TWI306960B - - Google Patents
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- TWI306960B TWI306960B TW094110730A TW94110730A TWI306960B TW I306960 B TWI306960 B TW I306960B TW 094110730 A TW094110730 A TW 094110730A TW 94110730 A TW94110730 A TW 94110730A TW I306960 B TWI306960 B TW I306960B
- Authority
- TW
- Taiwan
- Prior art keywords
- top plate
- substrate
- liquid supply
- processing
- path
- Prior art date
Links
- 239000007788 liquid Substances 0.000 claims description 117
- 239000000758 substrate Substances 0.000 claims description 72
- 238000012545 processing Methods 0.000 claims description 65
- 238000004140 cleaning Methods 0.000 claims description 16
- 230000002093 peripheral effect Effects 0.000 claims description 9
- 238000012546 transfer Methods 0.000 claims description 5
- 238000005520 cutting process Methods 0.000 claims description 3
- 239000002245 particle Substances 0.000 description 25
- 238000005406 washing Methods 0.000 description 11
- 239000011521 glass Substances 0.000 description 5
- 238000011084 recovery Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000011144 upstream manufacturing Methods 0.000 description 4
- 230000006837 decompression Effects 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000010410 dusting Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000008267 milk Substances 0.000 description 1
- 210000004080 milk Anatomy 0.000 description 1
- 235000013336 milk Nutrition 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- -1 polyethylene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000035935 pregnancy Effects 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000009987 spinning Methods 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
- G01T7/00—Details of radiation-measuring instruments
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
- G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
- G01T1/16—Measuring radiation intensity
- G01T1/161—Applications in the field of nuclear medicine, e.g. in vivo counting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/08—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
- H01L31/085—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors the device being sensitive to very short wavelength, e.g. X-ray, Gamma-rays
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- High Energy & Nuclear Physics (AREA)
- Molecular Biology (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Power Engineering (AREA)
- Optics & Photonics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Biomedical Technology (AREA)
- General Health & Medical Sciences (AREA)
- Medical Informatics (AREA)
- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
- Electromagnetism (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Liquid Crystal (AREA)
- Weting (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Chemically Coating (AREA)
Description
:1306960 九、發明說明： 【發明所屬之技術領域】 本發明係有闕對於液晶面板、其他顯示用面板等使用 j各種用途之玻璃基板等片式基板，進行洗淨、㈣、顯 7、刺離等濕式處理所㈣之省液型處理液供給裝置之改 【先前技術】 文獻1，么\開—種濕式處理裝置，其設置有：, =成體广其形成有具有導入孔7之導入通路ι〇、具: 之^之排出料12、使導人通路u及排出通路12 理物1二予，又之父又部14，設置於交叉部14向被處 理物1開口之開口部6;及壓力控 處 與被處理物1接觸之濕式處理液之厂堅力盘大用以控制 使經由開口部6而與被處理物 之差，以 式處理後不流至排出通路12外。觸之濕式處理液’於濕 專利文獻2，記載有與專利 裝置之基本構造共通之片式洗㈡獻1所記載之濕式處理 (30B)之上方，設置有丨個 並且於下部筐體 内之玻璃基板。^個支揮镜⑽，以支撐單元 號【專利文獻1】 '本專利公開公報特開平，63153 號【專利文獻2】日本專利公開公報特開·2-280340 2014-7006-PF 5 1306960 【發明内容】 於專利文獻2,藉由支樓單元内之支撐輥，限制所搬 送玻璃基板之撓曲，然而將支撐滾設置於洗淨單元内部， 因支撐輥之轉動，會使支撐輥與軸承部之閭產生摩擦轉動 等而產生耗磨粉（顆粒particle)，因此原為進行洗淨之部 位，反而存在損害洗淨效果之可能。 本發明為鑑於上述事由而作，其目的在於提供一種處 理液供給裝置，於安裝#支撐滾軸之凹部底部，形成排液 路徑’將内部所產生之顆粒與處理液等―起排出，而適用 於基板處理。 本發明之處理液供給裝置係包括上部處理部及下部處 理部處理部具備：上部頂板，與所經過之基板上 表面相對面；上部液體供給路徑部’設置於上述上部頂板 之基板搬送方向之-側’將處理液供給至上述上部頂板之 下表面侧，及上部液體排出路徑部，設置於上述上部頂板 之土板搬送方向之另一側，將上述所供給之處理液從上述 上部頂板之下表面侧吸引排出；該下部處理部，與上述上 p處理β相對而设’其具備：下部頂板，與所經過之基板 下表面相對面，下部液體供給路徑部，設置於上述下部頂 板之基板搬送方向之一側，將處理液供給至上述下部頂板 之上表面側，及下部液體排出路徑部，設置於上述下部頂 板之基板搬送方向之另-側，將上述供給之處理液從上述 下ρ頁板之上表面側吸引排出；其中’上述下部頂板，於[1] The invention is based on a liquid crystal panel, other display panels, and the like, and is used for cleaning a liquid crystal panel or other display panel using a glass substrate such as a glass substrate for various uses, and (4), display 7, and thorn. The liquid-saving type processing liquid supply device of the iso-wet processing unit (4) is modified [Prior Art] Document 1, the open-opening type wet processing device, which is provided with: = adult body formed with the introduction hole 7 The introduction passage ι〇, the discharge material 12 of the nozzle, the guide passage u and the discharge passage 12, and the parent portion 14 are disposed at the opening of the intersection portion 14 to the object 1 to be processed. The portion 6 of the wet processing liquid in contact with the workpiece 1 at the pressure control portion is used to control the difference between the workpiece and the object to be treated via the opening portion 6, and does not flow to the discharge passage 12 after the treatment. outer. In the wet processing method 2, the wet processing (30B) described in the sheet washing (2), which is common to the basic structure of the patented device, is provided above and is provided in the lower housing. The glass substrate inside.支 支 ( ( 支 支 支 支 2- 2- 2- 2- 2- 2- 2- 2- 2- 2- 2- 2- 2- 2- 2- 2- 2- 2- 2- 2- 2- 2- 2- 2- 2- 2- 2- 2- 2- 2- 2- 2- 2- 2- 2- 2- 2- 2- 2- 2- 2- 2- 2- 2- 2- 2- 2- 2- In Patent Document 2, the deflection of the conveyed glass substrate is restricted by the support roller in the branch unit. However, the support roller is placed inside the cleaning unit, and the support roller and the bearing portion are caused by the rotation of the support roller. Then, frictional rotation or the like is generated to generate a powder (particle particle), so that the original portion is washed, and there is a possibility that the washing effect is impaired. The present invention has been made in view of the above circumstances, and it is an object of the invention to provide a processing liquid supply device which is configured to discharge a particle generated in the inside of a concave portion of a support roller and to discharge a particle generated from the inside and a treatment liquid. Processing on the substrate. The processing liquid supply device of the present invention includes an upper processing unit and a lower processing unit processing unit including an upper top plate facing the upper surface of the substrate that passes therethrough, and an upper liquid supply path portion 'provided in the substrate transporting direction of the upper top plate- The side 'the processing liquid is supplied to the lower surface side of the upper top plate, and the upper liquid discharge path portion is provided on the other side of the earth plate conveying direction of the upper top plate, and the supplied processing liquid is discharged from the upper top plate The lower processing unit is provided with a lower top plate facing the lower surface of the substrate, a lower liquid supply path portion, and a substrate transporting on the lower top plate. One side of the direction, the processing liquid is supplied to the upper surface side of the lower top plate, and the lower liquid discharge path portion is provided on the other side of the substrate conveying direction of the lower top plate, and the supplied processing liquid is supplied from the lower page The upper surface of the plate is sucked and discharged; wherein the above lower top plate is
2014-7006-PF 6 1306960 其上表面側所形成之所需個數之凹部内，具有轉動支撐 體，於其上端從上述下部頂板之上表面突出之高度位置， 可圍繞轉動支撐軸轉動而予以安裝；上述凹部，於其底部 形成有排液路徑。 若採用上述構成，伴隨近年來處理對象基板之尺寸逐 漸增大（例如··長度為1 300咖，寬度為n〇〇mm)，搬送至裝 置内之基板前端侧，或脫離裝置時之基板後端侧，以及基 板之中央部分位於裝置内時之該中央部分，可能會向下： 撓曲，而接觸下部頂板，但藉由轉動支標體，可適當防止 此撓曲，阻止與下部頂板接觸所引起之基板表面損傷等， f而可維持基板之品質，且可將基板正確維持於上部處理 ”下β處理部之間，因此亦可有效進行液體處理。 揮體二Γ於安裝有轉動支撐體之凹部底部，因轉動支 I _而產生顆粒，此顆粒將經由形成於凹部底部之 *處理中之基板= 排出。因此，顆粒不會附著於 表面，從而可適當進行基板處理。 在上述發明φ，L、上 口 f 述凹部為形成於上述下部頂板之缺 二之::::::缺，支撐，繞平行 從上述缺口部之底=動而予以轴支撐；上述排液路徑係 成，韓方所形成之小孔。若採用上述構 即使搬支推。 從缺口部底部所心 轉動而產生顆粒，該顆粒亦可 少成之小孔排出。 在上述發明中， 迷凹部於寬度方向僅設置既定個2014-7006-PF 6 1306960 The required number of recesses formed on the upper surface side thereof have a rotating support body, and the upper end thereof protrudes from the upper surface of the lower top plate at a height position thereof, and can be rotated around the rotation support shaft Mounting; the above recess has a draining path formed at the bottom thereof. According to the above configuration, the size of the substrate to be processed is gradually increased (for example, the length is 1,300 coffee, and the width is n〇〇mm), and the substrate is transferred to the front end side of the substrate in the device or the substrate is removed from the device. The end side, and the central portion of the central portion of the substrate when located in the device, may be deflected downward to contact the lower top plate, but by rotating the support body, the deflection may be appropriately prevented from contacting the lower top plate. The surface damage caused by the substrate, etc., can maintain the quality of the substrate, and the substrate can be properly maintained between the lower processing portions of the upper processing step. Therefore, the liquid treatment can be performed efficiently. At the bottom of the concave portion of the body, particles are generated by the rotation of the branch I_, and the particles are discharged through the substrate which is formed in the bottom of the concave portion. Therefore, the particles are not attached to the surface, so that the substrate treatment can be appropriately performed. Φ, L, upper port f The recessed portion is formed in the lower part of the lower top plate:::::: lack, support, and parallel to the bottom of the notch portion to be axially supported; The liquid discharge path is formed into a small hole formed by the Korean side. If the above-mentioned structure is used, even if it is moved, the particles are rotated from the bottom of the notch portion to generate particles, and the particles can be discharged in a small number of small holes. , the concave portion is only set in the width direction
