GB1511415A - Connecting strips - Google Patents

Connecting strips

Info

Publication number
GB1511415A
GB1511415A GB16956/76A GB1695676A GB1511415A GB 1511415 A GB1511415 A GB 1511415A GB 16956/76 A GB16956/76 A GB 16956/76A GB 1695676 A GB1695676 A GB 1695676A GB 1511415 A GB1511415 A GB 1511415A
Authority
GB
United Kingdom
Prior art keywords
strips
ribbon
strip
pads
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB16956/76A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Corp
Original Assignee
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Corp filed Critical Siemens Corp
Publication of GB1511415A publication Critical patent/GB1511415A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/453—Leadframes comprising flexible metallic tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/695—Organic materials

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
GB16956/76A 1975-06-24 1976-04-27 Connecting strips Expired GB1511415A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19752528119 DE2528119A1 (de) 1975-06-24 1975-06-24 Elektrisch leitendes band

Publications (1)

Publication Number Publication Date
GB1511415A true GB1511415A (en) 1978-05-17

Family

ID=5949834

Family Applications (1)

Application Number Title Priority Date Filing Date
GB16956/76A Expired GB1511415A (en) 1975-06-24 1976-04-27 Connecting strips

Country Status (5)

Country Link
JP (1) JPS523384A (cg-RX-API-DMAC7.html)
DE (1) DE2528119A1 (cg-RX-API-DMAC7.html)
FR (1) FR2315770A1 (cg-RX-API-DMAC7.html)
GB (1) GB1511415A (cg-RX-API-DMAC7.html)
IT (1) IT1064051B (cg-RX-API-DMAC7.html)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2138210A (en) * 1982-02-05 1984-10-17 Hitachi Ltd A multiple frame
US4829666A (en) * 1980-05-20 1989-05-16 Gao Gesellschaft Fur Automation Und Organisation Mbh Method for producing a carrier element for an IC-chip
WO2004077557A1 (en) * 2003-02-24 2004-09-10 Infineon Technologies Ag A plastics leadframe and an integrated circuit package fabricated using the leadframe
JP2012152984A (ja) * 2011-01-25 2012-08-16 Canon Inc 液体吐出ヘッドおよび液体吐出ヘッドの製造方法

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5793559A (en) * 1980-12-03 1982-06-10 Nec Corp Semiconductor device
JPS57117265A (en) * 1981-01-13 1982-07-21 Nec Corp Semiconductor device
JPS57134941A (en) * 1981-02-13 1982-08-20 Nec Corp Semiconductor device
JPS57145356A (en) * 1981-03-03 1982-09-08 Nec Corp Semiconductor device
JPS59128736U (ja) * 1984-01-17 1984-08-30 日本電気株式会社 半導体集積回路装置
JPS6359593A (ja) * 1986-08-30 1988-03-15 株式会社東芝 携帯可能媒体における実装方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1193519A (en) * 1967-08-31 1970-06-03 Texas Instruments Ltd Semiconductor Devices
GB1306031A (cg-RX-API-DMAC7.html) * 1971-01-01 1973-02-07
US3777365A (en) * 1972-03-06 1973-12-11 Honeywell Inf Systems Circuit chips having beam leads attached by film strip process

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4829666A (en) * 1980-05-20 1989-05-16 Gao Gesellschaft Fur Automation Und Organisation Mbh Method for producing a carrier element for an IC-chip
GB2138210A (en) * 1982-02-05 1984-10-17 Hitachi Ltd A multiple frame
WO2004077557A1 (en) * 2003-02-24 2004-09-10 Infineon Technologies Ag A plastics leadframe and an integrated circuit package fabricated using the leadframe
JP2012152984A (ja) * 2011-01-25 2012-08-16 Canon Inc 液体吐出ヘッドおよび液体吐出ヘッドの製造方法

Also Published As

Publication number Publication date
DE2528119A1 (de) 1977-01-20
FR2315770B1 (cg-RX-API-DMAC7.html) 1982-10-22
JPS523384A (en) 1977-01-11
FR2315770A1 (fr) 1977-01-21
IT1064051B (it) 1985-02-18

Similar Documents

Publication Publication Date Title
JPS53149763A (en) Mounting method of semiconductor integrate circuit
KR870011691A (ko) 반도체 장치 및 그 제조방법
ES472055A1 (es) Perfeccionamientos introducidos en un conectador electrico
JPS55111151A (en) Integrated circuit device
JPS5553446A (en) Container of electronic component
JPS55133549A (en) Probe card
GB1209901A (en) Improvements relating to the mounting of integrated circuit assemblies
ES2006054A6 (es) Metodo para conectar paquetes de pastilla sin terminales y articulo correspondiente.
JPS5698853A (en) Structure of lead in semiconductor device
JPS5412263A (en) Semiconductor element and production of the same
JPS5421854A (en) Recording head
JPS5636147A (en) Semiconductor device and its manufacture
JPS5353261A (en) Electronic device
JPS6464332A (en) Manufacture of tape carrier type semiconductor device
JPS53108372A (en) Substrate for wireless bonding
JPS5618451A (en) Manufacture of substrate for semiconductor device
JPS55124241A (en) Method of fabricating semiconductor device
JPS56142659A (en) Semiconductor device
JPS5240972A (en) Packaging construction of semiconductor device
JPS5349948A (en) Semiconductor device
JPS57103322A (en) Sealing case for semiconductor device
JPS5313874A (en) Production of semiconductor device
GB1503449A (en) Semiconductor components
AU2514777A (en) Terminal connections on microcircuit chips
JPS55160452A (en) Hybrid integrated circuit

Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee