JPS523384A - Comb teeth shaped conductor for semiconductor elements or integrated circuits - Google Patents

Comb teeth shaped conductor for semiconductor elements or integrated circuits

Info

Publication number
JPS523384A
JPS523384A JP7497076A JP7497076A JPS523384A JP S523384 A JPS523384 A JP S523384A JP 7497076 A JP7497076 A JP 7497076A JP 7497076 A JP7497076 A JP 7497076A JP S523384 A JPS523384 A JP S523384A
Authority
JP
Japan
Prior art keywords
integrated circuits
semiconductor elements
comb teeth
shaped conductor
teeth shaped
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7497076A
Other languages
English (en)
Inventor
Riyuhiaruto Fuugo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of JPS523384A publication Critical patent/JPS523384A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/145—Organic substrates, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Die Bonding (AREA)
JP7497076A 1975-06-24 1976-06-24 Comb teeth shaped conductor for semiconductor elements or integrated circuits Pending JPS523384A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19752528119 DE2528119A1 (de) 1975-06-24 1975-06-24 Elektrisch leitendes band

Publications (1)

Publication Number Publication Date
JPS523384A true JPS523384A (en) 1977-01-11

Family

ID=5949834

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7497076A Pending JPS523384A (en) 1975-06-24 1976-06-24 Comb teeth shaped conductor for semiconductor elements or integrated circuits

Country Status (5)

Country Link
JP (1) JPS523384A (ja)
DE (1) DE2528119A1 (ja)
FR (1) FR2315770A1 (ja)
GB (1) GB1511415A (ja)
IT (1) IT1064051B (ja)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5793559A (en) * 1980-12-03 1982-06-10 Nec Corp Semiconductor device
JPS57117265A (en) * 1981-01-13 1982-07-21 Nec Corp Semiconductor device
JPS57134941A (en) * 1981-02-13 1982-08-20 Nec Corp Semiconductor device
JPS57145356A (en) * 1981-03-03 1982-09-08 Nec Corp Semiconductor device
JPS59128736U (ja) * 1984-01-17 1984-08-30 日本電気株式会社 半導体集積回路装置
JPS6359593A (ja) * 1986-08-30 1988-03-15 株式会社東芝 携帯可能媒体における実装方法
JP2012152984A (ja) * 2011-01-25 2012-08-16 Canon Inc 液体吐出ヘッドおよび液体吐出ヘッドの製造方法

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3019207A1 (de) * 1980-05-20 1981-11-26 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Traegerelement fuer einen ic-chip
FR2521350B1 (fr) * 1982-02-05 1986-01-24 Hitachi Ltd Boitier porteur de puce semi-conductrice
AU2003216033A1 (en) * 2003-02-24 2004-09-17 Infineon Technologies Ag A plastics leadframe and an integrated circuit package fabricated using the leadframe

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1193519A (en) * 1967-08-31 1970-06-03 Texas Instruments Ltd Semiconductor Devices
GB1306031A (ja) * 1971-01-01 1973-02-07
US3777365A (en) * 1972-03-06 1973-12-11 Honeywell Inf Systems Circuit chips having beam leads attached by film strip process

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5793559A (en) * 1980-12-03 1982-06-10 Nec Corp Semiconductor device
JPS6132822B2 (ja) * 1980-12-03 1986-07-29 Nippon Electric Co
JPS57117265A (en) * 1981-01-13 1982-07-21 Nec Corp Semiconductor device
JPH04387B2 (ja) * 1981-01-13 1992-01-07 Nippon Electric Co
JPS57134941A (en) * 1981-02-13 1982-08-20 Nec Corp Semiconductor device
JPS57145356A (en) * 1981-03-03 1982-09-08 Nec Corp Semiconductor device
JPS6216544B2 (ja) * 1981-03-03 1987-04-13 Nippon Electric Co
JPS59128736U (ja) * 1984-01-17 1984-08-30 日本電気株式会社 半導体集積回路装置
JPS6214689Y2 (ja) * 1984-01-17 1987-04-15
JPS6359593A (ja) * 1986-08-30 1988-03-15 株式会社東芝 携帯可能媒体における実装方法
JP2012152984A (ja) * 2011-01-25 2012-08-16 Canon Inc 液体吐出ヘッドおよび液体吐出ヘッドの製造方法

Also Published As

Publication number Publication date
IT1064051B (it) 1985-02-18
GB1511415A (en) 1978-05-17
DE2528119A1 (de) 1977-01-20
FR2315770B1 (ja) 1982-10-22
FR2315770A1 (fr) 1977-01-21

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