AU2003216033A1 - A plastics leadframe and an integrated circuit package fabricated using the leadframe - Google Patents

A plastics leadframe and an integrated circuit package fabricated using the leadframe

Info

Publication number
AU2003216033A1
AU2003216033A1 AU2003216033A AU2003216033A AU2003216033A1 AU 2003216033 A1 AU2003216033 A1 AU 2003216033A1 AU 2003216033 A AU2003216033 A AU 2003216033A AU 2003216033 A AU2003216033 A AU 2003216033A AU 2003216033 A1 AU2003216033 A1 AU 2003216033A1
Authority
AU
Australia
Prior art keywords
leadframe
plastics
integrated circuit
circuit package
package fabricated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003216033A
Inventor
Beng Keh See
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infineon Technologies AG
Original Assignee
Infineon Technologies AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies AG filed Critical Infineon Technologies AG
Publication of AU2003216033A1 publication Critical patent/AU2003216033A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
AU2003216033A 2003-02-24 2003-02-24 A plastics leadframe and an integrated circuit package fabricated using the leadframe Abandoned AU2003216033A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/SG2003/000038 WO2004077557A1 (en) 2003-02-24 2003-02-24 A plastics leadframe and an integrated circuit package fabricated using the leadframe

Publications (1)

Publication Number Publication Date
AU2003216033A1 true AU2003216033A1 (en) 2004-09-17

Family

ID=32923958

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003216033A Abandoned AU2003216033A1 (en) 2003-02-24 2003-02-24 A plastics leadframe and an integrated circuit package fabricated using the leadframe

Country Status (2)

Country Link
AU (1) AU2003216033A1 (en)
WO (1) WO2004077557A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102969296A (en) * 2012-11-20 2013-03-13 无锡市威海达机械制造有限公司 Lead frame structure

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2528119A1 (en) * 1975-06-24 1977-01-20 Siemens Ag ELECTRIC CONDUCTIVE TAPE
US4089733A (en) * 1975-09-12 1978-05-16 Amp Incorporated Method of forming complex shaped metal-plastic composite lead frames for IC packaging
JPS5788752A (en) * 1980-11-25 1982-06-02 Hitachi Ltd Lead frame and semiconductor device prepared by using the same
US5297008A (en) * 1991-12-31 1994-03-22 Compaq Computer Corporation (Compaq) Polymeric composite lead wire and method for making same
US5879965A (en) * 1997-06-19 1999-03-09 Micron Technology, Inc. Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication

Also Published As

Publication number Publication date
WO2004077557A1 (en) 2004-09-10

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase