TW201003825A - Device and method for the treatment of silicon wafers or flat objects - Google Patents

Device and method for the treatment of silicon wafers or flat objects Download PDF

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Publication number
TW201003825A
TW201003825A TW98113784A TW98113784A TW201003825A TW 201003825 A TW201003825 A TW 201003825A TW 98113784 A TW98113784 A TW 98113784A TW 98113784 A TW98113784 A TW 98113784A TW 201003825 A TW201003825 A TW 201003825A
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Taiwan
Prior art keywords
individual
substrate
rollers
individual rollers
transport
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TW98113784A
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Chinese (zh)
Inventor
Joerg Lampprecht
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Schmid Gmbh & Co Geb
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Publication of TW201003825A publication Critical patent/TW201003825A/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67063Apparatus for fluid treatment for etching
    • H01L21/67075Apparatus for fluid treatment for etching for wet etching
    • H01L21/67086Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706Mechanical details, e.g. roller, belt
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Weting (AREA)

Abstract

Device for texture etching of silicon wafers features a continuous track through a treating chamber with etching solution as well as a means of transport for conveying the substrate on the continuous track. In doing-so, the means of transport features bottom feed rollers along the continuous track on which the silicon wafers lie with their bottom side. The means of transport features also top transport rollers above the bottom feed rollers for support on the top side of the substrate, wherein the top transport rollers feature individual rollers separated from one another and besides one another on a top transport shaft and with a gap relative to one another. A bearing of the individual rollers on the top transport shaft features a radial clearance for movability of the individual roller in radial direction relative to the transport shaft, thus for adapting to different substrate thicknesses. Driving means are provided for every individual roller.

Description

201003825 六、發明說明: 【發明所屬之技術領域】 本發明係關於-種如技術方案】開頭的用於處理石夕晶屢 或基板或平坦物體之裝置以及一種用於處理基板或石夕晶疆 之方法。絆言之’本發明係關於一種用於基板之敍亥&quot; 置。 【先前技術】 自DE 1〇20〇5〇3845() A1已知經由處理袭置之處理腔室在 連續軌道上輸送基板或平坦物體。連續軌道以呈饋料滚筒 形式的輸送構件為特徵,該基板於底面上支撐於該等镇料 滾筒上。在基板之頂面上,以可移動及彈菁負載方式安裝 窄接觸滾筒,用於建立與基板之頂面之電接觸以有利於電 锻。 自DE 102007026081 A1已知一種作為所謂紋理化方法 (texturing method)之用蝕刻溶液製造太陽能電池時處理矽 晶圓之類似處理裝置。在如此實行時’將基板之底面及頂 面同時紋理化,尤其消除基板上之鋸切損壞。可能及均一 地將基板各面之所有表面紋理為重要的以便獲得稍後由該 矽晶圓製成之良好效率之太陽能電池。 【發明内容】 本發明之任務為提供如上文所提及之裝置以及可避免目 月il技術狀態之缺點的方法,且特定而言,本發明之任務為 在基板可能最小暴露於機械應力下時獲得基板各面可能均 一及全表面之紋理。 139764.doc 201003825 此任務係藉由具有如技術方案1之 如技術方案12之特徵之方法來解決。太\、以及具有 其他技術方案之目標且在以下段落中詳細闡 寺斂之大部分僅關於褒置或方法描述,但其應與 述内容無關而應用於兩者。 A Μ /、 Λ2ηη8ίρ/1 此外,由相同申請者在曰期 ’ 月24日之優先權申請案Μ 102008022282 8之护 詞係明確基於參考本發明描述 2叫曰 詞係基於參考描述内容之表述。^專利賴之措 Ο 以:二1=處理腔室在連續軌道上傳送基板之輸送構件 2際上形成連續執道之底部饋料滾筒為特徵。基板位於 底4饋料滾筒上,基板之底面接觸底部饋料滾筒,且因此 :底:饋料滚筒上且藉由底部饋料滾筒輸送。根據本發 牲輸送構件亦以安置於底部饋料滾筒上之頂部輸送滾筒 2徵/。此等頂部輸送滾筒位於基板之頂面上。頂部輪送 二:以彼此分離之個別滾筒為特徵’該等個別滾筒安置且 安裝於頂部輸送軸上。此等個別滾筒以彼此間相對小之間 隙(例如幾個毫米)為特徵。此外,為每—個別滾筒提供驅 動構件,以使其不僅有助於基板之安全及均一輸送,且尤 其不會在敏感基板之頂面上研磨且不會對其有負面影響, 尤2機械性影響。頂部輸送軸上之個別滾筒上之軸承二徑 向空隙為特徵以使個別滾筒可相對於輸送軸在徑向方向上 移動。此徑向空隙使得在剛性頂部輸送軸上之每—個別滾 筒此夠可能適當地位於基板之頂面上。此不僅關於基板厚 度之可能差異適用,且尤其亦適用於以下情況:若干基板 139764.doc 201003825 在連 '卞軌道上彼此相鄰且未停置於一基板上之滾筒重量不 會另外置於相鄰基板上且給相鄰基板施加機械應力,而 疋钕置於(例如)底部饋料滾筒上或由剛性頂部輸送軸支撐 而不向另基板施加應力。此外,經由徑向空隙可有利地 提供將個別滾筒以其自身重量下之接觸力支撐於基板之頂 面上。因此,儘管量值較小,但亦存在某一支撐力。對於 每一基板而言,此係限於單一個別滾筒之重量。 本發明之-大優點在於以下事實:經由應有利地經由待 處理基板之全部寬度延伸之個別滾筒,對於若干欲在連續 軌道上輸送之相鄰基板而言,該基板之頂面不僅另外麵由 與處理介質接觸而潤濕。舉例μ,晶圓紋理化用 於太陽能電池時,在用諸如蝕刻液體或類似介質之介質處 理期間可將放出之氣泡移除或轉移離開。在此方面,藉由 本發明之此實施例,個別㈣不具有類似於電接觸基板之 任務’而是均-地分配處理介質以及移除其所位於之基板 頂面上之氣泡。 徑向空隙尤其亦滿足個別滚筒相料於了5 μ认 π很问相對於頂部輸送軸之可3 動性’及因此相對於其他個別滾筒. 〜艰冋在垂直方向中之可移3 性’藉此輸送轴有利地不可在其抽*中移動。尤其有^ 的’個別滾筒之徑向可移動性可能在各個方向中,因為」 易於經由設計解決。同樣,在無 / 付评黃負载之個別〉、 筒之情況下自由可移動性亦可Α古4|丨&amp; 马有利的。因此,結構可」 易地固持。個別滾筒相對於頂邱仏、、, 貝邛輪达軸之徑向可移動性. 介於個別滾筒之直徑的1%與2〇%之鬥.,,, 之間。有利地,此等值, 139764.doc 201003825 、力5 /°至1 0 /❶,因為輸送轴上之個別滾筒之足夠承載仍然總 得到保證。 闕於徨向可移動性或徑向空隙之結構實施例,個別滾筒 可以縱向孔為特徵,輸送軸經由該縱向孔而定位。縱向孔 之直徑大於輸送軸之直徑,作為形成徑向空隙之方法,個 別滾筒可經由該縱向孔在輸送軸上於徑向方向中移動。縱 向孔之直徑以上文提及之比例大於頂部輸送軸之直徑。輸 送軸及縱向孔有利地為圓形。 一方面,個別滾筒應以彼此間儘可能多的間隙為特徵以 使八不彼此干擾或以使其各別徑向可移動性既不被相鄰個 別滾筒損害又不被相鄰個別滾筒劣化。另一方面,其應相 對寬以便覆蓋儘可能寬之基板且排出或擦去其表面上之液 體。因此推薦在輸送軸上之個別滾筒彼此之間提供幾個毫 米之間,例如最大i mm至1〇 _或甚至僅i咖至5咖之 間的間隙。 當在頂部輸送軸上之個別滾筒經由連續軌道之全部宽度 延伸時較為有利。為此,待處理之基板可在連續轨道上以 條帶形式位於彼此後方且在整個寬度上分別被個別滾筒覆 1。此外當個別滾筒比基板稍寬時係—優點。在如此實行 曰守,其可橫向上寬出或突出(例如)5%至2〇〇/。。 在本發明之另外實施例中’當頂部輸送軸之—者上之所 有個別滚筒相同地形成時係一優點。當裝置上所有個別滾 筒相同以使製造費用減少時尤其有利。 上文所提及之用於個別滾筒之驅動構件有利地亦以在其 139764.doc 201003825 與個別滾筒之卡人a 之徑向方向、(因此)在對應於轴承之徑向空隙 動構件之”,亦周方向中之空隙為特徵。經由此驅 '、料保當驅動個㈣筒時,此輸送轴上之 ψ同之“空隙未被損害。驅動構件可以自輸送軸突 :之突出物為特徵,其與個別滾筒上之相應的較大凹部卡 :或者,個別滾筒上之突出物亦可與輸送軸中之相應凹 ΒI χ出物有利地形成為固定於輸送轴或個別滾筒上 之刀離、.且件’較佳為永久地或不可拆卸地。 ^本發明之另外實施射,當輸送軸上之用於個別滾筒 之突出物以相對於彼此不同對準或定向為特徵,較佳亦指 。同方向日守係有利的。當使輸送轴旋轉時,將分別分配 =於駆動構件之彼此卡合所致之可能急衝性運動,以使此 t月況不會同時在幾個或所有個別滾筒中發生。料突出物 之角度可相對於彼此偏移相同量值,因此為大約36〇。除以 個別滾筒之數目。 若製造為固體或作為整體時,個別滾筒之表面可由硬塑 膠材料組成。有利地’其形成為軟性物,例如,由橡膠或 類橡膠材料製成。可將基板上之不均勻性或基板之不同厚 度部分變平’而使個別滾筒同時適當地位於基板頂面上或 位於其整個寬度上。經由此支撐狀態及爬行作用,可以 說,甚至藉由在基板頂面上之蝕刻方法,可將放出之氣泡 或雜質擠出。尤其由於個別滾筒在整個晶圓寬度上在頂面 上沿基本上線性接觸點爬行,可在矽晶圓之頂面上進行處 理介質之密集交換。以彼方式,完全撇去或爬行法在基板 139764.doc 201003825 頂面上發生或經達成,且因此移除干擾氣泡。 為能夠在個別滾筒上之橡膠表面上作業,有可能選擇硬 核用於個別滚筒(尤其具有上文提及之用於輸送轴之通 孔)’或用橡膠塗覆其。或者,可塗覆可交換之橡膠覆蓋 - 物例如形成為軟管且接著在張力下拉起之橡膠覆蓋物。 * 因此有可忐谷易且快速地將用過或損壞之橡膠覆罢物替 換。 1 〇 除實施方式及圖式之外,此等及另外之特徵亦來源於申 -請專利範圍,其中將本發明之-實施例之單獨之個別特徵 或經組合以形成分別呈子組合形式之若干特徵之個別特徵 在=他領域實施且可有利地描繪可取得專利之實施例(二 處尋求針對其之保護)。將本申請案再劃分成個別部分及 中間標題並未使在其下所提出之揭示内容在一般有效 面受到限制。 【實施方式】 (j 在圖式中示意性描繪且在下文中詳細解釋本發明之 例。該等圖如下所示。 在圖1中,描繪根據本發明之處理裝置丨丨,其可作為敕 個系統形成,例如類似於上文所提及之DE 10200503: 中所揭示者。該處理裝置n以複數個底部饋料滾筒13為 特徵,該複數個底部饋料滾筒13經由其形成之連續 整個寬度延伸。此外,饋料滾筒13係以本文未說明之 驅動。五個石夕晶圓彼此相鄰位於複數個底部饋料滚筒η 上,以便(可以說)五個成長列之石夕晶圓15在連續軌道二由 139764.doc 201003825 饋料滾筒1 3輸送。一個該個別 &gt; 曰 〜矽日日圓15可(例如)為且有一 邊長為約1 5 cm之矩形或正方形。 連續執道切晶圓15位於钱刻槽中(本文未,㈣ 執道切晶圓15經沈沒於_槽中,切_15在其底面 16及頂面17上被接觸。此可自以上所提及之加咖㈣ 38450 A1 已知。 為改良在連續軌道上之輸送以及㈣溶液切晶圓以 頂面17上之分配,將五個個別滾筒22安置於頂部輸送軸2〇 上,該頂部輸送軸20為連續驅動軸。如上所述,此等個別 滾筒(例如)係由塑膠製成且分別為相同形狀。正如圖2之截 面圖中所述,個別滾筒22以中央縱向孔23為特徵。輸送軸 2〇經由該中央縱向孔23裝配。顯而易見’縱向孔23之直徑 為大於輸送軸20之直徑約20%。此結果形成根據本發明之 徑向空隙,其中個別滚筒22可相對於輸送軸2〇移動且因此 (例如)亦可在垂直方向中向上移動。因為個別滾筒22在相 對於彼此平行且垂直於矽晶圓丨5之通路方向上之導引被損 告’所以縱向孔23之直徑不應大於輸送軸2〇之直徑。 自圖2來看,顯然在個別滚筒22停置於右方上且其外側 面24位於石夕晶圓1 5之頂面1 7上之情況下,可以說個別滾筒 22未靠在輸送軸2〇上。相反,個別滾筒22之重量係由矽晶 圓15承載。由於在輸送轴2〇之頂面與縱向扎23之相對内部 面之間提供某一間隙,故此可識別。此具有以下作用:個 別滾筒22之重量停置於矽晶圓15上,且因此可(可以說)藉 由個別滾筒之重量設定相應接觸力。由於此接觸,可使矽 139764.doc 10 201003825 晶圓15之頂面17上之蝕刻溶液適當地分配、混合且再次更 新。 相反,位於最左方之個別滾筒並未位於矽晶圓。上,且 可以說僅靠在輪送軸上並同時靠在饋料$衰筒13上。個別滾 阊南度差可自虛線與點虛線之比較得出。虛線貫穿輸送 軸20之中點,點虛線貫穿最左方之個別滾筒。 此外,上述Μ 102007026081 A1中所提及之敍刻方法具 有以下問《 :氣泡可直接在♦晶圓15上形成。在硬晶圓^ 之底面1 6上,將藉由接觸在底部饋料滾筒13上形成之此等 氣泡移除或可以說滾動除去或擦去。以類似方式使在頂面 17上之個別滾筒22如此做。由於徑向空隙,根據本發明之 個別滚筒22之可移動軸承之優點現因a,由於個別滾筒在 輸送軸20上之剛性排列,故與底部饋料滾㈣之間隙必須 另外進行精確設定。由於可能时晶圓15之厚度之少許變 動’故此係困難的。此外’在某些情況下可將太大之璧力 力;夕曰曰圓15上,可導致其機械損壞或甚至毁壞。無論 如何應避免此情況。接著當在個職筒剛性安裝於頂㈣ 达軸20上之情況下’應經由可撓性個別滾筒(例如具有由 橡膠製成之軟性的外側面)達成某厚度均衡時,亦存在類 似危險。即使如此,仍存在太大壓力施加於矽晶圓上(尤 其其邊緣上)之危險。 欣本發明之—另外優點,即在頂部輪送軸20處若干個別滾 同二分配藉由圖1可見。若矽晶圓以不同厚度為特徵, 則貝牙可移動軸承之每―個別滾筒听用其重量位於石夕晶 139764.doc • 11 . 201003825 圓〗5之頂面1 7上並消除兮科态 “ μ ^處之氣泡或其類似者。此外, 如圖2左方所見之情形易為 t 勿马了犯(例如)’即無矽晶圓丨5位於 根據圖1之五個執道之—去 者中。相應之個別滾筒20可接著 自身降低至其下方之底部錯料、、奋々知】1 “ -丨謂#滾同1 3上’或相反仍僅由輸 送轴2 0固持。就此而言,接报加w、办# 徒供個別滾同22恰好高於底部饋 料滾筒13通常亦係有利的。若另外之石夕晶圓15到達此處, 則個別滾筒22自身類自動地自己提昇且在其頂面17上滚過 去。頂部輸送軸20之任務之一為提供個別滾筒以大致固 持及定位,以及驅動個別滾筒,纟在下文將詳細論及。 圖3中可見上文提及之根據本發明之頂部輸送轴上之 個別滾筒22之驅動,矽晶圓15之頂面〗7之爬行作用經由其 得以改良。壓圈26係固定於輸送軸2〇上,例如經螺旋固 定、膠合或焊接。此等壓圈26以在一側上之整體形成之突 出物27為特徵,以便壓圈26之橫截面為包括突出物”之圓 形。壓圈26固定於輸送軸2〇上之個別滾筒22之邊緣區上, 例如根據圖1之分別在右方末端區之個別滚筒22。此處個 別滾筒22不僅以圓形縱向孔23為特徵,亦以凹部29為特 徵,該凹部29之形狀對應於上述壓圈26連同突出物27之橫 截面之形狀。然而,在個別滾筒22中之該凹部29稍大(例 如)2 mm至5 mm間隙’參見圖3。有利地,此間隙類似地 與根據圖2之縱向孔23之半徑與輸送軸20之半徑之間的差 值一樣大,在某些情況下量值稍小。以此方式,確保具有 壓圈26及突出物27之驅動構件既不限制又不損害輸送轴2〇 上之個別滾筒22之可移動軸承或徑向空隙(詳言之,在垂 139764.doc 12 201003825 直方向中)。此外,關於在圓周方向上至輸送軸2〇之扭矩 傳遞同樣亦達成某一空隙。其亦用於個別滾筒22在輸送軸 2 0上平滑及自由可移動性之作用。 此外,基於根據圖3之壓圈26上之突出物27之可見及分 別不同之疋向,可見根據圖!之五個個別滾筒22如何以在 單们輸送軸20上相對於彼此偏移之類似突出物”為特徵。 沿輸送軸之突出物27之角偏移可例如分別等於9〇。。201003825 VI. Description of the Invention: [Technical Field] The present invention relates to a device for processing a stone substrate or a flat object or a flat object at the beginning of the present invention, and a device for processing a substrate or a stone substrate The method. The present invention relates to a type of substrate for use in a substrate. [Prior Art] It is known from DE 1〇20〇5〇3845() A1 to transport a substrate or a flat object on a continuous track via a processing chamber that is disposed of. The continuous track is characterized by a conveying member in the form of a feed roller supported on the bottom drum on the bottom surface. On the top surface of the substrate, a narrow contact roller is mounted in a movable and elastic loading manner for establishing electrical contact with the top surface of the substrate to facilitate electrical forging. A similar processing device for processing a ruthenium wafer when manufacturing a solar cell with an etching solution as a so-called texturing method is known from DE 10 2007 026 081 A1. When so implemented, the bottom surface and the top surface of the substrate are simultaneously textured, in particular, the sawing damage on the substrate is eliminated. It is possible and uniform to make all surface textures of the various faces of the substrate important in order to obtain a solar cell of good efficiency which is later made from the germanium wafer. SUMMARY OF THE INVENTION It is an object of the present invention to provide a device as mentioned above and a method for avoiding the disadvantages of the state of the art, and in particular, the object of the invention is that the substrate may be exposed to mechanical stress with minimal exposure. The texture of each surface of the substrate may be uniform and full surface. 