FR3067626B1 - Procede de polissage cmp uniforme - Google Patents
Procede de polissage cmp uniforme Download PDFInfo
- Publication number
- FR3067626B1 FR3067626B1 FR1855161A FR1855161A FR3067626B1 FR 3067626 B1 FR3067626 B1 FR 3067626B1 FR 1855161 A FR1855161 A FR 1855161A FR 1855161 A FR1855161 A FR 1855161A FR 3067626 B1 FR3067626 B1 FR 3067626B1
- Authority
- FR
- France
- Prior art keywords
- polishing
- wafer
- rotating
- radial feed
- grooves
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000007517 polishing process Methods 0.000 title 1
- 238000005498 polishing Methods 0.000 abstract 8
- 238000000034 method Methods 0.000 abstract 2
- 239000012530 fluid Substances 0.000 abstract 1
- 230000003287 optical effect Effects 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
- H01L21/3043—Making grooves, e.g. cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1409—Abrasive particles per se
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/0203—Making porous regions on the surface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/31051—Planarisation of the insulating layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/31051—Planarisation of the insulating layers
- H01L21/31053—Planarisation of the insulating layers involving a dielectric removal step
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/32115—Planarisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/32115—Planarisation
- H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Abstract
L'invention met à disposition un procédé pour polir ou planariser une galette d'au moins l'un parmi les substrats semi-conducteurs, optiques et magnétiques. Le procédé comprend la rotation d'un tampon de polissage (10) ayant des rainures d'alimentation radiales (20-34) dans une couche de polissage (12) séparant la couche de polissage (12) en régions de polissage (40-54). Les rainures d'alimentation radiales (20-34) s'étendent au moins depuis un emplacement adjacent au centre (16) jusqu'à un emplacement adjacent au bord extérieur (18). Chaque région de polissage (40-54) comprend une série de rainures obliques connectant une paire de rainures d'alimentation radiales adjacentes. La série de rainures obliques sépare une surface d'appui et elles ont des parois intérieures plus proches du centre (16) et des parois extérieures plus proches du bord extérieur (18). Le pressage et la rotation de la galette contre le tampon de polissage (10) en rotation pour de multiples rotations polissent ou planarisent la galette avec des surfaces d'appui mouillées par le fluide de polissage qui déborde.
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201715623184A | 2017-06-14 | 2017-06-14 | |
US15623184 | 2017-06-14 | ||
US201715624979A | 2017-06-16 | 2017-06-16 | |
US15624979 | 2017-06-16 | ||
US15725836 | 2017-10-05 | ||
US15/725,836 US10586708B2 (en) | 2017-06-14 | 2017-10-05 | Uniform CMP polishing method |
Publications (2)
Publication Number | Publication Date |
---|---|
FR3067626A1 FR3067626A1 (fr) | 2018-12-21 |
FR3067626B1 true FR3067626B1 (fr) | 2021-12-10 |
Family
ID=64457757
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1855161A Active FR3067626B1 (fr) | 2017-06-14 | 2018-06-13 | Procede de polissage cmp uniforme |
Country Status (8)
Country | Link |
---|---|
US (1) | US10586708B2 (fr) |
JP (1) | JP7148288B2 (fr) |
KR (1) | KR102660720B1 (fr) |
CN (1) | CN109079587B (fr) |
DE (1) | DE102018004634A1 (fr) |
FR (1) | FR3067626B1 (fr) |
SG (1) | SG10201804558XA (fr) |
TW (1) | TWI798222B (fr) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20210116759A (ko) | 2020-03-13 | 2021-09-28 | 삼성전자주식회사 | Cmp 패드 및 이를 구비하는 화학적 기계적 연마 장치 |
CN111805412A (zh) * | 2020-07-17 | 2020-10-23 | 中国科学院微电子研究所 | 一种抛光液施配器及抛光装置 |
Family Cites Families (65)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4037367A (en) | 1975-12-22 | 1977-07-26 | Kruse James A | Grinding tool |
US4450652A (en) | 1981-09-04 | 1984-05-29 | Monsanto Company | Temperature control for wafer polishing |
JPS60242975A (ja) | 1984-05-14 | 1985-12-02 | Kanebo Ltd | 平面研磨装置 |
US5076024A (en) | 1990-08-24 | 1991-12-31 | Intelmatec Corporation | Disk polisher assembly |
US5212910A (en) | 1991-07-09 | 1993-05-25 | Intel Corporation | Composite polishing pad for semiconductor process |
US5527215A (en) | 1992-01-10 | 1996-06-18 | Schlegel Corporation | Foam buffing pad having a finishing surface with a splash reducing configuration |
US5243790A (en) | 1992-06-25 | 1993-09-14 | Abrasifs Vega, Inc. | Abrasive member |
MY114512A (en) | 1992-08-19 | 2002-11-30 | Rodel Inc | Polymeric substrate with polymeric microelements |
JPH0741539B2 (ja) * | 1992-10-22 | 1995-05-10 | 日本軽金属株式会社 | 平面研磨装置及び該装置に使用する扇形固形砥石片 |
US6135856A (en) | 1996-01-19 | 2000-10-24 | Micron Technology, Inc. | Apparatus and method for semiconductor planarization |
US5778481A (en) | 1996-02-15 | 1998-07-14 | International Business Machines Corporation | Silicon wafer cleaning and polishing pads |
US5690540A (en) | 1996-02-23 | 1997-11-25 | Micron Technology, Inc. | Spiral grooved polishing pad for chemical-mechanical planarization of semiconductor wafers |
JP3812970B2 (ja) * | 1996-06-20 | 2006-08-23 | 東京エレクトロン株式会社 | 研磨装置および研磨方法 |
US5888121A (en) | 1997-09-23 | 1999-03-30 | Lsi Logic Corporation | Controlling groove dimensions for enhanced slurry flow |
JP2000000755A (ja) * | 1998-06-16 | 2000-01-07 | Sony Corp | 研磨パッド及び研磨方法 |
GB2345255B (en) | 1998-12-29 | 2000-12-27 | United Microelectronics Corp | Chemical-Mechanical Polishing Pad |
CN1312742C (zh) | 1999-03-30 | 2007-04-25 | 株式会社尼康 | 抛光垫、抛光机及制造半导体器件的方法 |
US6220942B1 (en) * | 1999-04-02 | 2001-04-24 | Applied Materials, Inc. | CMP platen with patterned surface |
JP2001071256A (ja) | 1999-08-31 | 2001-03-21 | Shinozaki Seisakusho:Kk | 研磨パッドの溝形成方法及び装置並びに研磨パッド |
JP2001121405A (ja) * | 1999-10-25 | 2001-05-08 | Matsushita Electric Ind Co Ltd | 研磨パッド |
EP1602444B1 (fr) | 2000-01-31 | 2008-03-12 | Shin-Etsu Handotai Company Limited | Procédé de polissage |
TW479000B (en) | 2000-02-24 | 2002-03-11 | United Microelectronics Corp | Polish pad for polishing semiconductor wafer |
US6749485B1 (en) | 2000-05-27 | 2004-06-15 | Rodel Holdings, Inc. | Hydrolytically stable grooved polishing pads for chemical mechanical planarization |
US6656019B1 (en) | 2000-06-29 | 2003-12-02 | International Business Machines Corporation | Grooved polishing pads and methods of use |
US8062098B2 (en) | 2000-11-17 | 2011-11-22 | Duescher Wayne O | High speed flat lapping platen |
JP4087581B2 (ja) * | 2001-06-06 | 2008-05-21 | 株式会社荏原製作所 | 研磨装置 |
JP2003145402A (ja) * | 2001-11-09 | 2003-05-20 | Nippon Electric Glass Co Ltd | ガラス物品用研磨具 |
US7169014B2 (en) | 2002-07-18 | 2007-01-30 | Micron Technology, Inc. | Apparatuses for controlling the temperature of polishing pads used in planarizing micro-device workpieces |
US7377840B2 (en) | 2004-07-21 | 2008-05-27 | Neopad Technologies Corporation | Methods for producing in-situ grooves in chemical mechanical planarization (CMP) pads, and novel CMP pad designs |