2014-7006-PF 7 1306960 « 數’且於搬送方向僅設置既定個數。若採用上述構成，因 轉動支撐體於寬度方向及搬送方向，各設置所需個數，因 此於基板之全面可限制撓曲產生。 在上述發明中，上述排液路徑與上述下部處理部所形 成之共同路捏連通。若採用上述構成，即使形成多個轉動 支擇體，亦即形成多個排液路徑之情況，藉由共同路徑， 仍能以1條管線進行液體排出。 Φ 在上述發明中，上述支撐軸形成有洗淨液供給孔，延 伸至於轉動支撐體之内周面相對面之外周面。若採用上述 構成，即使在轉動支擇體與支擇軸之間，因產生摩擦轉動 ^生顆粒’仍可藉由洗淨液，將此顆粒從排液路徑有效 —々在述發明中，上述轉動支撐體之外周面呈紡錘狀。 右採用上述構成’轉動支撐體與基板之 小，則基板之接觸損傷隨之減小。 ^ 發明效果 =本發明，即使因轉動支標體之轉動而產， =:形成於凹部底部之排液路徑，將此顆粒與處理, 因此可防止顆粒附著於處理中之基板 攸而可適當進行基板處理。 顆粒=本㈣'可㈣歧缺4敎小孔，將產生之 採用本發明，因轉動支擇體於寬度方向及搬送方向， 2014-7006-pf 8 1306960 各设置所需個數，因此於基板之全面可限制撓曲產生。 採用本發明，即使形成多個轉動支撐體，亦即形成多 個排液路徑之情況，藉由共同路徑，仍能以丨條管線進行 液體排出。 採用本發明，即使在轉動支撐體與支撐軸之間，因產 生摩擦轉動而產生顆粒，仍可藉由洗淨液，將此顆粒從排 液路徑有效排出。 Φ 採用本發明，因轉動支撐體呈紡錘狀，所以縮小轉動 支撐體與基板之接觸面積，可抑制基板之接觸損傷。 【實施方式】2014-7006-PF 7 1306960 «Number' and only the predetermined number is set in the transport direction. According to the above configuration, since the number of required rotations of the support body in the width direction and the conveyance direction is set, the deflection of the substrate can be restricted. In the above invention, the liquid discharge path is in communication with the common path formed by the lower processing unit. According to the above configuration, even if a plurality of rotating support bodies are formed, that is, a plurality of liquid discharge paths are formed, the liquid can be discharged by one line by the common path. In the above invention, the support shaft is formed with a cleaning liquid supply hole extending to the outer circumferential surface of the inner peripheral surface of the rotary support. According to the above configuration, even if the frictional rotating particles are generated between the rotating supporting body and the supporting shaft, the particles can be effectively removed from the liquid discharging path by the cleaning liquid. The outer peripheral surface of the rotating support body is in the shape of a spindle. When the right configuration is used, the rotation support is smaller than the substrate, and the contact damage of the substrate is reduced. ^ Effect of the Invention = The present invention, even if it is produced by the rotation of the rotating support body, =: the liquid discharge path formed at the bottom of the concave portion, the particles are treated, thereby preventing the particles from adhering to the substrate being processed and being appropriately carried out Substrate processing. Particles = (4) '(4) Discrete 4 敎 small holes, which will be produced by the present invention, due to the rotation of the selected body in the width direction and the transport direction, 2014-7006-pf 8 1306960 each set the required number, so on the substrate The overall limit of deflection can be produced. According to the present invention, even if a plurality of rotary support bodies are formed, that is, a plurality of liquid discharge paths are formed, liquid discharge can be performed by the purlin line by the common path. According to the present invention, even if particles are generated by the frictional rotation between the rotating support and the support shaft, the particles can be efficiently discharged from the liquid discharge path by the cleaning liquid. Φ According to the present invention, since the rotating support body has a spindle shape, the contact area between the rotating support body and the substrate is reduced, and contact damage of the substrate can be suppressed. [Embodiment]
圖1為表示本發明所有關處理液供給裝置之一實施形 態之侧面剖視圖。處理液供給裝置丨，為液體回收（省液） i喷嘴裝置，叹置於玻璃基板GB之搬送路徑5〇途中，在 其上下方向之中央部位設置有具有相對於搬送路徑5〇進 行基板之搬入、搬出之既定間隙之基板通路，包含在上下 側相對而設之上部處理部1〇及下部處理部2〇。於本實施 例，作為液體處理，以使用純水等進行洗淨處理予以說明 於本實施形態，上部處理部10,具有長方體狀之筐错 11，此筐體11之下部，由頂板12構成，該頂板12與搬發 中之基板GB相對面而相距既定微小間隙。又，於值體^ 之搬送方向下游侧之側板適當位置，豎直設置有液體 路徑13，於搬送方向上游側之侧板適當位置，同樣豎直設 置有液體排出路徑14。液體供給路經13及液體排出路徑 2014-7006-PF 9 1306960 14’於寬度方向（圖1之紙面縱潘古& ^ tA囱縱/木方向），以所要數目相對 而設。又，液體供給路徑13及液體排出路徑“之下端尸 口之高度位置’設定為與頂板12之下表面大致位於同一: 面。 卞 液體供給路徑13，經由圖式省略之加職而連通於洗 淨液槽，另-方面，液體排出路徑14，經由圖式省 壓栗而連通於回收槽。藉由此構成’若於處理液供給裝置 1内，作為洗淨對象之基板GB藉由搬送路徑之親51 52而搬送至處理液供給裝置^，加㈣及減壓泵予㈣ 動’洗淨液從搬送中之基板⑼之前端㈣始，供哈至基板 GB之上表面與頂板12間之微小間隙。所供給之洗淨^， 於基板GB之上表面全面擴散’另一方面，利用因減壓泵而 於搬达方向上游侧之液體排出路徑14之下部開口周邊所 產生之負屢，洗淨液被吸往上游侧而流向裤出路徑…並 予以吸引排出。加壓泵所產生 夕自n進 澄位竿及減壓泵所產生 =^位準’以為使從液體供給路徑13供給至頂板12 GB之上表面之間之洗淨液，不會從側方漏茂，而大 由=體排出路徑14所吸引。加塵系、減塵系，可藉由圖 =略之泵驅動部，分別予以壓力調整。如此，洗淨液可 户相反於基板之搬送方向之方 洗淨效果。 Θ之方向-動，以便進一步提高 =處㈣2〇’、具有基本上與上部處理部ι〇大致相 下反向之構造。亦即，下部# 。 體狀之僮體21，此筐體21之 地° 〇’具有長方 Ρ由頂板22構成，該頂 2014-7006-PF 1〇 1306960 板22與搬送尹之基板GB相對面而相距既定微小間隙。又， 於筐體21之搬送方向下游側之側板適當位置，豎直設置有 液體供給路徑23 ’於搬送方向上游側之側板適當位置，同 樣置直設置有液體排出路徑24。液體供給路徑23及液體 排出路徑24 ’於寬度方向（圖i之紙面縱深方向），以所要 數目相對而設。又，液體供、給路徑23及液體排出路徑Μ 之上端開口之高度位置’設定為與頂板22之上表面大致位 於同一平面。 與上部處理部Π)相同，液體供給路徑23，經由圖式 ^之加壓栗而連通於洗淨液槽，另_方面，液體排出路 :24’經由圖式省略之減壓栗而連通於回收槽。藉由此構 L若於處理液供給裝置1内，作為洗淨對象之基板GB藉 由搬送路徑50之輥51、52 搬送至處理液供給裝置1内，BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a side cross-sectional view showing an embodiment of a processing liquid supply device according to the present invention. The liquid supply device 丨 is a liquid recovery (liquid-saving) i-nozzle device, which is placed on the middle of the transport path 5 of the glass substrate GB, and is provided at the center in the vertical direction with the substrate carried in with respect to the transport path 5 The substrate path for the predetermined gap to be carried out is provided with the upper processing unit 1 and the lower processing unit 2 including the upper and lower sides. In the present embodiment, the liquid processing is performed by using pure water or the like. In the present embodiment, the upper processing unit 10 has a rectangular parallelepiped basket 11 and the lower portion of the casing 11 is composed of a top plate 12. The top plate 12 is spaced apart from the substrate GB in the moving direction by a predetermined minute gap. Further, a liquid path 13 is vertically provided at an appropriate position of the side plate on the downstream side in the transport direction of the value body, and a liquid discharge path 14 is also vertically disposed at an appropriate position on the side plate on the upstream side in the transport direction. The liquid supply path 13 and the liquid discharge path 2014-7006-PF 9 1306960 14' are disposed in the width direction (the paper surface of Fig. 1 is longitudinal Pan & ^ tA chimney / wood direction), and the relative number is set. Further, the liquid supply path 13 and the liquid discharge path "the height position of the lower end of the corpse" are set to be substantially the same as the lower surface of the top plate 12. The liquid supply path 13 is connected to the wash by the addition of the figure. In addition, the liquid discharge path 14 is connected to the recovery tank via the pressure relief pump in the drawing, and the substrate GB serving as the cleaning target is transported in the processing liquid supply device 1 by the transport path. The pro-51 52 is transported to the processing liquid supply device ^, plus (4) and the decompression pump to (4) the moving liquid is supplied from the front end (four) of the substrate (9) in the transfer to the upper surface of the substrate GB and the top plate 12 a small gap. The supplied cleaning ^ is totally diffused on the upper surface of the substrate GB. On the other hand, the negative pressure generated by the lower portion of the liquid discharge path 14 on the upstream side in the transport direction by the decompression pump is used. The cleaning liquid is sucked to the upstream side and flows to the trousers exit path... and is sucked and discharged. The pressure pump generates the = 进 澄 竿 竿 竿 竿 减压 减压 减压 减压 减压 减压 减压 减压 减压 减压 减压 减压 减压 减压 减压 减压 减压 减压 减压 减压 减压 减压 减压 减压 减压 减压 减压To the top surface of the top plate of 12 GB The cleaning solution between the two will not be leaked from the side, but will be attracted by the body discharge path 14. The dusting system and the dust-removing system can be adjusted by the pump driving unit. The washing liquid can be washed in the opposite direction to the conveying direction of the substrate. The direction of the crucible is moved to further increase the position (4) 2〇', and has a structure substantially opposite to the upper processing portion ι. That is, the lower part #. The body of the body 21, the floor of the casing 21 〇' has a rectangular square which is composed of a top plate 22, and the top 2014-7006-PF 1〇1306960 board 22 is opposite to the substrate for transporting Yin In addition, the liquid supply path 23' is vertically disposed at an appropriate position on the upstream side of the transport direction on the downstream side of the side plate of the casing 21 in the transport direction, and is also provided with a liquid discharge path. 24. The liquid supply path 23 and the liquid discharge path 24' are disposed in opposite directions in the width direction (the depth direction of the paper surface in Fig. i). Further, the liquid supply path, the liquid supply path 23, and the liquid discharge path Μ upper end opening height position 'set as The upper surface of the top plate 22 is substantially flush with the same surface. Similarly to the upper processing unit, the liquid supply path 23 communicates with the cleaning liquid tank via the pressure pump of the drawing, and the liquid discharge path: 24' In the processing liquid supply device 1, the substrate GB to be cleaned is transported to the processing liquid supply device by the rollers 51 and 52 of the transport path 50. Within 1,
