JPS5698853A - Structure of lead in semiconductor device - Google Patents

Structure of lead in semiconductor device

Info

Publication number
JPS5698853A
JPS5698853A JP133480A JP133480A JPS5698853A JP S5698853 A JPS5698853 A JP S5698853A JP 133480 A JP133480 A JP 133480A JP 133480 A JP133480 A JP 133480A JP S5698853 A JPS5698853 A JP S5698853A
Authority
JP
Japan
Prior art keywords
lead
sides
circuit
slanted
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP133480A
Other languages
Japanese (ja)
Other versions
JPS6342416B2 (en
Inventor
Fumihito Inoue
Kazuo Shimizu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP133480A priority Critical patent/JPS5698853A/en
Publication of JPS5698853A publication Critical patent/JPS5698853A/en
Publication of JPS6342416B2 publication Critical patent/JPS6342416B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Abstract

PURPOSE:To improve the adhesiveness of the lead and circuit and to make easier the visual inspection on the wettability of the solder flux, by putting the end of the lead vertically on to the surface of the substrate, making slanted cut on both sides of the end of the lead and applying solder flux to the end and the slanted portions of the lead. CONSTITUTION:The outer lead 13 which extend, by the inner lead 12, from the four sides of the package 11 constituting the resin mold that contains semiconductor pellet, lead and wire are bent vertically downward immediately they extend from the package 11. The end 14 of the lead 13 is put on to the solder printed circuit 16 formed on the surface of the substrate 15, and the end 14 and the circuit 16 are connected. The both sides of the end 14 of the lead are sharpened out in a manner that it takes the shape of the central flat portion 17 and the slanted portion 18 on both sides. The slanted portions are covered with soldering flux to make sure the adhesion between the lead and the circuit.
JP133480A 1980-01-11 1980-01-11 Structure of lead in semiconductor device Granted JPS5698853A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP133480A JPS5698853A (en) 1980-01-11 1980-01-11 Structure of lead in semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP133480A JPS5698853A (en) 1980-01-11 1980-01-11 Structure of lead in semiconductor device

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP30370786A Division JPS62169354A (en) 1986-12-22 1986-12-22 Packaging structure of semiconductor device

Publications (2)

Publication Number Publication Date
JPS5698853A true JPS5698853A (en) 1981-08-08
JPS6342416B2 JPS6342416B2 (en) 1988-08-23

Family

ID=11498593

Family Applications (1)

Application Number Title Priority Date Filing Date
JP133480A Granted JPS5698853A (en) 1980-01-11 1980-01-11 Structure of lead in semiconductor device

Country Status (1)

Country Link
JP (1) JPS5698853A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59108389A (en) * 1982-12-13 1984-06-22 マルコン電子株式会社 Method of producing hybrid integrated circuit
JPS6188471A (en) * 1984-10-05 1986-05-06 松下電器産業株式会社 Connector
JPS6242253U (en) * 1985-08-31 1987-03-13
JPS62169354A (en) * 1986-12-22 1987-07-25 Hitachi Ltd Packaging structure of semiconductor device
JPS63172060U (en) * 1987-04-30 1988-11-09
JPH01132148A (en) * 1981-07-27 1989-05-24 Texas Instr Inc <Ti> Integrated circuit carrier

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5279258A (en) * 1975-12-25 1977-07-04 Nippon Electric Co Container for electronic circuit parts
JPS53118464U (en) * 1977-02-25 1978-09-20

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5279258A (en) * 1975-12-25 1977-07-04 Nippon Electric Co Container for electronic circuit parts
JPS53118464U (en) * 1977-02-25 1978-09-20

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01132148A (en) * 1981-07-27 1989-05-24 Texas Instr Inc <Ti> Integrated circuit carrier
JPH0445987B2 (en) * 1981-07-27 1992-07-28 Texas Instruments Inc
JPS59108389A (en) * 1982-12-13 1984-06-22 マルコン電子株式会社 Method of producing hybrid integrated circuit
JPS6188471A (en) * 1984-10-05 1986-05-06 松下電器産業株式会社 Connector
JPH0521316B2 (en) * 1984-10-05 1993-03-24 Matsushita Electric Ind Co Ltd
JPS6242253U (en) * 1985-08-31 1987-03-13
JPH0510366Y2 (en) * 1985-08-31 1993-03-15
JPS62169354A (en) * 1986-12-22 1987-07-25 Hitachi Ltd Packaging structure of semiconductor device
JPH0321096B2 (en) * 1986-12-22 1991-03-20 Hitachi Ltd
JPS63172060U (en) * 1987-04-30 1988-11-09
JPH051909Y2 (en) * 1987-04-30 1993-01-19

Also Published As

Publication number Publication date
JPS6342416B2 (en) 1988-08-23

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