139764.doc 201003825 This task is solved by a method having the features of claim 12 as in claim 1. It is too much, and has the objectives of other technical solutions and is explained in detail in the following paragraphs. Most of the discussion is only about the device or method description, but it should be applied to both regardless of the content. A Μ /, Λ2ηη8ίρ/1 In addition, the same applicant's priority application Μ 102008022282 8 in the ’ ’ ’ 月 月 月 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 。 。 。 。 。 。 。 。 。 。 。 。 。 。 ^Patent Measure Ο : 二 Ο Ο Ο Ο 二 二 二 二 二 二 二 二 处理 处理 处理 处理 处理 处理 处理 处理 处理 处理 处理 处理 处理 处理 处理 处理 处理 处理 处理 处理 处理The substrate is located on the bottom 4 feed roller, the bottom surface of the substrate contacts the bottom feed roller, and thus: the bottom: feed roller and conveyed by the bottom feed roller. According to the present invention, the transport member is also transported by the top transport roller 2 disposed on the bottom feed roller. These top conveyor rollers are located on the top surface of the substrate. Top Rotation 2: Features individual drums that are separated from one another. These individual rollers are placed and mounted on the top conveyor shaft. These individual rollers are characterized by a relatively small gap (e.g., a few millimeters) between each other. In addition, a drive member is provided for each of the individual rollers so that it not only contributes to the safe and uniform transport of the substrate, but also does not particularly grind on the top surface of the sensitive substrate without adversely affecting it, in particular 2 mechanical properties. influences. The bearing two radial clearances on the individual rollers on the top delivery shaft are characterized so that the individual rollers are movable in a radial direction relative to the delivery axis. This radial clearance allows each of the individual rollers on the rigid top delivery shaft to be properly positioned on the top surface of the substrate. This applies not only to possible differences in substrate thickness, but also to the following cases: several substrates 139764.doc 201003825 The weight of the drum adjacent to each other on the '卞 track and not resting on a substrate is not additionally placed in the phase Mechanical stress is applied to the adjacent substrate on the adjacent substrate, and the crucible is placed on, for example, the bottom feed roller or supported by the rigid top delivery shaft without applying stress to the other substrate. Furthermore, it is advantageously provided via the radial clearance to support the individual rollers on the top surface of the substrate with contact forces under their own weight. Therefore, although the magnitude is small, there is also a certain supporting force. For each substrate, this is limited to the weight of a single individual roller. A great advantage of the present invention resides in the fact that, via an individual roller that should advantageously extend over the entire width of the substrate to be processed, for a plurality of adjacent substrates to be transported on a continuous track, the top surface of the substrate is not only otherwise Wetting with contact with the treatment medium. For example, when wafer texturing is used in a solar cell, the emitted bubbles can be removed or transferred away during processing with a medium such as an etching liquid or the like. In this regard, with this embodiment of the invention, the individual (d) does not have a task similar to electrical contact with the substrate, but rather uniformly distributes the processing medium and removes air bubbles on the top surface of the substrate on which it is located. The radial clearance especially satisfies the individual roller phase. The 5 π π is very versatile with respect to the top conveying shaft and thus relative to the other individual rollers. Thereby the conveying shaft is advantageously not movable in its pumping*. In particular, the radial mobility of the individual rollers may be in all directions, as it is easy to solve via design. Similarly, in the case of no/pay for the individual load of the yellow load, the free mobility can also be used for the benefit of the horse. Therefore, the structure can be easily held. The radial movability of the individual rollers relative to the top and bottom, and the Bentley wheel axis. Between 1% and 2% of the diameter of the individual rollers. Advantageously, this value, 139764.doc 201003825, force 5 / ° to 10 / ❶, because the sufficient load of the individual rollers on the conveyor shaft is still always guaranteed. In the structural embodiment of the slidability or radial clearance, the individual rollers may be characterized by longitudinal holes through which the delivery shaft is positioned. The diameter of the longitudinal bore is larger than the diameter of the delivery shaft, and as a method of forming the radial void, the individual rollers can be moved in the radial direction on the transport shaft via the longitudinal bore. The diameter of the longitudinal bore is greater than the diameter of the top transport shaft. The delivery shaft and the longitudinal bore are advantageously circular. In one aspect, the individual rollers should be characterized by as many gaps as possible between each other such that eight do not interfere with each other or such that their respective radial movability is neither damaged by adjacent individual rollers nor degraded by adjacent individual rollers. On the other hand, it should be relatively wide so as to cover the substrate as wide as possible and to discharge or wipe off the liquid on its surface. It is therefore recommended that the individual rollers on the transport shaft provide a gap between a few millimeters between each other, for example a maximum i mm to 1 〇 _ or even only between 1 coffee and 5 coffee. It is advantageous when the individual rollers on the top conveying shaft extend over the full width of the continuous track. For this purpose, the substrates to be treated can be placed behind each other in strips on successive tracks and individually covered by individual rolls 1 over the entire width. In addition, when the individual rollers are slightly wider than the substrate, the advantage is. In doing so, it can be widened or highlighted laterally (for example) 5% to 2 〇〇 /. . In an alternative embodiment of the invention, it is an advantage when all of the individual rollers on the top transport shaft are formed identically. It is especially advantageous when all of the individual rollers on the device are identical to reduce manufacturing costs. The drive members for the individual rollers mentioned above are also advantageously also in the radial direction of their respective rollers 138a in their 139764.doc 201003825, and thus in the radial clearance member corresponding to the bearing. It is also characterized by the gap in the circumferential direction. Through this drive, when the (four) cylinder is driven, the same gap on the conveying shaft is not damaged. The drive member may be characterized by a projection of the axon: the protrusions corresponding to the corresponding larger recesses on the individual rollers: or the projections on the individual rollers may also be adapted to the corresponding concave I in the delivery shaft. It becomes a knife that is fixed to the conveying shaft or the individual rollers, and the piece 'is preferably permanent or non-detachable. Additional implementations of the present invention are preferred when the projections for the individual rollers on the delivery shaft are characterized by different alignments or orientations relative to one another. It is advantageous in the same direction. When the conveying shaft is rotated, the possible slamming movements caused by the engagement of the raking members with each other are respectively assigned so that this tempo does not occur simultaneously in several or all of the individual rollers. The angles of the projections can be offset by the same amount relative to each other and are therefore about 36 inches. Divide by the number of individual rollers. When manufactured as a solid or as a unit, the surface of the individual rolls may be composed of a hard plastic material. Advantageously, it is formed as a soft substance, for example, made of a rubber or rubber-like material. The unevenness on the substrate or the different thickness portions of the substrate can be flattened' such that the individual rollers are simultaneously properly positioned on the top surface of the substrate or over the entire width thereof. By this support state and creeping action, it can be said that the discharged bubbles or impurities can be extruded even by an etching method on the top surface of the substrate. In particular, since individual rollers crawl along substantially linear contact points on the top surface over the entire width of the wafer, dense exchange of processing media can be performed on the top surface of the wafer. In one way, a complete skimming or crawling process occurs or is achieved on the top surface of the substrate 139764.doc 201003825, and thus the interfering bubbles are removed. In order to be able to work on the rubber surface on individual rollers, it is possible to select a hard core for the individual rollers (especially with the above-mentioned through holes for the conveying shaft)' or to coat it with rubber. Alternatively, an exchangeable rubber cover may be applied, such as a rubber cover formed into a hose and then pulled down under tension. * Therefore, it is possible to replace the used or damaged rubber cover with a quick and easy change. In addition to the embodiments and the drawings, these and other features are also derived from the scope of the patent application, in which individual individual features of the embodiments of the invention are combined or combined to form separate combinations. The individual features of several features are implemented in the field of <RTIgt; </ RTI> and may advantageously depict patentable embodiments (the two seek protection against them). Subdividing this application into individual parts and intermediate headings does not limit the disclosures presented below in general terms. [Embodiment] (j is schematically depicted in the drawings and the examples of the invention are explained in detail below. The figures are as follows. In Fig. 1, a processing device according to the present invention is depicted, which can be used as a The system is formed, for example, similar to that disclosed in DE 10200503: The treatment device n features a plurality of bottom feed rolls 13 through which the entire bottom feed roll 13 is formed over its entire width. In addition, the feed roller 13 is driven by an unillustrated one. The five stone wafers are adjacent to each other on a plurality of bottom feed rollers η so as to be able to say five growth columns. The continuous track 2 is conveyed by the feed roller 13 3 of 139764.doc 201003825. One of the individual > 曰 矽 矽 日 15 15 may, for example, be a rectangle or square having a side length of about 15 cm. The wafer 15 is located in the money groove (n., (4) the wafer 150 is sunk in the groove, and the slice _15 is contacted on the bottom surface 16 and the top surface 17. This can be added from the above mentioned Coffee (4) 38450 A1 is known. For improvement in the continuous track The transport on the track and (iv) the solution-cut wafer are dispensed on the top surface 17, and five individual rolls 22 are placed on the top transfer shaft 2, which is a continuous drive shaft. As described above, these individual rolls (for example) made of plastic and each having the same shape. As described in the cross-sectional view of Figure 2, the individual rollers 22 are characterized by a central longitudinal bore 23. The delivery shaft 2 is assembled via the central longitudinal bore 23. Obviously 'longitudinal The diameter of the aperture 23 is greater than about 20% of the diameter of the delivery shaft 20. This result forms a radial clearance in accordance with the present invention wherein the individual rollers 22 are movable relative to the delivery axis 2〇 and thus, for example, also upward in the vertical direction The movement of the individual rollers 22 in the direction of the passage parallel to each other and perpendicular to the 矽 wafer 丨 5 is damned 'the diameter of the longitudinal holes 23 should not be larger than the diameter of the conveying shaft 2 。. It can be seen that, in the case where the individual rollers 22 are parked on the right side and the outer side surface 24 is located on the top surface 17 of the stone wafer 15, it can be said that the individual rollers 22 are not resting on the conveying shaft 2〇. , the weight of the individual rollers 22 The amount is carried by the crucible wafer 15. Since a certain gap is provided between the top surface of the conveying shaft 2 and the opposite inner surface of the longitudinal strand 23, it is identifiable. This has the following effect: the weight of the individual drums 22 is stopped. The wafer 15 is on the wafer 15, and thus the corresponding contact force can be set by the weight of the individual rollers. Due to this contact, the etching solution on the top surface 17 of the wafer 15 can be properly distributed. In contrast, the individual rollers on the far left are not located on the crucible wafer, and can be said to rest only on the transfer shaft and at the same time on the feed failure tube 13. The difference can be derived from the comparison of the dotted line and the dotted line. The dotted line runs through the midpoint of the transport shaft 20, and the dotted line runs through the individual rollers on the far left. Further, the characterization method mentioned in the above-mentioned Μ 102007026081 A1 has the following question: "The bubble can be formed directly on the ♦ wafer 15. On the bottom surface 16 of the hard wafer, these bubbles formed by contact on the bottom feed roller 13 are removed or can be said to be removed or wiped off by rolling. The individual rollers 22 on the top surface 17 are made in a similar manner. Due to the radial clearance, the advantages of the movable bearing of the individual rollers 22 according to the present invention are due to a. Since the individual rollers are rigidly arranged on the conveying shaft 20, the gap with the bottom feeding roller (four) must be additionally accurately set. This is difficult because of the slight variation in the thickness of the wafer 15 when possible. In addition, it may be too powerful in some cases; it may cause mechanical damage or even destruction. This should be avoided no matter what. Then, when the individual cylinder is rigidly mounted on the top (four) shaft 20, a certain thickness balance should be achieved via a flexible individual cylinder (e.g., having a soft outer side made of rubber). Even so, there is still a risk of too much pressure being applied to the silicon wafer, especially on its edges. An additional advantage of the invention is that several individual rolls are distributed at the top transfer shaft 20 as seen in Figure 1. If the wafer is characterized by different thicknesses, then the weight of each individual cylinder of the movable tooth bearing is located on the top surface of the stone 139764.doc • 11 . 201003825 round 5 and eliminate the 兮 兮 state "The bubble at μ ^ or the like. In addition, as seen on the left side of Figure 2, it is easy for t to make a mistake (for example) 'that is, the flawless wafer 丨 5 is located in the five ways according to Figure 1 - In the case of the player, the corresponding individual rollers 20 can then be lowered to the bottom of the bottom of the drums, and the first roller 20 can be held by the conveyor shaft 20 or the opposite. In this regard, it is generally advantageous to receive the addition of w, and to make the individual rolls 22 just above the bottom feed roll 13 . If another stone wafer 15 arrives here, the individual rollers 22 themselves automatically lift themselves and roll over their top surface 17. One of the tasks of the top delivery shaft 20 is to provide individual rollers for substantially holding and positioning, as well as to drive individual rollers, as will be discussed in more detail below. The driving of the individual rollers 22 on the top transport shaft according to the present invention as mentioned above can be seen in Fig. 3, and the creeping action of the top surface 7 of the tantalum wafer 15 is improved therethrough. The pressure ring 26 is attached to the delivery shaft 2, for example by screwing, gluing or welding. The pressure rings 26 are characterized by integrally formed projections 27 on one side such that the cross-section of the pressure ring 26 is a circular shape including protrusions. The pressure ring 26 is fixed to the individual rollers 22 on the delivery shaft 2〇. On the edge regions, for example, the individual rollers 22 in the right end region according to Fig. 1, respectively, the individual rollers 22 are characterized not only by the circular longitudinal holes 23 but also by the recesses 29, the shape of which corresponds to The press ring 26 is in the shape of a cross section of the protrusion 27. However, the recess 29 in the individual drum 22 is slightly larger (for example) 2 mm to 5 mm gap 'see Fig. 3. Advantageously, this gap is similarly and based on The radius of the longitudinal bore 23 of Figure 2 is as large as the difference between the radius of the delivery shaft 20, and in some cases the magnitude is slightly smaller. In this way, it is ensured that the drive member with the collar 26 and the projection 27 is neither The restriction does not damage the movable bearing or radial clearance of the individual rollers 22 on the transport shaft 2 (in detail, in the straight direction of 139764.doc 12 201003825). Furthermore, regarding the circumferential direction to the transport shaft 2〇 The torque transmission also achieves a certain gap. It is used for the smoothing and free mobility of the individual rollers 22 on the conveying shaft 20. Further, based on the visible and different directions of the projections 27 on the pressing ring 26 according to Fig. 3, it can be seen that according to the figure! How the individual rollers 22 are characterized by similar protrusions that are offset relative to each other on the single delivery shaft 20. The angular offset of the projections 27 along the conveying axis can be, for example, equal to 9 分别, respectively. .

一自圖1亦可見個別滾筒22相對於彼此之間隙總計為幾個 宅米。其亦可稍小。為防止輸送軸2G上之個別滾㈣之轴 向私動’仍可另外在輸送軸20上之壓圈26上提供另外、美 本上類似之塵圏’例如在個別滾筒之其他各別末端處心 亦可以類似於根據圖3之突出物27的突出 用作驅動構件,但不必如此做。 凌筒之此實施例之另外較大優點在於 徑向空陈及可移動性,其必須既不以分開之構件二 不以額外構件An ’、、寺徵亦 且县μ 為極簡單以及極穩固的, 易於製造,亦安全並為操作可靠的。 【圖式簡單說明】 ㈣本發明之處理裝置在連續執道之方向令觀 Τ'圖_’其具有底部饋料滾筒及頂部個別滾筒。 圖2展示顯現輸送軸上之個別滾_ &gt; ^ i 視圖,及 職同之徑向空隙的放大側 繪之驅動構件 圖3展示類似於圖2之視圖,其具有所描 【主要元件符號說明】 139764.doc •13- 201003825 11 處理裝置 13 底部饋料滾筒/饋料滾筒 15 石夕晶圓 16 矽晶圓15之底面/矽晶圓(15)之表面 17 矽晶圓1 5之頂面/矽晶圓(1 5)之表面 20 頂部輸送軸/輸送軸 22 個別滾筒 23 中央縱向孔/縱向孔/圓形縱向孔 24 個別滾筒之外側面 26 壓圈 27 突出物 29 凹部 139764.doc -14 -It can also be seen from Figure 1 that the gaps of the individual rollers 22 relative to each other amount to a few house meters. It can also be slightly smaller. In order to prevent the axial movement of the individual rollers (four) on the transport shaft 2G, it is still possible to additionally provide an additional, similarly similar dust mites on the pressure ring 26 on the transport shaft 20, for example at other individual ends of the individual rollers. The heart can also be used as a drive member similar to the protrusion of the protrusion 27 according to Fig. 3, but this need not be done. Another major advantage of this embodiment of the cylinder is the radial vacancies and mobility, which must be neither separate components nor additional components An ', the temple sign and the county μ are extremely simple and extremely stable. Easy to manufacture, safe and reliable. [Simple description of the drawings] (4) The processing apparatus of the present invention has a bottom feed roller and a top individual roller in the direction of continuous execution. Figure 2 shows the individual roll _ &gt; ^ i view on the transport axis, and the enlarged side of the drive member of the radial gap. Figure 3 shows a view similar to Figure 2, with the description of the main components 139764.doc •13- 201003825 11 Processing Unit 13 Bottom Feed Roller/Feed Roller 15 Shixi Wafer 16 底面The bottom surface of the wafer 15/the surface of the wafer (15) 17 顶The top surface of the wafer 1 5 / 矽 wafer (1 5) surface 20 top conveying shaft / conveying shaft 22 individual drum 23 central longitudinal hole / longitudinal hole / circular longitudinal hole 24 individual drum outer side 26 compression ring 27 protrusion 29 recess 139764.doc - 14 -

Claims (1)

201003825 七、申請專利範圍: r 1 種經由一具有處理介質之處理腔室在—連續軌道上用 於處理矽晶圓或基板之處理裝置,特別地用於矽晶圓之 蝕刻裝置,特別地該處理介質為蝕刻溶液,該處理裝置 具有經由該處理腔室在該連續軌道上用於傳送該基板之 輸=構件’其中該輸送構件以沿該連續軌道之底部饋料 滾筒為特徵,其中該等基板以其底面位於該等底部饋料 滾筒上’該處理裝置之特徵在於該輸送構件亦以在該等 底部饋料滾筒上之頂部輸送滾筒為特徵,該等頂部輸送 滚筒在—個別滾筒之整個寬度上支揮於該基板之頂面 二其中該㈣部輸送滾“彼此分離、在—頂部輸送 特徵彼Γ㈣且具有—相對於彼此之間隙的個別滾筒為 …、中為每—個別滾筒提供該等驅動構件,且 該等個別滾筒之,以-徑:空 隙用於該等個別滾筒相對於該輸送 釉在k向方向中之較佳自由可移動性。 2. 如請求項}之裝置’其特徵在於該徑向空隙 Μ個別滾筒相對於該頂部輸送轴之 = ::,…半徑一叫較=: 3. :請求項丨或2之裝置’其特徵在於對於 3 ’該個別滾筒以-縱向孔為特徵,該广除而 向孔延伸,且該縱向孔之直徑大於 及由邊縱 徑。 。卩輪送軸之直 139764.doc 201003825 4.之裝置,其特徵在於在該輪送轴上之峨 ⑽同相對於彼此之間的該間隙為最大若干毫米 1 mm。 乂1土 5_ :請求項1之裝置,其特徵在於在該頂部輪送轴上之所 形狀皆相同,尤其在該裝置之所有頂部輪送 軸上之所有個別滾筒形狀皆相同。 I ^求項1之裝置,其特徵在於用於—個別滾筒之該等 .δ構件以一在圓周方向中之空隙為特徵,盆中驅 動構件較佳以-自該輸送軸突出之特 '二 送轴…1 相應凹部卡合,其中該頂部輸 之该突出物較佳作為一分離组件而固定。 7.:請求項6之裝置,其特徵在於在一頂部輸送轴 、固別滾筒之所有突出物以不同對準 佳彼此角度分別偏移相等之量度。 白為特徵,較 8·如。月求項!之裝置,其特徵在於 軟性的,冬、计y ’农同之—表面係 尤八係由橡膠製成以使_基板上之 基板之不同厚度部分變次 上確保該個別W基板之整個寬度 ㈣“在縣板之該頂面上之良好支撐。 '^項1之|置,其特徵 滾筒之一*心括^ 怿胗層塗覆於該個別 工 較佳以一軟管之形式安。 10 _如請求項1之梦罟 甘此 v 蓉個特徵在於在該頂部輪送軸上之兮 衰筒經由該連續軌道之整個寬度延伸A 個別滾筒較佳寬度相等。 L伸’其中所有 11. 士 Μ求項i之骏置,其特徵 刑达及待處理之該等 139764.doc 201003825 基板上之該等個別滚筒經以一方式調適以使得該等個別 滾筒比該等基板寬,較佳寬5%至20%。 1 2,種用於處理石夕晶圓(〗5)或基板之方法’尤其該基板為 用於製造太陽能電池之基板,其中該矽晶圓(1 5)之表面 (16 ’ 17)經潤濕且因此用處理介質紋理化,該方法之特 徵在於具有寬度近似於矽晶圓之寬度之個別滾筒支撐於 該矽晶圓之頂面上,用於移除經由該處理介質與該矽曰曰 圓反應之紋理化期間放出之氣泡,其甲該等個別滾筒經 導引以使其在其自身重量下總是直接位於該矽晶圓之該 表面上。 13.如請求項12之方法,其特徵在於在該石夕晶圓⑴)之咳頂 面(17)上進行處理介質之密集交換,尤其經由個別Μ 在該頂面上沿一基本上線性接觸線攸行而密集交換’ 佳使該頂面與個別滾筒在該基板之整個寬度上接觸/201003825 VII. Patent application scope: r 1 processing device for processing a germanium wafer or substrate on a continuous track via a processing chamber having a processing medium, in particular, an etching device for a germanium wafer, in particular The processing medium is an etching solution, the processing device having a transport member for transporting the substrate on the continuous track via the processing chamber, wherein the transport member is characterized by a feed roller along the bottom of the continuous track, wherein The substrate is located on the bottom feed roller with its bottom surface. The processing device is characterized in that the conveying member is also characterized by a top conveying roller on the bottom feeding roller, the top conveying roller being in the entire individual roller Width-supporting the top surface of the substrate 2, wherein the (four)-part conveying rollers are separated from each other, the top-side conveying features (four) and having a gap with respect to each other are ..., each of the individual rollers is provided a driving member, and the individual diameters of the individual rollers are used in the k-direction of the individual rollers relative to the conveying glaze Free mobility 2. The device of claim 1 is characterized by the radial gap Μ individual drums relative to the top transport axis = ::, ... radius one called =: 3. : request item 丨 or 2 The device 'is characterized in that the individual drums are characterized by a longitudinal hole for the 3', and the widening extends toward the hole, and the diameter of the longitudinal hole is larger than the longitudinal diameter of the side. The straight wheel of the wheel is 139764.doc 201003825 4. Apparatus, characterized in that the weir (10) on the wheel axle is at most a few millimeters 1 mm with respect to the gap between each other. 乂1土5_: The device of claim 1, characterized in that at the top The shapes on the wheel axle are the same, especially all the individual drum shapes on all the top wheel axles of the device are the same. The device of claim 1 is characterized by the use of the individual rollers. The member is characterized by a gap in the circumferential direction, and the driving member in the basin is preferably engaged with a corresponding recess of the 'two feed shafts...1 protruding from the transport shaft, wherein the protrusion of the top portion is preferably used as a Separate components and fix them. 7.: Request The device of 6 is characterized in that all the protrusions of the top conveying shaft and the fixing roller are offset by the same angles of different alignments, and the angles of the projections are equal to each other. It is characterized in that the soft, winter, and y 'the same as the surface system is made of rubber so that the different thickness portions of the substrate on the substrate are changed to ensure the entire width of the individual W substrate (four) "in the county Good support on the top surface of the board. '^ Item 1|Setting, one of the characteristics of the drum * heart ^ ^ 怿胗 layer applied to the individual work is preferably in the form of a hose. 10 _ The dream of claim 1 is characterized in that the casket on the top transfer axle extends through the entire width of the continuous track A. The individual rollers preferably have the same width. L extensions of all of them 11. The stipulations of the items i, the characteristics of the stipulations and the pending 139764.doc 201003825 the individual rollers on the substrate are adapted in such a way that the individual rollers are The substrate is wider, preferably 5% to 20% wider. 1 2, a method for processing a stone wafer (〗 5) or a substrate, in particular, the substrate is a substrate for manufacturing a solar cell, wherein the surface (16 '17) of the germanium wafer (15) is run Wet and thus textured with a processing medium, the method is characterized in that an individual roller having a width approximately equal to the width of the germanium wafer is supported on the top surface of the germanium wafer for removal via the processing medium and the crucible The bubbles that are emitted during the texturing of the circular reaction, such that the individual rollers are guided such that they are always directly on the surface of the wafer under their own weight. 13. The method of claim 12, characterized in that the intensive exchange of the treatment medium is carried out on the cough top surface (17) of the Shixi wafer (1), in particular via a single Μ on the top surface along a substantially linear contact The line is hovering and densely exchanged. 'The top surface is in contact with the individual rollers over the entire width of the substrate / 139764.doc139764.doc
TW98113784A 2008-04-24 2009-04-24 Device and method for the treatment of silicon wafers or flat objects TW201003825A (en)

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