JPS59128736U - 半導体集積回路装置 - Google Patents
半導体集積回路装置Info
- Publication number
- JPS59128736U JPS59128736U JP1984004773U JP477384U JPS59128736U JP S59128736 U JPS59128736 U JP S59128736U JP 1984004773 U JP1984004773 U JP 1984004773U JP 477384 U JP477384 U JP 477384U JP S59128736 U JPS59128736 U JP S59128736U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- circuit device
- semiconductor integrated
- bonding pads
- external lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
め要約のデータは記録されません。
Description
第1図a、 bは従来の音響用電力増幅半導体集積回
路装置の一例の外形図、第2図は第1図a。 bの音響用電力増幅半導体集積回路装置の実装例を示す
説明図、第3図a、 bはそれぞれ第1図a。 bに示す音響用電力増幅半導体集積回路装置の内 一
部を説明する説明図、第4図a、 bは本考案の一実
施例を示す音響用電力増幅半導体集積回路装置の外形図
、第5図a、 bはそれぞれ第4図a、 bに示さ
れる音響用電力増幅半導体集積回路装置の内部を説明す
る説明図である。 11、 12. 19. 20・・・音響用電力増幅半
導体集積回路装置、13・・・放熱板、14.14’。 40.50・・・半導体ペレット、15.15’。 45.55・・・放熱板、16−1・・・16−7.1
6−1′・・・16−7’ 、46−1・・・46−7
.56−1・・・56−7・・・リード、17. 17
’、47゜57.47’ 、57’・・・ボンディング
線、18−1・・・1B−7,18−1’・・・1B−
7’、21〜27.31〜37・・・ポンディングパッ
ド。
路装置の一例の外形図、第2図は第1図a。 bの音響用電力増幅半導体集積回路装置の実装例を示す
説明図、第3図a、 bはそれぞれ第1図a。 bに示す音響用電力増幅半導体集積回路装置の内 一
部を説明する説明図、第4図a、 bは本考案の一実
施例を示す音響用電力増幅半導体集積回路装置の外形図
、第5図a、 bはそれぞれ第4図a、 bに示さ
れる音響用電力増幅半導体集積回路装置の内部を説明す
る説明図である。 11、 12. 19. 20・・・音響用電力増幅半
導体集積回路装置、13・・・放熱板、14.14’。 40.50・・・半導体ペレット、15.15’。 45.55・・・放熱板、16−1・・・16−7.1
6−1′・・・16−7’ 、46−1・・・46−7
.56−1・・・56−7・・・リード、17. 17
’、47゜57.47’ 、57’・・・ボンディング
線、18−1・・・1B−7,18−1’・・・1B−
7’、21〜27.31〜37・・・ポンディングパッ
ド。
Claims (1)
- 半導体ペレット上の多数のポンディングパッドが第1の
電流容量をもつ導電路で外部導出用リードに接続される
複数の第1のポンディングパッドと前記第1の電流容量
とは異なる第2の電流容量をもつ導電路で外部導出用リ
ードに接続される複数の第2のポンディングパッドとで
構成されている半導体集積回路装置において、前記複数
の第2のポンディングパッドは前記半導体ペレットの中
心線に対して対称に配置されていることを特徴とする半
導体集積回路装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1984004773U JPS59128736U (ja) | 1984-01-17 | 1984-01-17 | 半導体集積回路装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1984004773U JPS59128736U (ja) | 1984-01-17 | 1984-01-17 | 半導体集積回路装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59128736U true JPS59128736U (ja) | 1984-08-30 |
JPS6214689Y2 JPS6214689Y2 (ja) | 1987-04-15 |
Family
ID=30136373
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1984004773U Granted JPS59128736U (ja) | 1984-01-17 | 1984-01-17 | 半導体集積回路装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59128736U (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1986005322A1 (en) * | 1985-02-28 | 1986-09-12 | Sony Corporation | Semiconducteur circuit device |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS49131381U (ja) * | 1973-03-14 | 1974-11-12 | ||
JPS49131381A (ja) * | 1973-04-18 | 1974-12-17 | ||
JPS523384A (en) * | 1975-06-24 | 1977-01-11 | Siemens Ag | Comb teeth shaped conductor for semiconductor elements or integrated circuits |
-
1984
- 1984-01-17 JP JP1984004773U patent/JPS59128736U/ja active Granted
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS49131381U (ja) * | 1973-03-14 | 1974-11-12 | ||
JPS49131381A (ja) * | 1973-04-18 | 1974-12-17 | ||
JPS523384A (en) * | 1975-06-24 | 1977-01-11 | Siemens Ag | Comb teeth shaped conductor for semiconductor elements or integrated circuits |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1986005322A1 (en) * | 1985-02-28 | 1986-09-12 | Sony Corporation | Semiconducteur circuit device |
Also Published As
Publication number | Publication date |
---|---|
JPS6214689Y2 (ja) | 1987-04-15 |
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