FR2357068B1 - - Google Patents

Info

Publication number
FR2357068B1
FR2357068B1 FR7716063A FR7716063A FR2357068B1 FR 2357068 B1 FR2357068 B1 FR 2357068B1 FR 7716063 A FR7716063 A FR 7716063A FR 7716063 A FR7716063 A FR 7716063A FR 2357068 B1 FR2357068 B1 FR 2357068B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7716063A
Other languages
French (fr)
Other versions
FR2357068A1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of FR2357068A1 publication Critical patent/FR2357068A1/fr
Application granted granted Critical
Publication of FR2357068B1 publication Critical patent/FR2357068B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H10W20/082—
    • H10P76/202—
    • H10W20/058—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10S156/918—Delaminating processes adapted for specified product, e.g. delaminating medical specimen slide
    • Y10S156/919—Delaminating in preparation for post processing recycling step
    • Y10S156/922—Specified electronic component delaminating in preparation for recycling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
FR7716063A 1976-06-30 1977-05-18 Procede de decapage qui utilise la meme couche photoresistante positive pour deux etapes de decapage Granted FR2357068A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/701,068 US4040891A (en) 1976-06-30 1976-06-30 Etching process utilizing the same positive photoresist layer for two etching steps

Publications (2)

Publication Number Publication Date
FR2357068A1 FR2357068A1 (fr) 1978-01-27
FR2357068B1 true FR2357068B1 (cg-RX-API-DMAC10.html) 1978-11-03

Family

ID=24815952

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7716063A Granted FR2357068A1 (fr) 1976-06-30 1977-05-18 Procede de decapage qui utilise la meme couche photoresistante positive pour deux etapes de decapage

Country Status (11)

Country Link
US (1) US4040891A (cg-RX-API-DMAC10.html)
JP (1) JPS533773A (cg-RX-API-DMAC10.html)
BE (1) BE855161A (cg-RX-API-DMAC10.html)
BR (1) BR7704380A (cg-RX-API-DMAC10.html)
CA (1) CA1095310A (cg-RX-API-DMAC10.html)
CH (1) CH614070A5 (cg-RX-API-DMAC10.html)
DE (1) DE2723944C2 (cg-RX-API-DMAC10.html)
FR (1) FR2357068A1 (cg-RX-API-DMAC10.html)
GB (1) GB1526638A (cg-RX-API-DMAC10.html)
IT (1) IT1115668B (cg-RX-API-DMAC10.html)
NL (1) NL7706107A (cg-RX-API-DMAC10.html)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2626516A1 (de) * 1976-06-14 1977-12-22 Siemens Ag Verfahren zum herstellen von lichtleiterstrukturen mit dazwischenliegenden elektroden
US4246595A (en) * 1977-03-08 1981-01-20 Matsushita Electric Industrial Co., Ltd. Electronics circuit device and method of making the same
US4131497A (en) * 1977-07-12 1978-12-26 International Business Machines Corporation Method of manufacturing self-aligned semiconductor devices
US4202914A (en) * 1978-12-29 1980-05-13 International Business Machines Corporation Method of depositing thin films of small dimensions utilizing silicon nitride lift-off mask
US4251318A (en) * 1979-06-29 1981-02-17 Hutchinson Industrial Corporation Method of making fully etched type-carrier elements
JPS5626450A (en) * 1979-08-13 1981-03-14 Hitachi Ltd Manufacture of semiconductor device
US4251621A (en) * 1979-11-13 1981-02-17 Bell Telephone Laboratories, Incorporated Selective metal etching of two gold alloys on common surface for semiconductor contacts
US4320190A (en) * 1979-12-18 1982-03-16 Ebauches S.A. Method of manufacturing the substrate of an electrochromic display cell
US4307179A (en) * 1980-07-03 1981-12-22 International Business Machines Corporation Planar metal interconnection system and process
US4397079A (en) * 1981-03-30 1983-08-09 International Business Machines Corp. Process for improving the yield of integrated devices including Schottky barrier diodes
US4472240A (en) * 1981-08-21 1984-09-18 Tokyo Shibaura Denki Kabushiki Kaisha Method for manufacturing semiconductor device
US4377633A (en) * 1981-08-24 1983-03-22 International Business Machines Corporation Methods of simultaneous contact and metal lithography patterning
US4398964A (en) * 1981-12-10 1983-08-16 Signetics Corporation Method of forming ion implants self-aligned with a cut
US4466849A (en) * 1982-02-24 1984-08-21 Ers Engineering Corporation Process for removing adhesive tape
US4430365A (en) 1982-07-22 1984-02-07 International Business Machines Corporation Method for forming conductive lines and vias
US4508815A (en) * 1983-11-03 1985-04-02 Mostek Corporation Recessed metallization
US5059454A (en) * 1989-04-26 1991-10-22 Flex Products, Inc. Method for making patterned thin film
US4957592A (en) * 1989-12-27 1990-09-18 Xerox Corporation Method of using erodable masks to produce partially etched structures in ODE wafer structures
US5126006A (en) * 1990-10-30 1992-06-30 International Business Machines Corp. Plural level chip masking
US5213916A (en) * 1990-10-30 1993-05-25 International Business Machines Corporation Method of making a gray level mask
US5240878A (en) * 1991-04-26 1993-08-31 International Business Machines Corporation Method for forming patterned films on a substrate
JP2000199827A (ja) * 1998-10-27 2000-07-18 Sony Corp 光導波装置およびその製造方法
US6372647B1 (en) 1999-12-14 2002-04-16 International Business Machines Corporation Via masked line first dual damascene
US6569763B1 (en) * 2002-04-09 2003-05-27 Northrop Grumman Corporation Method to separate a metal film from an insulating film in a semiconductor device using adhesive tape
US20070037386A1 (en) * 2005-08-13 2007-02-15 Williams John L Sloped thin film substrate edges

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE506677A (cg-RX-API-DMAC10.html) * 1950-10-31
NL130926C (cg-RX-API-DMAC10.html) * 1959-09-04
GB1048424A (en) * 1963-08-28 1966-11-16 Int Standard Electric Corp Improvements in or relating to semiconductor devices
FR1064185A (fr) * 1967-05-23 1954-05-11 Philips Nv Procédé de fabrication d'un système d'électrodes
US3542551A (en) * 1968-07-01 1970-11-24 Trw Semiconductors Inc Method of etching patterns into solid state devices
US3649393A (en) * 1970-06-12 1972-03-14 Ibm Variable depth etching of film layers using variable exposures of photoresists
US3666473A (en) * 1970-10-06 1972-05-30 Ibm Positive photoresists for projection exposure
US3767397A (en) * 1971-10-21 1973-10-23 Sony Corp Photographic treatment for semiconductor devices or the like
GB1384028A (en) * 1972-08-21 1974-02-12 Hughes Aircraft Co Method of making a semiconductor device
US3853576A (en) * 1973-04-20 1974-12-10 Suburban Screen Print Inc Production of windowed face plates
US3868723A (en) * 1973-06-29 1975-02-25 Ibm Integrated circuit structure accommodating via holes
FR2237311B1 (cg-RX-API-DMAC10.html) * 1973-07-12 1977-05-13 Ibm France
US3873361A (en) * 1973-11-29 1975-03-25 Ibm Method of depositing thin film utilizing a lift-off mask
US3878008A (en) * 1974-02-25 1975-04-15 Us Navy Method of forming high reliability mesa diode

Also Published As

Publication number Publication date
JPS5626139B2 (cg-RX-API-DMAC10.html) 1981-06-17
DE2723944C2 (de) 1985-12-19
GB1526638A (en) 1978-09-27
JPS533773A (en) 1978-01-13
CH614070A5 (cg-RX-API-DMAC10.html) 1979-10-31
US4040891A (en) 1977-08-09
NL7706107A (nl) 1978-01-03
BR7704380A (pt) 1978-04-18
BE855161A (fr) 1977-09-16
FR2357068A1 (fr) 1978-01-27
CA1095310A (en) 1981-02-10
IT1115668B (it) 1986-02-03
DE2723944A1 (de) 1978-01-05

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Legal Events

Date Code Title Description
ST Notification of lapse