加壓泵及減壓泵予以驅動，渰 A 先孕液k搬送中之基板GB之前 端側開始’供給至基板GB之τ |二〜 之下表面與頂板22間之微小間 _隙。冼淨液之流向與上部處 理液㈣署彳… 情況相同。已通過處 二裳置1之基板GB，經由下游侧之搬送路徑5。之 輥53，進一步搬送至下游側。 於下部處理部20之頂缸00 .里七 板22，作為支撐所需個數基板 之轉動支撐體，設置有支禮 袞軸3〇。圖1中，於搬送方向 大致均等配置4個支撐滾輛 兩―叙’並且於寬度方向亦設置所 而仃數。隨處理對象之基板 ^ 之尺寸增大，以及為提高處 理效率，處理液供給裝置丨 ώ ^ % <搬送方向尺寸則相應增大， 由此搬送路徑50之輥52蛊 ，、輥53之距離增長，因此已通The pressure pump and the decompression pump are driven, and the front side of the substrate before the pre-pregnancy liquid k is transported is supplied to the τ of the substrate GB, and the second space between the lower surface and the top plate 22 is _ gap. The flow of the cleaning liquid is the same as that of the upper treatment liquid (4). The substrate GB having passed through the second side has passed through the transport path 5 on the downstream side. The roller 53 is further conveyed to the downstream side. The top cylinder 00 of the lower processing unit 20 is provided as a pivot support for supporting a required number of substrates, and a support shaft 3 is provided. In Fig. 1, four support rollers are arranged in the transport direction, and the number of turns is also set in the width direction. As the size of the substrate to be processed is increased, and the processing efficiency is increased, the processing liquid supply device 丨ώ ^ % < the transport direction size is correspondingly increased, whereby the roller 52 of the transport path 50, the distance of the roller 53 Growth, so it has been
2014—7006—PF 11 1306960 -頂板端側…重而向下方撓曲，則前端 質頂：22接觸，於基板表面造成損傷等，可能損及基板品 、’基板⑶之後側’及基㈣之中央部分 =題:支標滾軸3〇,於處理液供給裝置1内，於限制 隨於錢曲之同時，進行切搬送。支撐滾袖3〇， 圍、、堯於寬度方向平行之軸，而進行從動轉動。 供轴30’可於搬送方向，至幻個設置於處理液 液=裝置Γ搬送方向大致中間位置，但亦可對應於處理 尺寸厚产之搬达方向尺寸’處理對象之基板GB之長度 ί太眚…^及村^具有之繞曲程度1設定所需個數 實施形態令為4個）。於各支撐滾轴3〇之下方 排液路徑40。圖令雖未表示 乂成有 ^ 1 一排液路裎40，可經由吸引 連通於回收槽，於基板處理中此吸引…驅動。 圖2表示⑽滾轴及其安裝構造之剖_，⑷表 一實施形態，（b)表示第二實施形態。 於圖2⑷，支撐滾軸3〇,裝填於頂板22之上表面側 所形成之凹部（安裝孔）221内。凹部221，具有所要尺寸之 =:兩：其周圍侧壁中位於寬度方向(圖2之紙面縱深 )兩側壁，形成有水平支揮轉動軸31之軸承部222, 支樓滚軸3。可圍繞該轉動轴31轉動而予以軸支㈣動 =:ΓΓ兩側壁之上端延伸至轴承部222之插入 導引溝而予以插入拔出。凹邦 面，其中央部位形成為面向：=底部223大致為水平 向下方延伸，且具有所^Λ 於其下端穿設有 需4面面積之小直徑之排液用孔2014—7006—PF 11 1306960—The top end side of the top plate is deflected downwards, and the front end top surface: 22 contacts, causing damage on the surface of the substrate, which may damage the substrate, 'substrate (3) rear side and base (4) The central part = the title: the support roller 3 is placed in the processing liquid supply device 1, and the cutting and conveying are performed while restricting the money. Supporting the rolling sleeves 3〇, the circumference and the shaft are parallel to the axis in the width direction, and the driven rotation is performed. The supply shaft 30' can be disposed in the transport direction, and is disposed in the middle of the processing liquid-liquid=device-to-device transport direction, but can also correspond to the processing size of the processing size and the size of the substrate GB of the processing object.眚...^ and the village ^ have the degree of winding 1 set the number of implementation orders to 4). A drain path 40 is provided below each of the support rollers 3''. Although the illustration does not indicate that there is a 1 row of liquid passages 40, it can be connected to the recovery tank via suction, and is attracted by the substrate processing. Fig. 2 shows a cross-sectional view of the (10) roller and its mounting structure, (4) shows an embodiment, and (b) shows a second embodiment. In Fig. 2 (4), the support roller 3 is loaded into a recess (mounting hole) 221 formed on the upper surface side of the top plate 22. The recessed portion 221 has a desired size of =: two: two side walls of the peripheral side wall in the width direction (the depth of the paper surface of Fig. 2), and a bearing portion 222 that horizontally supports the rotating shaft 31 and a branch roller 3 are formed. The rotation of the rotating shaft 31 can be pivoted (four). The upper end of the two side walls extends to the insertion guide groove of the bearing portion 222 to be inserted and removed. In the concave surface, the central portion is formed to face: = the bottom portion 223 extends substantially horizontally downward, and has a small-diameter liquid discharge hole which is required to have a small area of 4 faces at the lower end thereof.
2014-7006-PF 12 1306960 24。圖中雖未表示，但此排液孔224之下端侧連通於圖工 所不之排液路捏40。再者，於圖2之例，頂板22為2層 構造，插人切滾軸30後所鋪設之上層板仏，將插入導 引溝封閉’以阻止轉動軸31掉出。又，於上層板…之上 表面侧’形成使㈣221之開口縮小之緣部，由此使凹部 221之開口面積減小，以有效抑制顆粒擴散。 支撐滾軸30，在其位於外周面之一部分從頂板22之 上表面露出之高度位置’由轉動軸31予以支撐。 若採用上述構成，搬入處理液供給裝置1内之基板 其下表面侧由支撐滾軸30予以支撐，因此不存在基板 GB向下方撓曲而與頂板22接觸之問題。又，支撐滾軸， 藉由基板GB之搬送力而予以從動，以圓滑進行基板⑶之 移送。即使支擇滾軸與轉動轴31之間因摩擦轉動而產生顆 粒等’此顆粒’可經由排液孔224，通過圖略之吸引栗予 以吸引，並經由排液孔224、排液路徑40，與洗淨液—起 回收至回收槽’因此顆粒不會進入頂板22之上表面，而混 入處于洗淨處理之洗淨液中’使洗淨效果降低，或損傷基 板GB之背面。 圖2(b)所示之支撐滾軸3〇之安裝構造，基本上與圖 2(3)大致相同。亦即，於頂板22之上表面側，形成有裝填 支撐滾軸30之凹部（安裝孔）221，於位於此凹部221之寬 度方向(圖2之紙面縱深方向)之兩側壁’形成水平支撐轉 動軸32之轴承部222 ’支撑滾軸3〇可圍繞該轉動軸μ轉 動而予以軸支撐，並且從上述兩側壁之上端至軸承部如， 2014-7006-PF 13 1306960 形成轉動軸32可插入拔出之插入導％溝。凹部22i之底立 223大致為水平面，其令央部位貫穿設置有向下方延伸，Ρ 且具有所需剖面面積之小徑之排液用孔224。 支撲滾軸30之外周寬度尺寸，為所需之較短尺寸，尤 其中央部位沿寬度方向呈紡錘狀(凸狀）。藉由此紡錘狀， 與基板GB之接觸面積予以減小，從而可減低基板之接觸損2014-7006-PF 12 1306960 24. Although not shown in the drawing, the lower end side of the drain hole 224 is connected to the draining path 40 of the drawing. Further, in the example of Fig. 2, the top plate 22 has a two-layer structure, and after the cutting roller 30 is inserted, the upper layer is laid, and the insertion guide groove is closed to prevent the rotating shaft 31 from falling out. Further, an edge portion at which the opening of the (4) 221 is narrowed is formed on the upper surface side of the upper layer, thereby reducing the opening area of the concave portion 221 to effectively suppress the diffusion of the particles. The support roller 30 is supported by the rotating shaft 31 at a height position where a portion of the outer peripheral surface is exposed from the upper surface of the top plate 22. According to the above configuration, the lower surface side of the substrate loaded into the processing liquid supply device 1 is supported by the support roller 30. Therefore, there is no problem that the substrate GB is deflected downward to come into contact with the top plate 22. Further, the support roller is driven by the conveyance force of the substrate GB to smoothly transfer the substrate (3). Even if the friction between the support roller and the rotating shaft 31 is generated by the frictional rotation, the particles can be sucked through the drain hole 224 through the suction port, and through the drain hole 224 and the drain path 40. It is recovered from the cleaning liquid to the recovery tank. Therefore, the particles do not enter the upper surface of the top plate 22, and are mixed into the washing liquid in the washing process to reduce the washing effect or damage the back surface of the substrate GB. The mounting structure of the support roller 3A shown in Fig. 2(b) is substantially the same as that of Fig. 2 (3). That is, on the upper surface side of the top plate 22, a concave portion (mounting hole) 221 for loading the support roller 30 is formed, and horizontal support rotation is formed on both side walls 'in the width direction of the concave portion 221 (the depth direction of the paper surface in Fig. 2). The bearing portion 222' of the shaft 32 supports the roller shaft 3 to be pivotally supported around the rotation shaft μ, and the rotation shaft 32 is inserted and inserted from the upper end of the two side walls to the bearing portion, for example, 2014-7006-PF 13 1306960 Insert the guide groove. The bottom portion 223 of the recess 22i is substantially a horizontal plane, and the central portion is provided with a drain hole 224 which extends downward and has a small diameter of a desired cross-sectional area. The outer peripheral width of the buckling roller 30 is a desired short dimension, and particularly the central portion is spindle-shaped (convex) in the width direction. By the spindle shape, the contact area with the substrate GB is reduced, thereby reducing the contact loss of the substrate.
傷。此纺錘狀亦可同樣適用於圖2(a)所示之支樓滾轴I 鲁 於頂板22之厚壁内，形成連通軸承部222及外部（頂 板22之側面或下面側）之液孔225。又，於轉動轴32之轴 内’同心狀之液孔321穿設至長度方向之中間部位，且於 轉動軸32之長度方向中間位置，穿設有沿徑向貫穿中心之 貫通液孔322。因此，液孔321及貫通液孔奶予以連通， 並且頂板22之液孔225與轉動軸之液孔321連通，結果液 孔225與貫通液孔322連通。而且圖中雖未表示，㈣液 孔225之外部開口側，經由供給系而連通於洗淨㈣，驅 瞻動此供給栗，可將洗淨液喷射供給至支撐滾軸⑽之内周壁 面。 若採用上述構成，於圖2(a)之情況相同，搬入處理液 供給裝置1内之基板GB，其下表面側由支撐滾轴3〇予以 支樓，因此不存在基板向下方繞曲而與頂板U接觸之 問題。又，支撐滾軸30’藉由基板GB之搬送力而予以從 動，可圓滑進行基板GB之移送。即使支樓滾轴3〇與轉動 軸32之間因摩擦轉動而產生顆粒等，此顆粒，可經由排液 孔224而予以吸引，並經由排液路徑4〇，與洗淨液一起回 2014-7006—PF 14 1306960 收至回收槽，因此不會進入頂板22之上表面，而混入處于 洗淨處理之洗淨液t，使洗淨效果降低，或損傷基板之 背面。又，洗淨液從液孔322喷射供給至支撐滾軸3〇之内 周壁面，因此即使支撐滾軸30與轉動軸32之間因摩擦轉 動而產生顆粒等，仍可進一步將此顆粒有效洗掉。又，於 基板處理結束之後，可洗淨附著有處理液之支撐滚軸30之 内周側壁，從而有效防止所附著之處理液（尤其在處理液不 為洗淨水’而採用藥液之態樣時）等因附著、乾燥所形成之 結晶等之附著，由此可長期確保支撐滾軸30之圓滑轉動。 圖3表示本發明所有關處理液供給裝置之一具體形態 之局部切面正視圖，圖4為圖3所示之處理液供給裝置之 局部切面側視圖。再者’於圖314,騎於說明，僅記 載有關支揮滚軸30之構成部分，®略部分基本上與圖1相 同0 圑hurt. The spindle shape can also be applied to the thick-walled wall of the top plate 22 shown in Fig. 2(a), forming a liquid hole communicating the bearing portion 222 and the outer portion (the side or the lower side of the top plate 22). 225. Further, a concentric liquid hole 321 is bored in the axial direction of the rotating shaft 32 to an intermediate portion in the longitudinal direction, and a through liquid hole 322 penetrating the center in the radial direction is bored at an intermediate position in the longitudinal direction of the rotating shaft 32. Therefore, the liquid hole 321 and the through-hole milk are communicated, and the liquid hole 225 of the top plate 22 communicates with the liquid hole 321 of the rotating shaft, and as a result, the liquid hole 225 communicates with the through liquid hole 322. Further, although not shown in the drawing, (4) the external opening side of the liquid hole 225 is connected to the cleaning (4) via the supply system, and the supply pump is driven, and the cleaning liquid is sprayed and supplied to the inner peripheral wall surface of the support roller (10). According to the above configuration, in the same manner as in the case of Fig. 2(a), the substrate GB carried into the processing liquid supply device 1 is supported by the support roller 3〇 on the lower surface side, so that the substrate does not bend downward. The problem of contact with the top plate U. Further, the support roller 30' is driven by the conveying force of the substrate GB, and the transfer of the substrate GB can be smoothly performed. Even if particles or the like are generated by the frictional rotation between the branch roller 3's and the rotating shaft 32, the particles can be sucked through the liquid discharge hole 224, and returned to the 2014 with the washing liquid via the liquid discharge path 4'. 7006-PF 14 1306960 is collected in the recovery tank, so it does not enter the upper surface of the top plate 22, and is mixed with the washing liquid t in the washing process to reduce the washing effect or damage the back surface of the substrate. Further, since the cleaning liquid is ejected from the liquid hole 322 to the inner peripheral wall surface of the support roller 3A, even if particles or the like are generated due to frictional rotation between the support roller 30 and the rotating shaft 32, the particles can be further washed. Drop it. Further, after the substrate processing is completed, the inner peripheral side wall of the support roller 30 to which the treatment liquid is attached can be washed, thereby effectively preventing the attached treatment liquid (especially when the treatment liquid is not used as the washing water). In the case of the sample, the adhesion of the crystal formed by adhesion or drying, etc., can ensure the smooth rotation of the support roller 30 for a long period of time. Fig. 3 is a partially cutaway front elevational view showing a specific embodiment of a processing liquid supply device according to the present invention, and Fig. 4 is a partial cross-sectional side view showing the processing liquid supply device shown in Fig. 3. Further, in Fig. 314, riding on the description, only the components of the supporting roller 30 are recorded, and the slight portion is substantially the same as that of Fig. 1.
、圓4所示之實施例，處理液供給裝置1之基 板搬送方向之長度尺寸約4QGmm’處理對象基板之長度尺 寸為寬度尺寸為議mm，支撑滾軸3G於搬送方 向以等間隔設置有6個，於寬度方向大致以等間隔設置有 5個，合計共設置3。個。又，支樓滾軸 用高分子聚乙稀等樹脂材料，以採用具有藥品耐受性之樹 = :::，其直徑約2〇_、寬度尺寸約一: 孔224二：Μ，各凹部221之底部所穿設之排液 跨越搬送方向，分別與共同路徑226( 並且於搬送方向之適當位置，以搬送方向之大致中央位置In the embodiment shown by the circle 4, the length of the substrate in the transport direction of the processing liquid supply device 1 is about 4QGmm. The length dimension of the substrate to be processed is the width dimension, and the support roller 3G is provided at equal intervals in the transport direction. In total, five are arranged at equal intervals in the width direction, and a total of three is set. One. In addition, the resin for the roller of the branch is made of a resin material such as polymer polyethylene, and the tree having the resistance of the product = :::, the diameter of the tree is about 2 〇, and the width is about one: hole 224: Μ, each concave portion The liquid discharged through the bottom of 221 spans the transport direction, and the common path 226 (and the appropriate position in the transport direction, the approximate central position of the transport direction)
2014-7006-PF 15 1306960 較為理想，與排液路裡40連通。排液路徑4〇’以圖 不之結構較為理想，收敛為i條，經由外部 通於回從而使凹部221内之液體可回收至回丨：:連 此外，本發明亦可採用以下形態。 但亦=作Λ轉声動較支/雜’採用外周寬度較短之切滾袖， 寬又較長之輥等以取代上述結構。於此 若於寬度方向間隔(部分地)形成多個，將:接觸 作，支㈣，不限於滾軸或輥 鐘狀繞轉動之構成。並且支#滾轴不限於纺 ，知照其材質或處理對象基板之種总 平之滾軸。 j採用扁 ⑵支擇絲之設置，於寬度方向、搬送方 狀，但不限於該設置 /成矩陣 智由 狀態，亦可採用格子狀設置。相斟认 寬度方向左右對稱支擇罝相對於 ^袞14 ’錢基㈣持平衡即可。 ⑺本實施形態中，已說明 參間因轉動摩擦而產生顆# 興轉動軸31之 W 王顆粒，亦即轉動軸31不韓動, 支樓滾軸30與轉動轴31一 θ子於 部222轉動之離樣，t ，轉動轴31相對於軸承 怎橡亦可同樣適用。 ⑷本實施形態中，已說明於頂板 以收容（内裝）支撐滾 。置凹4 221， w刊，作為凹部221之形站 以穿設之結構外，亦可採 形t，除僅予 體嵌入頂板22之結構。％ 牙滾軸收容空間之筐 ⑸穿設於轉動軸32之貫通液孔 開口，但亦可採用僅一方開口之卜周面予以 用母隔120度2014-7006-PF 15 1306960 Ideally, it is connected to the drain 40. The liquid discharge path 4〇' is preferably a structure which is not shown in the figure, and converges to i, and the liquid in the concave portion 221 can be recovered to the return through the external passage. Further, the present invention can also adopt the following form. However, it is also used to replace the above structure with a rolling sleeve having a short outer circumference and a wide and long roller. Here, if a plurality of portions are formed at intervals (partially) in the width direction, the contact is made, and the branch (four) is not limited to the configuration of the roller or the roller-shaped winding. And the support roller is not limited to spinning, and it is known that the material is the material or the roller of the substrate to be processed. j Use flat (2) to set the wire, in the width direction, and to move the shape, but it is not limited to the setting / matrix. It can also be set in a grid shape. According to the width direction, the left and right symmetry is balanced with respect to ^衮14 ’ Qianji (4). (7) In the present embodiment, it has been explained that the W-particles of the rotating shaft 31 are generated by the rotational friction of the stator, that is, the rotating shaft 31 is not moved, and the roller 30 and the rotating shaft 31 are θ-sub-portions 222. The rotation is off-sample, t, and the rotation shaft 31 is also applicable to the bearing. (4) In the present embodiment, the support roller has been described as being housed (inside) in the top plate. The recess 4 221, w magazine, as the structure of the recess 221, can be shaped in addition to the structure, except that only the structure of the top plate 22 is embedded. The basket of the tooth roller accommodating space (5) is inserted through the through hole opening of the rotating shaft 32, but it is also possible to use the circumferential surface of only one opening to be used 120 degrees apart.
2014-7006-PF 16 1306960 並且於長度方向可設置多個。 為從動式，但亦可設置驅動源以積 形成1個開口之結構 (6)支撐滾軸30 極搬送基板。 ⑺排液孔224與排液路徑40之連接位置，位於連通 路徑226之大致中央位置，但亦可位於排液孔m之正下 方02014-7006-PF 16 1306960 and a plurality of lengths can be set. It is a driven type, but a driving source may be provided to form a structure in which one opening is formed. (6) The roller 30-pole transfer substrate is supported. (7) The connection position of the drain hole 224 and the drain path 40 is located substantially at the center of the communication path 226, but may also be located directly below the drain hole m.
【圖式簡單說明】 理液供給裝置之一實施形 圖1為表示本發明所有關處 態側面剖視圖。 圖2為表示支撐滾轴及其安裝構造之剖面圖，⑷表示 弟一貫施形態，（b)表示第二實施形態。 圖3為表示本發明所有關處理液供给裝置之一具體形 態之局部切面正視圖。BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a side cross-sectional view showing a state of the present invention. Fig. 2 is a cross-sectional view showing a support roller and a mounting structure thereof, (4) showing a conventional embodiment, and (b) showing a second embodiment. Fig. 3 is a partially cutaway front elevational view showing a specific state of a processing liquid supply device according to the present invention.
4為圖3所示之處理 液供給裝置之局部切4 is a partial cut of the treatment liquid supply device shown in FIG.
面侧視圖。 主要元件符號說明】 1〜處理液供給裝置； 2 0〜下部處理部； 12、22〜頂板； 14、24~液體排出路徑 2 21〜凹部； 2 2 2 -•軸承部； 224〜排液路徑； 1 〇〜上部處理部； 11、2卜筐體； 13、23〜液體供給路徑；;3〇〜支撐滾軸； 31、32〜轉動軸（支撐軸 2 2 3〜底部； 225〜液孔；Side view. Explanation of main component symbols] 1 to processing liquid supply device; 2 0 to lower processing unit; 12, 22 to top plate; 14, 24 to liquid discharge path 2 21 to recess; 2 2 2 - • bearing portion; 224 to drain path ; 1 〇 ~ upper processing part; 11, 2 housing; 13, 23 ~ liquid supply path; 3 〇 ~ support roller; 31, 32 ~ rotating shaft (support shaft 2 2 3 ~ bottom; 225 ~ liquid hole ;
2014-7006-PF 17 1306960 226〜共同路徑； 321~液孔； 322〜貫通液孔； 40〜排液路徑。2014-7006-PF 17 1306960 226~ common path; 321~ liquid hole; 322~ through liquid hole; 40~ drain path.
2014-7006-PF 182014-7006-PF 18
Claims (1)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004131037A JP4206359B2 (en) | 2004-04-27 | 2004-04-27 | Treatment liquid supply device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200609562A TW200609562A (en) | 2006-03-16 |
| TWI306960B true TWI306960B (en) | 2009-03-01 |
Family
ID=35441015
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW094110730A TW200609562A (en) | 2004-04-27 | 2005-04-04 | Treatment liquid supply apparatus |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP4206359B2 (en) |
| KR (1) | KR100670630B1 (en) |
| TW (1) | TW200609562A (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100753498B1 (en) | 2005-08-02 | 2007-08-31 | 가부시키가이샤 퓨쳐비전 | Processing solution supplying apparatus |
| KR100785403B1 (en) * | 2006-11-27 | 2007-12-13 | 세메스 주식회사 | Apparatus and method for treating substrates |
| KR100873236B1 (en) * | 2007-06-14 | 2008-12-10 | 주식회사 실트론 | Apparatus for treating wafer |
| JP5372695B2 (en) * | 2009-10-19 | 2013-12-18 | 大日本スクリーン製造株式会社 | Substrate processing equipment |
| KR101307006B1 (en) * | 2012-03-14 | 2013-09-26 | 주식회사 디엠에스 | Apparatus for treating substrate |
| CN116175869B (en) * | 2022-10-31 | 2023-07-25 | 江苏正力新能电池技术有限公司 | Surface treatment device for battery top cover |
-
2004
- 2004-04-27 JP JP2004131037A patent/JP4206359B2/en not_active Expired - Fee Related
-
2005
- 2005-04-04 TW TW094110730A patent/TW200609562A/en not_active IP Right Cessation
- 2005-04-26 KR KR1020050034450A patent/KR100670630B1/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR20060046703A (en) | 2006-05-17 |
| TW200609562A (en) | 2006-03-16 |
| JP4206359B2 (en) | 2009-01-07 |
| KR100670630B1 (en) | 2007-01-17 |
| JP2005313014A (en) | 2005-11-10 |
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| MM4A | Annulment or lapse of patent due to non-payment of fees |