GB1526638A - Semiconductor integrated circuits - Google Patents

Semiconductor integrated circuits

Info

Publication number
GB1526638A
GB1526638A GB24255/77A GB2425577A GB1526638A GB 1526638 A GB1526638 A GB 1526638A GB 24255/77 A GB24255/77 A GB 24255/77A GB 2425577 A GB2425577 A GB 2425577A GB 1526638 A GB1526638 A GB 1526638A
Authority
GB
United Kingdom
Prior art keywords
openings
portions
exposed
etched
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB24255/77A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of GB1526638A publication Critical patent/GB1526638A/en
Expired legal-status Critical Current

Links

Classifications

    • H10W20/082—
    • H10P76/202—
    • H10W20/058—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10S156/918—Delaminating processes adapted for specified product, e.g. delaminating medical specimen slide
    • Y10S156/919—Delaminating in preparation for post processing recycling step
    • Y10S156/922—Specified electronic component delaminating in preparation for recycling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Weting (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
GB24255/77A 1976-06-30 1977-06-09 Semiconductor integrated circuits Expired GB1526638A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/701,068 US4040891A (en) 1976-06-30 1976-06-30 Etching process utilizing the same positive photoresist layer for two etching steps

Publications (1)

Publication Number Publication Date
GB1526638A true GB1526638A (en) 1978-09-27

Family

ID=24815952

Family Applications (1)

Application Number Title Priority Date Filing Date
GB24255/77A Expired GB1526638A (en) 1976-06-30 1977-06-09 Semiconductor integrated circuits

Country Status (11)

Country Link
US (1) US4040891A (cg-RX-API-DMAC10.html)
JP (1) JPS533773A (cg-RX-API-DMAC10.html)
BE (1) BE855161A (cg-RX-API-DMAC10.html)
BR (1) BR7704380A (cg-RX-API-DMAC10.html)
CA (1) CA1095310A (cg-RX-API-DMAC10.html)
CH (1) CH614070A5 (cg-RX-API-DMAC10.html)
DE (1) DE2723944C2 (cg-RX-API-DMAC10.html)
FR (1) FR2357068A1 (cg-RX-API-DMAC10.html)
GB (1) GB1526638A (cg-RX-API-DMAC10.html)
IT (1) IT1115668B (cg-RX-API-DMAC10.html)
NL (1) NL7706107A (cg-RX-API-DMAC10.html)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2626516A1 (de) * 1976-06-14 1977-12-22 Siemens Ag Verfahren zum herstellen von lichtleiterstrukturen mit dazwischenliegenden elektroden
US4246595A (en) * 1977-03-08 1981-01-20 Matsushita Electric Industrial Co., Ltd. Electronics circuit device and method of making the same
US4131497A (en) * 1977-07-12 1978-12-26 International Business Machines Corporation Method of manufacturing self-aligned semiconductor devices
US4202914A (en) * 1978-12-29 1980-05-13 International Business Machines Corporation Method of depositing thin films of small dimensions utilizing silicon nitride lift-off mask
US4251318A (en) * 1979-06-29 1981-02-17 Hutchinson Industrial Corporation Method of making fully etched type-carrier elements
JPS5626450A (en) * 1979-08-13 1981-03-14 Hitachi Ltd Manufacture of semiconductor device
US4251621A (en) * 1979-11-13 1981-02-17 Bell Telephone Laboratories, Incorporated Selective metal etching of two gold alloys on common surface for semiconductor contacts
US4320190A (en) * 1979-12-18 1982-03-16 Ebauches S.A. Method of manufacturing the substrate of an electrochromic display cell
US4307179A (en) * 1980-07-03 1981-12-22 International Business Machines Corporation Planar metal interconnection system and process
US4397079A (en) * 1981-03-30 1983-08-09 International Business Machines Corp. Process for improving the yield of integrated devices including Schottky barrier diodes
US4472240A (en) * 1981-08-21 1984-09-18 Tokyo Shibaura Denki Kabushiki Kaisha Method for manufacturing semiconductor device
US4377633A (en) * 1981-08-24 1983-03-22 International Business Machines Corporation Methods of simultaneous contact and metal lithography patterning
US4398964A (en) * 1981-12-10 1983-08-16 Signetics Corporation Method of forming ion implants self-aligned with a cut
US4466849A (en) * 1982-02-24 1984-08-21 Ers Engineering Corporation Process for removing adhesive tape
US4430365A (en) 1982-07-22 1984-02-07 International Business Machines Corporation Method for forming conductive lines and vias
US4508815A (en) * 1983-11-03 1985-04-02 Mostek Corporation Recessed metallization
US5059454A (en) * 1989-04-26 1991-10-22 Flex Products, Inc. Method for making patterned thin film
US4957592A (en) * 1989-12-27 1990-09-18 Xerox Corporation Method of using erodable masks to produce partially etched structures in ODE wafer structures
US5126006A (en) * 1990-10-30 1992-06-30 International Business Machines Corp. Plural level chip masking
US5213916A (en) * 1990-10-30 1993-05-25 International Business Machines Corporation Method of making a gray level mask
US5240878A (en) * 1991-04-26 1993-08-31 International Business Machines Corporation Method for forming patterned films on a substrate
JP2000199827A (ja) * 1998-10-27 2000-07-18 Sony Corp 光導波装置およびその製造方法
US6372647B1 (en) 1999-12-14 2002-04-16 International Business Machines Corporation Via masked line first dual damascene
US6569763B1 (en) * 2002-04-09 2003-05-27 Northrop Grumman Corporation Method to separate a metal film from an insulating film in a semiconductor device using adhesive tape
US20070037386A1 (en) * 2005-08-13 2007-02-15 Williams John L Sloped thin film substrate edges

