JPS6411399A - Etching of thin film pattern - Google Patents

Etching of thin film pattern

Info

Publication number
JPS6411399A
JPS6411399A JP16663987A JP16663987A JPS6411399A JP S6411399 A JPS6411399 A JP S6411399A JP 16663987 A JP16663987 A JP 16663987A JP 16663987 A JP16663987 A JP 16663987A JP S6411399 A JPS6411399 A JP S6411399A
Authority
JP
Japan
Prior art keywords
pattern
layer
thin film
etching
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16663987A
Other languages
Japanese (ja)
Other versions
JPH0552076B2 (en
Inventor
Takayuki Kato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP16663987A priority Critical patent/JPS6411399A/en
Publication of JPS6411399A publication Critical patent/JPS6411399A/en
Publication of JPH0552076B2 publication Critical patent/JPH0552076B2/ja
Granted legal-status Critical Current

Links

Abstract

PURPOSE:To perform rapid and effective etching at a position of etching under a fine pattern, to improve its yield, to improve the pattern accuracy and to manufacture a thin film etching substrate having high reliability by forming a connecting pattern for connecting an opening pattern to the fine pattern on a resist film. CONSTITUTION:A first layer thin film 12 is formed on a substrate 11, a second layer thin film 13 is formed thereon, and a resist film 14 is formed. When a pattern is formed on the film 14, an opening pattern 15 and a fine pattern 16 are formed, and a connecting pattern 17 for connecting the openings is formed. Then, the second layer thin film layer 13 of the patterns 15, 16, 17 not covered with the film 14 is etched, and then the layer 13 is etched. In this case, an etchant is introduced to the pattern 17 and rapidly fed into the pattern 16. Thus, since it can prevent the etchant from staying in the pattern 16 to accelerate the flowing, the depthwise etching from the layer 13 to the layer 12 is effectively and rapidly performed.
JP16663987A 1987-07-03 1987-07-03 Etching of thin film pattern Granted JPS6411399A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16663987A JPS6411399A (en) 1987-07-03 1987-07-03 Etching of thin film pattern

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16663987A JPS6411399A (en) 1987-07-03 1987-07-03 Etching of thin film pattern

Publications (2)

Publication Number Publication Date
JPS6411399A true JPS6411399A (en) 1989-01-13
JPH0552076B2 JPH0552076B2 (en) 1993-08-04

Family

ID=15835006

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16663987A Granted JPS6411399A (en) 1987-07-03 1987-07-03 Etching of thin film pattern

Country Status (1)

Country Link
JP (1) JPS6411399A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006138268A (en) * 2004-11-12 2006-06-01 Fujitsu General Ltd Centrifugal fan device
JP2007247957A (en) * 2006-03-15 2007-09-27 Max Co Ltd Air blowing device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006138268A (en) * 2004-11-12 2006-06-01 Fujitsu General Ltd Centrifugal fan device
JP2007247957A (en) * 2006-03-15 2007-09-27 Max Co Ltd Air blowing device

Also Published As

Publication number Publication date
JPH0552076B2 (en) 1993-08-04

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term