US6783436B1 (en) | 2003-04-29 | 2004-08-31 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Polishing pad with optimized grooves and method of forming same |
US6918824B2 (en) | 2003-09-25 | 2005-07-19 | Novellus Systems, Inc. | Uniform fluid distribution and exhaust system for a chemical-mechanical planarization device |
JP2005158797A (ja) * | 2003-11-20 | 2005-06-16 | Renesas Technology Corp | 半導体装置の製造方法 |
US6843711B1 (en) | 2003-12-11 | 2005-01-18 | Rohm And Haas Electronic Materials Cmp Holdings, Inc | Chemical mechanical polishing pad having a process-dependent groove configuration |
US6955587B2 (en) | 2004-01-30 | 2005-10-18 | Rohm And Haas Electronic Materials Cmp Holdings, Inc | Grooved polishing pad and method |
JP2005262341A (ja) | 2004-03-16 | 2005-09-29 | Noritake Super Abrasive:Kk | Cmpパッドコンディショナー |
JP2007081322A (ja) * | 2005-09-16 | 2007-03-29 | Jsr Corp | 化学機械研磨パッドの製造方法 |
US7329174B2 (en) | 2004-05-20 | 2008-02-12 | Jsr Corporation | Method of manufacturing chemical mechanical polishing pad |
KR100568258B1 (ko) | 2004-07-01 | 2006-04-07 | 삼성전자주식회사 | 화학적 기계적 연마용 연마 패드 및 이를 이용하는 화학적기계적 연마 장치 |
USD559066S1 (en) | 2004-10-26 | 2008-01-08 | Jsr Corporation | Polishing pad |
US7169029B2 (en) | 2004-12-16 | 2007-01-30 | 3M Innovative Properties Company | Resilient structured sanding article |
JP3769581B1 (ja) | 2005-05-18 | 2006-04-26 | 東洋ゴム工業株式会社 | 研磨パッドおよびその製造方法 |
KR101279819B1 (ko) | 2005-04-12 | 2013-06-28 | 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스 인코포레이티드 | 방사-편향 연마 패드 |
KR100721196B1 (ko) * | 2005-05-24 | 2007-05-23 | 주식회사 하이닉스반도체 | 연마패드 및 이를 이용한 화학적기계적연마장치 |
US7534162B2 (en) | 2005-09-06 | 2009-05-19 | Freescale Semiconductor, Inc. | Grooved platen with channels or pathway to ambient air |
KR20070070094A (ko) | 2005-12-28 | 2007-07-03 | 제이에스알 가부시끼가이샤 | 화학 기계 연마 패드 및 화학 기계 연마 방법 |
US20080220702A1 (en) * | 2006-07-03 | 2008-09-11 | Sang Fang Chemical Industry Co., Ltd. | Polishing pad having surface texture |
US7300340B1 (en) * | 2006-08-30 | 2007-11-27 | Rohm and Haas Electronics Materials CMP Holdings, Inc. | CMP pad having overlaid constant area spiral grooves |
JP4909706B2 (ja) | 2006-10-24 | 2012-04-04 | 東洋ゴム工業株式会社 | 研磨パッド |
US20090137187A1 (en) | 2007-11-21 | 2009-05-28 | Chien-Min Sung | Diagnostic Methods During CMP Pad Dressing and Associated Systems |
US9180570B2 (en) * | 2008-03-14 | 2015-11-10 | Nexplanar Corporation | Grooved CMP pad |
TWI360459B (en) | 2008-04-11 | 2012-03-21 | Bestac Advanced Material Co Ltd | A polishing pad having groove structure for avoidi |
KR20110100080A (ko) * | 2010-03-03 | 2011-09-09 | 삼성전자주식회사 | 화학적 기계적 연마 공정용 연마 패드 및 이를 포함하는 화학적 기계적 연마 설비 |
KR101232787B1 (ko) | 2010-08-18 | 2013-02-13 | 주식회사 엘지화학 | 연마 시스템용 연마 패드 |
US9211628B2 (en) | 2011-01-26 | 2015-12-15 | Nexplanar Corporation | Polishing pad with concentric or approximately concentric polygon groove pattern |
US8968058B2 (en) * | 2011-05-05 | 2015-03-03 | Nexplanar Corporation | Polishing pad with alignment feature |
TWI492818B (zh) | 2011-07-12 | 2015-07-21 | Iv Technologies Co Ltd | 研磨墊、研磨方法以及研磨系統 |
US8920219B2 (en) * | 2011-07-15 | 2014-12-30 | Nexplanar Corporation | Polishing pad with alignment aperture |
SG11201400614RA (en) | 2011-09-15 | 2014-09-26 | Toray Industries | Polishing pad |
US9067298B2 (en) | 2011-11-29 | 2015-06-30 | Nexplanar Corporation | Polishing pad with grooved foundation layer and polishing surface layer |
US9649742B2 (en) | 2013-01-22 | 2017-05-16 | Nexplanar Corporation | Polishing pad having polishing surface with continuous protrusions |
US9415479B2 (en) | 2013-02-08 | 2016-08-16 | Taiwan Semiconductor Manufacturing Co., Ltd. | Conductive chemical mechanical planarization polishing pad |
TWM459065U (zh) | 2013-04-29 | 2013-08-11 | Iv Technologies Co Ltd | 硏磨墊以及硏磨系統 |
TWM475334U (en) | 2013-06-07 | 2014-04-01 | Iv Technologies Co Ltd | Polishing pad |
TWI599447B (zh) | 2013-10-18 | 2017-09-21 | 卡博特微電子公司 | 具有偏移同心溝槽圖樣之邊緣排除區的cmp拋光墊 |
TWI549781B (zh) | 2015-08-07 | 2016-09-21 | 智勝科技股份有限公司 | 研磨墊、研磨系統及研磨方法 |
-
2017
- 2017-10-05 US US15/725,836 patent/US10586708B2/en active Active
-
2018
- 2018-05-11 CN CN201810448097.0A patent/CN109079587B/zh active Active
- 2018-05-13 TW TW107116212A patent/TWI798222B/zh active
- 2018-05-28 KR KR1020180060170A patent/KR102660720B1/ko active IP Right Grant
- 2018-05-30 SG SG10201804558XA patent/SG10201804558XA/en unknown
- 2018-06-11 JP JP2018111057A patent/JP7148288B2/ja active Active
- 2018-06-11 DE DE102018004634.7A patent/DE102018004634A1/de active Pending
- 2018-06-13 FR FR1855161A patent/FR3067626B1/fr active Active
Also Published As
Publication number | Publication date |
---|---|
CN109079587B (zh) | 2021-05-14 |
TWI798222B (zh) | 2023-04-11 |
FR3067626A1 (fr) | 2018-12-21 |
KR20180136372A (ko) | 2018-12-24 |
US20180366331A1 (en) | 2018-12-20 |
TW201904722A (zh) | 2019-02-01 |
JP2019022929A (ja) | 2019-02-14 |
JP7148288B2 (ja) | 2022-10-05 |
SG10201804558XA (en) | 2019-01-30 |
KR102660720B1 (ko) | 2024-04-26 |
DE102018004634A1 (de) | 2018-12-20 |
CN109079587A (zh) | 2018-12-25 |
US10586708B2 (en) | 2020-03-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
FR3049205B1 (fr) | Tampon de polissage ayant des rainures de retrait des debris | |
FR3022815B1 (fr) | Procede de polissage mecano-chimique | |
FR3067626B1 (fr) | Procede de polissage cmp uniforme | |
JP5677929B2 (ja) | 少なくとも3枚の半導体ウェハの両面の同時材料除去処理のための方法 | |
JP5476432B2 (ja) | 平坦なワークピースを両面加工する装置、ならびに複数の半導体ウェハを両面で同時に材料切削加工する方法 | |
FR3067630B1 (fr) | Tampon de polissage a rainures obliques | |
FR3067629B1 (fr) | Tampon de polissage a structure de rainures trapezoidales | |
CN103659579A (zh) | 弹性膜以及基板保持装置 | |
TW201003825A (en) | Device and method for the treatment of silicon wafers or flat objects | |
JP4319425B2 (ja) | 無端状金属ベルト用金属リングの製造方法 | |
JP2008173741A (ja) | 研磨装置 | |
FR3067628B1 (fr) | Procede de polissage cmp uniforme | |
CN103567839A (zh) | 用于化学机械抛光层纹理预处理的方法 | |
US6620035B2 (en) | Grooved rollers for a linear chemical mechanical planarization system | |
TWI566289B (zh) | Tray and workpiece double-sided grinding device | |
TWI642516B (zh) | 研磨墊以及研磨方法 | |
KR101292227B1 (ko) | 웨이퍼 연마용 패드 드레싱 장치 | |
FR3037834B1 (fr) | Tampon de polissage mecano-chimique et procede pour le produire | |
FR3056432B1 (fr) | Procede de faconnage de la surface de tampons de polissage mecano-chimique | |
MY201367A (en) | Uniform cmp polishing method | |
KR100941198B1 (ko) | 화학 기계적 연마 패드 | |
KR20090062147A (ko) | 연주 슬라브의 표면 연마장치 | |
KR20100062369A (ko) | 연마패드용 드레서 | |
JP2008080428A (ja) | 両面研磨装置および両面研磨方法 | |
MY202290A (en) | Controlled residence cmp polishing method |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PLFP | Fee payment |
Year of fee payment: 3 |
|
PLSC | Publication of the preliminary search report |
Effective date: 20210122 |
|
PLFP | Fee payment |
Year of fee payment: 4 |
|
PLFP | Fee payment |
Year of fee payment: 5 |
|
PLFP | Fee payment |
Year of fee payment: 6 |
|
PLFP | Fee payment |
Year of fee payment: 7 |