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE506677A (cg-RX-API-DMAC10.html) * 1950-10-31
NL130926C (cg-RX-API-DMAC10.html) * 1959-09-04
GB1048424A (en) * 1963-08-28 1966-11-16 Int Standard Electric Corp Improvements in or relating to semiconductor devices
FR1064185A (fr) * 1967-05-23 1954-05-11 Philips Nv Procédé de fabrication d'un système d'électrodes
US3542551A (en) * 1968-07-01 1970-11-24 Trw Semiconductors Inc Method of etching patterns into solid state devices
US3649393A (en) * 1970-06-12 1972-03-14 Ibm Variable depth etching of film layers using variable exposures of photoresists
US3666473A (en) * 1970-10-06 1972-05-30 Ibm Positive photoresists for projection exposure
US3767397A (en) * 1971-10-21 1973-10-23 Sony Corp Photographic treatment for semiconductor devices or the like
GB1384028A (en) * 1972-08-21 1974-02-12 Hughes Aircraft Co Method of making a semiconductor device
US3853576A (en) * 1973-04-20 1974-12-10 Suburban Screen Print Inc Production of windowed face plates
US3868723A (en) * 1973-06-29 1975-02-25 Ibm Integrated circuit structure accommodating via holes
FR2237311B1 (cg-RX-API-DMAC10.html) * 1973-07-12 1977-05-13 Ibm France
US3873361A (en) * 1973-11-29 1975-03-25 Ibm Method of depositing thin film utilizing a lift-off mask
US3878008A (en) * 1974-02-25 1975-04-15 Us Navy Method of forming high reliability mesa diode

Also Published As

Publication number Publication date
JPS5626139B2 (cg-RX-API-DMAC10.html) 1981-06-17
DE2723944C2 (de) 1985-12-19
JPS533773A (en) 1978-01-13
CH614070A5 (cg-RX-API-DMAC10.html) 1979-10-31
US4040891A (en) 1977-08-09
NL7706107A (nl) 1978-01-03
BR7704380A (pt) 1978-04-18
BE855161A (fr) 1977-09-16
FR2357068B1 (cg-RX-API-DMAC10.html) 1978-11-03
FR2357068A1 (fr) 1978-01-27
CA1095310A (en) 1981-02-10
IT1115668B (it) 1986-02-03
DE2723944A1 (de) 1978-01-05

Similar Documents

Publication Publication Date Title
GB1526638A (en) Semiconductor integrated circuits
GB1194159A (en) Improvements relating to Integrated Circuits.
JPS5713180A (en) Etching method
JPS54105476A (en) Manufacture of semiconductor device
JPS6421450A (en) Production of mask
JPS5578540A (en) Manufacture of semiconductor device
KR100252756B1 (ko) 반도체소자의설계기법의변경을통한오버랩마진향상방법
KR930001301A (ko) 반도체 패턴 형성방법
JPS5484483A (en) Formation of circuit pattern
JPS5599720A (en) Method and device of manufacturing semiconductor device
JPS5656633A (en) Manufacture of semiconductor element
JPS57143785A (en) Magnetic bubble memory element
JPS6411399A (en) Etching of thin film pattern
JPS55162253A (en) Manufacture of lead end projection
JPS5648151A (en) Wiring formation of semiconductor device
JPS5380167A (en) Manufacture of semiconductor device
GB1327306A (en) Method of masking a surface of a semiconductive sub strate
KR960005748A (ko) 반도체소자의 제조방법
TW376465B (en) Method for automatically generating assist phase shifting mask (PSM)
JPS5244570A (en) Photoetching method
JPS56105669A (en) Manufacture of mesa type semiconductor pellet
KR980005323A (ko) 반도체 소자의 스티칭(Stitching) 공정방법
JPS55129349A (en) Photomask
JPH0461314A (ja) 半導体ウエハのパターン形成方法
JPS57109371A (en) Manufacture of semiconductor device

Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee