構造

Publications (2)

Publication Number Publication Date
TW200614907A TW200614907A (en) 2006-05-01
TWI264991B true TWI264991B (en) 2006-10-21

Family

ID=35427995

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94126653A TWI264991B (en) 2004-08-09 2005-08-08 Heat dissipation structure of electronic device

Country Status (5)

Country Link
EP (1) EP1628514B1 (zh)
JP (1) JP4265505B2 (zh)
CN (1) CN1735330B (zh)
ES (1) ES2361631T3 (zh)
TW (1) TWI264991B (zh)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080174960A1 (en) * 2007-01-22 2008-07-24 Themis Computer Clamshell enclosure for electronic circuit assemblies
FI121949B (fi) * 2007-04-23 2011-06-15 Epec Oy Menetelmä ja järjestely laitekotelon jäähdyttämiseksi
US8289708B2 (en) * 2008-02-06 2012-10-16 Panasonic Corporation Electric equipment
WO2010064299A1 (ja) * 2008-12-02 2010-06-10 株式会社日立製作所 演算処理装置
JP5000013B2 (ja) * 2009-04-20 2012-08-15 三菱電機株式会社 電子機器収容ユニット
IT1394746B1 (it) * 2009-07-14 2012-07-13 Infor System S R L Sistema per l installazione di moduli fotovoltaici in condizioni di sicurezza elettrica e relativo metodo di installazione.
JP4693925B2 (ja) 2009-09-30 2011-06-01 株式会社東芝 電子機器
JP5706149B2 (ja) 2010-02-26 2015-04-22 パナソニックＩｐマネジメント株式会社 電気装置
JP2011188671A (ja) * 2010-03-10 2011-09-22 Daihen Corp 電源装置
JP2011192809A (ja) 2010-03-15 2011-09-29 Omron Corp パワーコンディショナー装置およびこの装置に使用するモジュール基板構造
US8472194B2 (en) * 2010-05-05 2013-06-25 Custom Sensors & Technologies, Inc. Solid state switching device with integral heatsink
JP5747633B2 (ja) * 2010-08-02 2015-07-15 富士電機株式会社 電子機器
JP5496018B2 (ja) * 2010-08-20 2014-05-21 株式会社日立国際電気 多段積電子装置用冷却装置
JP5127902B2 (ja) * 2010-09-21 2013-01-23 レノボ・シンガポール・プライベート・リミテッド 電子機器の放熱装置および電子機器
US9756761B2 (en) 2011-04-18 2017-09-05 Sony Corporation Electronic apparatus
JP5684047B2 (ja) * 2011-05-23 2015-03-11 株式会社三社電機製作所 電気装置
GB2503407B (en) * 2011-10-10 2015-12-09 Control Tech Ltd Barrier device
JP5515129B1 (ja) * 2013-05-23 2014-06-11 山佐株式会社 遊技機の基板ケース及び遊技機
EP2879476B1 (en) * 2013-11-29 2016-06-29 ABB Technology Oy Electric apparatus
CN104765432A (zh) * 2014-01-02 2015-07-08 鸿富锦精密电子(天津)有限公司 服务器组合
JP6116519B2 (ja) * 2014-05-02 2017-04-19 三菱電機株式会社 増幅装置
JP6595781B2 (ja) * 2015-03-19 2019-10-23 株式会社エンビジョンＡｅｓｃジャパン ポータブル電源装置
JP2018160552A (ja) * 2017-03-23 2018-10-11 新電元工業株式会社 放熱構造
JP6269882B1 (ja) * 2017-03-31 2018-01-31 富士電機株式会社 屋外盤
CN110636737A (zh) * 2018-06-25 2019-12-31 中兴通讯股份有限公司 通信设备的散热装置
KR102671866B1 (ko) 2019-01-17 2024-05-31 엘에스일렉트릭(주) 인버터용 방열모듈
CN112449559B (zh) * 2020-11-27 2024-09-17 佛山市青松科技股份有限公司 一种户外led显示屏散热器
CN112911851A (zh) * 2020-12-28 2021-06-04 青岛鼎信通讯股份有限公司 一种通风良好的分布式有源不平衡补偿装置的户外机箱

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4520425A (en) * 1982-08-12 1985-05-28 Mitsubishi Denki Kabushiki Kaisha Control apparatus with improved structure for cooling circuit elements
KR920005988B1 (ko) * 1988-08-31 1992-07-25 가부시기가이샤 히다찌세이사꾸쇼 인버터장치
DE4015030C1 (zh) * 1990-05-10 1991-11-21 Bicc-Vero Elektronics Gmbh, 2800 Bremen, De
TW265430B (en) * 1994-06-30 1995-12-11 Intel Corp Ducted opposing bonded fin heat sink blower multi-microprocessor cooling system
DE20016013U1 (de) * 2000-09-15 2001-11-08 Siemens AG, 80333 München Schaltschrank mit verbesserter Wärmeabführung

Also Published As

Publication number Publication date
EP1628514A2 (en) 2006-02-22
EP1628514B1 (en) 2011-05-11
EP1628514A3 (en) 2008-07-23
JP2006054215A (ja) 2006-02-23
TW200614907A (en) 2006-05-01
CN1735330A (zh) 2006-02-15
ES2361631T3 (es) 2011-06-20
JP4265505B2 (ja) 2009-05-20
CN1735330B (zh) 2010-12-29

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees