GB1503449A - Semiconductor components - Google Patents

Semiconductor components

Info

Publication number
GB1503449A
GB1503449A GB3159476A GB3159476A GB1503449A GB 1503449 A GB1503449 A GB 1503449A GB 3159476 A GB3159476 A GB 3159476A GB 3159476 A GB3159476 A GB 3159476A GB 1503449 A GB1503449 A GB 1503449A
Authority
GB
United Kingdom
Prior art keywords
pad
semiconductor
semiconductor components
contact
heading
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3159476A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of GB1503449A publication Critical patent/GB1503449A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/40—Electrodes ; Multistep manufacturing processes therefor
    • H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H01L23/4824—Pads with extended contours, e.g. grid structure, branch structure, finger structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Wire Bonding (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

1503449 Semiconductor devices SIEMENS AG 29 July 1976 [1 Aug 1975] 31594/76 Heading H1K A contact pad 2 for a semiconductor device comprises a plurality of discrete elements 6, 7, 8 one of which, 8, is electrically connected, e.g. via track 3, to the semiconductor zone to which external contact is to be made and comprises a series of spaced elongate portions distributed throughout the pad. When a terminal lead, such as 5, is bonded to the pad 2 only a minor portion of the total area of the pad is thus capacitively coupled through the underlying insulating layer to the semiconductor substrate. Various pad configurations are possible, Fig. 1 showing one example.
GB3159476A 1975-08-01 1976-07-29 Semiconductor components Expired GB1503449A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19752534477 DE2534477C3 (en) 1975-08-01 1975-08-01 Low-capacitance contact point

Publications (1)

Publication Number Publication Date
GB1503449A true GB1503449A (en) 1978-03-08

Family

ID=5953032

Family Applications (1)

Application Number Title Priority Date Filing Date
GB3159476A Expired GB1503449A (en) 1975-08-01 1976-07-29 Semiconductor components

Country Status (5)

Country Link
AT (1) AT359128B (en)
DE (1) DE2534477C3 (en)
FR (1) FR2319975A1 (en)
GB (1) GB1503449A (en)
IT (1) IT1067180B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2631810C3 (en) * 1976-07-15 1979-03-15 Deutsche Itt Industries Gmbh, 7800 Freiburg Planar semiconductor device

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3450965A (en) * 1966-05-28 1969-06-17 Sony Corp Semiconductor having reinforced lead structure

Also Published As

Publication number Publication date
FR2319975A1 (en) 1977-02-25
ATA834675A (en) 1980-03-15
AT359128B (en) 1980-10-27
DE2534477A1 (en) 1977-02-10
DE2534477C3 (en) 1979-04-05
FR2319975B1 (en) 1982-11-19
DE2534477B2 (en) 1978-07-27
IT1067180B (en) 1985-03-12

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee