KR101837069B1 - Board water supplying unit for wet type auto cutting laminating apparatus for bonding board and film - Google Patents

Abstract

Disclosed is a substrate water supply unit for a wet automatic cutting laminating apparatus for substrate film adhering.
A substrate water supply unit for a wet autoclaving laminating apparatus for adhering a substrate film is applied to a wet autoclaving laminating apparatus for substrate film adhering a film to a substrate so as to supply water to the substrate surface A water supply roller member rotated while contacting with the substrate; And a water supply member for supplying water to the water supply roller member, wherein water supplied from the water supply member to the water supply roller member is supplied to the water supply roller member, When the moisture supply roller member is in contact with the substrate while being rotated.
According to the substrate water supply unit for a wet automatic cutting laminating apparatus for adhering a substrate film, a substrate water supply unit for a wet automatic cutting laminating apparatus for substrate film adhering comprises a moisture supply roller member; And a water supply member, water supplied from the water supply member to the water supply roller member is supplied to the water supply roller member, and the water supply roller member is rotated so that the water supply roller member The substrate may be deposited on the surface of the substrate when the substrate is in contact with the substrate. Therefore, the substrate can be uniformly supplied with an appropriate amount of moisture to the substrate in order to adhere the substrate to the substrate.

Description

Technical Field [0001] The present invention relates to a water supply unit for a wet automatic cutting laminating apparatus for bonding a substrate film,

The present invention relates to a substrate water supply unit for a wet automatic cutting laminating apparatus for substrate film adhering.

When a film is adhered to a substrate, a wet laminating method in which a film is adhered using a pressure roller in a state in which moisture is supplied to the substrate for adhesion between the substrate and the film is often used.

According to such a wet laminating method, the substrate and the film can be brought into close contact with each other without bubbles being generated between the substrate and the film.

Conventional wet autoclaving laminating apparatuses for substrate film adhesion for performing the wet laminating method include the following patent documents.

The substrate water supply unit for the wet autoclaving laminating apparatus for bonding the substrate film is applied to the wet automatic cutting laminating apparatus for bonding the substrate film to supply moisture to the substrate.

However, according to the conventional substrate water supply unit for a wet automatic cutting laminating apparatus for substrate film adhering including the above patent documents, the substrate is supplied with water in a dipping manner, that is, by immersing the substrate in a water- Accordingly, the amount of water applied to the substrate can not be controlled, and excessive moisture is supplied and uniformly supplied.

Registered Patent No. 10-1413636, Date of Registration: Apr. 24, 2014, Title of Invention: Cleaner device for wet sheet-to-roll laminator Registered Utility Model No. 20-0440443, Date of Registration: 2008.06.05., Name of Design: Feeder for printed circuit board laminator Registered Patent No. 10-1327404, Registered on April 11, 2013, entitled: Wet Laminator

It is an object of the present invention to provide a substrate water supply unit for a wet automatic cutting laminating apparatus for substrate film adhering, which enables the substrate to be uniformly supplied with an appropriate amount of water required for adhesion of the film to the substrate.

The substrate water supply unit for a wet automatic cutting laminating apparatus for substrate film adhering according to the present invention is applied to a wet automatic cutting laminating apparatus for adhering a substrate film to a substrate so as to supply moisture to the substrate surface Which is applied to a wet automatic cutting laminating apparatus for bonding a substrate film,
A water supply roller member rotated while contacting with the substrate; And a water supply member for supplying moisture to the water supply roller member,
The moisture supplied to the moisture supply roller member from the moisture supply member is supplied to the moisture supply roller member and the moisture supply roller member is rotated so that when the moisture supply roller member contacts the substrate, And,
The wet automatic cutting laminating apparatus for bonding a substrate film comprises a feed roller for feeding the substrate, a moisture supply member for supplying moisture to the surface of the substrate conveyed by the feed roller, A film feeding member for feeding the film onto the substrate; and a pressing member for pressing the substrate on which the film fed by the film feeding member is placed, so that moisture is removed between the substrate and the film, A substrate deflection preventing member for supporting the substrate toward the pressure roller so as to prevent any sagging of the substrate toward the pressure roller via the conveying roller; Guiding the film fed from the feeding member toward the pressure roller, A pressure roller side film guide member having a smooth curved surface so as to gradually approach the surface of the pressure roller toward the roller toward the pressure roller side and a pressure roller side film guide member disposed on the side of the substrate deflection preventing member, Side film deflection preventing film side guide member,
Wherein the substrate deflection preventing member includes a pair of substrate deflection preventing members arranged to be spaced apart from each other, and the substrate passes through a pair of the substrate deflection preventing members so that the substrate can be directed to the pressing roller without being sagged Wherein a gap between a pair of the substrate deflector bodies is wider than a thickness of the substrate and is wider than a thickness of the substrate so that the substrate is smoothly drawn in and penetrated, And the film supplied from the film supply member is guided to the pressure roller while passing between the film guide member on the side of the pressure roller and the film guide member on the side of the substrate deflection preventing member, The film guide member on the pressure roller side, and the film guide unit on the side of the substrate deflection preventing member Wherein the substrate deflection preventing member comprises a pair of film guiding members disposed to be spaced apart from each other between the substrate deflection preventing member and the pressing roller, Wherein each of the film guide bodies is disposed on a same line as each of the substrate deflection preventing members and is formed separately from each of the substrate deflection preventing members, Wherein the pressure roller-side end portion of each film guide body is formed in a tapered shape so as to be relatively thinner toward the pressure roller, so that the pressure roller-side film guide member and the substrate deflection- The film guided to the pressure roller by the member is guided by the film guide And is drawn into the pressure roller while being in contact with the substrate guided by the substrate deflection preventing member at the entrance portion of the pressure roller.

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According to one aspect of the present invention, there is provided a substrate water supply unit for a wet automatic cutting laminating apparatus for substrate film adhering, comprising: a water supply roller member for a wet automatic cutting laminating apparatus for adhering a substrate film; And a water supply member, water supplied from the water supply member to the water supply roller member is supplied to the water supply roller member, and the water supply roller member is rotated so that the water supply roller member The substrate can be adhered to the surface of the substrate when the substrate is in contact with the substrate. Thus, the substrate can be uniformly supplied with an appropriate amount of moisture to the substrate in order to adhere the substrate to the substrate.

1 is a perspective view showing a main configuration of a wet automatic cutting laminating apparatus for adhering a substrate film to which a substrate water supply unit for a wet automatic cutting laminating apparatus for adhering a substrate film according to an embodiment of the present invention is applied.
2 is a front view showing a main configuration of a wet automatic cutting laminating apparatus for adhering a substrate film to which a substrate water supply unit for a wet automatic cutting laminating apparatus for adhering a substrate film according to an embodiment of the present invention is applied.
3 is an enlarged view of a main portion of a wet automatic cutting laminating apparatus for adhering a substrate film to which a substrate water supply unit for a wet automatic cutting laminating apparatus for adhering a substrate film according to an embodiment of the present invention is applied.
4 is a perspective view showing a substrate water supply unit for a wet automatic cutting laminating apparatus for substrate film adhering according to another embodiment of the present invention.
5 is a plan view showing a substrate water supply unit for a wet automatic cutting laminating apparatus for substrate film adhering according to another embodiment of the present invention.
6 is a front view showing a substrate water supply unit for a wet automatic cutting laminating apparatus for substrate film adhering according to another embodiment of the present invention.

Hereinafter, a substrate water supply unit for a wet automatic cutting laminating apparatus for adhering a substrate film according to an embodiment of the present invention will be described with reference to the drawings.

FIG. 1 is a perspective view showing a main structure of a wet automatic cutting laminating apparatus for adhering a substrate film to which a substrate water supply unit for a wet automatic cutting laminating apparatus for adhering a substrate film according to an embodiment of the present invention is applied. 3 is a front view showing a main configuration of a wet automatic cutting laminating apparatus for adhering a substrate film to which a substrate water supply unit for a wet automatic cutting laminating apparatus for substrate film adhering according to an embodiment is applied. Figure 1 is an enlarged view of a main part of a wet automatic cutting laminating apparatus for bonding a substrate film to which a substrate water supply unit for a wet automatic cutting laminating apparatus for film adhering is applied.

1 to 3, a wet automatic cutting laminating apparatus 100 for bonding a substrate film according to an embodiment of the present invention includes a feed roller 110, a moisture supply member 130, a film supply member 140, A pressure roller 150, and a substrate deflection preventing member 160.

The conveying rollers 110 are composed of a plurality of conveying rollers 110 to convey the substrate to which the film is adhered toward the pressing roller 150. Although not shown, it is preferable that a plurality of the conveying rollers 110 are installed in front of the moisture supplying member 130.

Reference numeral 115 denotes a driving member such as a motor for rotating the conveying roller 110.

The moisture supplying member 130 supplies moisture to the surface of the substrate conveyed by the conveying roller 110.

Reference numeral 120 denotes a water storage member for storing moisture supplied to the water supply member 130. Reference numeral 126 denotes a water supply member which is accommodated in the water storage member 120, And numeral 125 is a supply pump for supplying the water stored in the water storage member 120 to the water supply member 130. [

The moisture stored in the moisture storage member 120 and supplied to the moisture supply member 130 by the supply pump 125 is sprayed with water on the surface of the substrate transferred by the transfer roller 110 give.

The moisture remaining in the substrate is reduced again to the moisture storage member (120).

The film supply member 140 supplies the film onto the substrate to which moisture is supplied by the moisture supply member 130.

The film supply member 140 may be arranged in a pair so as to be symmetrical with respect to the movement path of the substrate so that the film may be supplied to both the upper and lower surfaces of the substrate.

The pressing roller 150 presses the substrate on which the film supplied by the film supply member 140 is placed so that the film is adhered to the substrate while the moisture between the substrate and the film is removed.

The pressing rollers 150 are formed as a pair and press the film and the substrate together on the upper side and the lower side of the substrate on which the film is placed so that water supplied between the film and the substrate is released to the outside, So that the substrate and the film are brought into close contact with each other without bubbles. The pressure roller 150 may be rotated together with the driving member 115 or may be rotated by a separate driving unit.

Reference numeral 151 denotes a heating element disposed on the pressure roller 150 to generate heat. The heating element 151 generates heat, so that the pressure roller 150 is heated, so that adhesion between the film and the substrate can be improved .

Reference numeral 155 denotes a suction member capable of sucking air such as a ring blower. The suction member 155 protrudes from the film and the substrate in the process of adhering the film to the substrate, . ≪ / RTI >

The substrate deflection preventing member 160 supports the substrate toward the pressure roller 150 so that any deflection of the substrate toward the pressure roller 150 is prevented through the conveying roller 110. [

In detail, the substrate deflection preventing member 160 includes a pair of substrate deflection preventing members 161 arranged to be spaced apart from each other, and the substrate passes through between the pair of substrate deflection preventing members 161, The substrate can be directed to the pressure roller 150 without being sagged.

The gap between the pair of the substrate deflection preventing members 161 is slightly wider than the thickness of the substrate and the inlet portion is formed to be narrowed toward the inner side so that the substrate can be smoothly inserted and penetrated .

The wet automatic cutting laminating apparatus 100 for bonding a substrate film further includes a film supply member 140, a pressure roller side film guide member 170, and a substrate deflection prevention member side film guide member 175.

The film supply member 140 supplies the film to the substrate facing the pressure roller 150.

The pressure roller side film guide member 170 is disposed on the side of the pressure roller 150 and guides the film supplied from the film supply member 140 toward the pressure roller 150.

The pressure roller-side film guide member 170 has a smooth curved surface so as to be closer to the surface of the pressure roller 150 toward the pressure roller 150.

The substrate deflection preventing member side film guide member 175 is disposed on the side of the substrate deflection preventing member 161 to guide the film supplied from the film supplying member 140 toward the pressing roller 150.

The film supplied from the film supply member 140 is guided to the pressure roller 150 while passing between the pressure roller side film guide member 170 and the substrate deflection prevention member side film guide member 175.

The film supply member 140, the pressure roller side film guide member 170, and the substrate deflection preventing member side film guide member 175 are arranged in pairs so as to be symmetrical to each other with respect to the moving path of the substrate .

The substrate deflection preventing member 160 includes a pair of film guides 162 spaced apart from each other between the substrate deflection preventing member 161 and the pressing roller 150.

Each of the film guide bodies 162 is disposed in the same line as the substrate deflection preventing bodies 161 and may be integrally formed with the substrate deflection preventing bodies 161, 161 and may be disposed on an extension of each of the substrate deflection preventing members 161 on the side of the pressure roller 150. [

The end portions of the film guide bodies 162 on the side of the pressure roller 150 are tapered so as to be relatively thinner toward the pressure roller 150 so that the film guide member 162 is supplied from the film supply member 140, The film guided by the side film guide member 170 and the film deflection prevention member side film guide member 175 toward the pressure roller 150 is guided by the film guide 162 so that the pressure roller 150 to the pressure roller 150 while being in contact with the substrate.

Hereinafter, the operation of the wet automatic laminating apparatus 100 for adhering a substrate film according to the present embodiment will be described with reference to the drawings.

First, the substrate placed on the conveying roller 110 is conveyed toward the pressure roller 150 in accordance with the rotation of the conveying roller 110.

When the substrate transferred as described above passes through the water supply member 130, moisture is supplied to the substrate surface from the water supply member 130 in the form of spray or the like.

The substrate to which the moisture has been supplied is continuously conveyed to the pressure roller 150. At this time, the substrate can be stably transported by the substrate deflection preventing member 160 without being sagged.

The film supplied from the film supply member 140 is placed on the surface of the substrate conveyed as described above. The film is drawn into the pressure roller 150 in this state and is pressed by the pressure roller 150, And moisture between the film and the film is removed, so that the substrate and the film can be brought into close contact with each other.

After the substrate and the film are adhered to each other as described above, the end of the film is automatically cut by cutting means (not shown) such as a separate blade constituting the wet automatic cutting laminating apparatus 100 for adhering the substrate film .

As described above, the wet automatic cutting laminating apparatus 100 for adhering the substrate film is provided with the feed roller 110, the moisture supplying member 130, the film supplying member 140, the pressing roller 150, and the substrate deflection preventing member 160 It is possible to supply moisture and adhere the film onto the substrate in a state in which the substrate is stably transported, so that substrate defects such as bubbling due to the expansion between the substrate and the film can be minimized. .

Hereinafter, a substrate water supply unit for a wet automatic cutting laminating apparatus for adhering a substrate film according to another embodiment of the present invention will be described with reference to the drawings. In carrying out the above description, the description overlapping with the content already described in the embodiment of the present invention described above will be omitted and it will be omitted here.

FIG. 4 is a perspective view showing a substrate water supply unit for a wet automatic cutting laminating apparatus for adhering a substrate film according to another embodiment of the present invention, FIG. 5 is a perspective view of a wet automatic cutting laminating apparatus for substrate film adhering according to another embodiment of the present invention, Fig. 6 is a front view showing a substrate water supply unit for a wet automatic cutting laminating apparatus for substrate film adhering according to another embodiment of the present invention. Fig.

Referring to FIGS. 4 to 6, the substrate water supply unit 230 for a wet automatic cutting laminating apparatus for bonding a substrate film according to the present embodiment is applied to a wet automatic cutting laminating apparatus for bonding a substrate film to a substrate And includes a water supply roller member 285 and water supply members 236 and 237 capable of supplying moisture to the surface of the substrate in order to adhere the film.

Reference numeral 231 denotes a frame in which the water supply roller member 285 and a substrate attraction roller member 280 described later are rotatably connected.

The water supply roller member 285 rotates while contacting the substrate.

In detail, the water supply roller member 285 includes a lower water supply roller 287 to be brought into contact with the bottom surface of the substrate, and an upper water supply roller 286 to be in contact with the upper surface of the substrate.

The lower water supply roller 287 and the upper water supply roller 286 are rotatably connected to the frame 231 while being vertically engaged with each other.

The surface of the moisture supply roller member 285 may be made of at least one of a sponge and a fabric for moisture content. In this case, moisture is contained in the surface of the moisture supply roller member 285, and moisture contained therein when the moisture supply roller member 285 touches the substrate can be evenly adhered to the substrate.

The water supply members 236 and 237 supply moisture to the water supply roller member 285.

In detail, the water supply members 236 and 237 include a lower water supply member 237 for spraying water with the lower water supply roller 287, and an upper moisture supply member 236 for dropping moisture with the upper water supply roller 286. [ (236).

The lower water supply member 237 injects water toward the lower water supply roller 287 by a pump and the upper water supply member 236 drops moisture toward the upper water supply roller 286 by gravity I will.

The water supplied from the water supply members 236 and 237 to the water supply roller member 285 is supplied to the water supply roller member 285 and the water supply roller member 285 Is rotated, and the moisture supply roller member 285 contacts the surface of the substrate when it contacts the substrate.

The substrate water supply unit 230 for the wet automatic cutting laminating apparatus for bonding the substrate film includes a substrate drawing roller member 280 for allowing the substrate to be drawn toward the moisture supply roller member 285.

In detail, the substrate drawing roller member 280 includes a lower substrate drawing roller 282 to be brought into contact with a bottom surface of the substrate, and an upper substrate drawing roller 281 to be brought into contact with an upper surface of the substrate.

The lower substrate drawing roller 282 and the upper substrate drawing roller 281 are rotatably connected to the frame 231 while being vertically engaged with each other.

The substrate drawing roller member 280 is disposed on the front side of the moisture supply roller member 285 with reference to the drawing direction of the substrate. That is, the lower substrate draw-in roller 282 and the upper substrate draw-in roller 281 are arranged in the vertical direction, and the lower and upper substrate drawing rollers 282 and 281 Respectively. Thus, the substrate drawn by the substrate drawing roller member 280 can be smoothly drawn into the water supplying roller member 285. Therefore, in a state in which the lower water supply roller 287 and the upper water supply roller 286 are wet by the moisture supplied from the lower side water supply member 237 and the upper side water supply member 236, The lower substrate suction roller 282 and the upper substrate suction roller 281 are engaged with each other and the substrate is wetted while passing through the lower water supply roller 287 and the upper water supply roller 286.

The surface of the substrate pulling-in roller member 280 is made of at least one of urethane and sponge to prevent slipping of the substrate.

The substrate water supply unit 230 for the wet automatic cutting laminating apparatus for bonding the substrate film includes a drawing roller interlocking member 283 and a water supply roller interlocking member 288.

The pulling-in roller interlocking member 283 causes the lower substrate pulling-in roller 282 and the upper substrate pulling-in roller 281 to rotate in mutually opposite directions.

In detail, the drawing roller interlocking member 283 may be composed of a pair of spur gears connected to the rotation shaft of the lower substrate drawing roller 282 and the rotation axis of the upper substrate drawing roller 281, respectively. Even if only one of the rotation shaft of the lower substrate pulling-in roller 282 and the rotation shaft of the upper substrate pulling-in roller 281 is connected to the driving means (not shown) and is rotated, the other pulling roller interlocking member 283 reverses Thereby making it possible to rotate in an interlocked manner.

Reference numeral 232 denotes a drawing roller pivot connected to the driving means for rotating the drawing roller interlocking member 283. In this embodiment, for example, the rotary shaft of the lower substrate drawing roller 282 is extended, It is indicated to be the pivot shaft 232.

The water supply roller interlocking member 288 is configured to cause the lower side water supply roller 287 and the upper side water supply roller 286 to rotate together in an opposite direction to each other.

The water supply roller interlocking member 288 may be a pair of spur gears connected to the rotation shaft of the lower water supply roller 287 and the rotation shaft of the upper water supply roller 286 and engaged with each other. Then, even if only one of the rotation shaft of the lower water supply roller 287 and the rotation shaft of the upper water supply roller 286 is connected to the driving means (not shown) and rotated, the other one by the water supply roller interlocking member 288 So that it can be rotated in the opposite direction.

Reference numeral 233 denotes a water supply roller rotation shaft connected to the driving means for rotating the water supply roller interlocking member 288. In this embodiment, for example, the rotation axis of the lower water supply roller 287 is extended, It is suggested to become the water supply roller pivot 233.

Driving means such as an electric motor may be provided individually on the drawing roller pivoting shaft 232 and the water supply roller pivoting shaft 233, respectively, and may be connected to driving means for driving the feeding roller, And may be driven together with the conveying roller.

Reference numeral 234 denotes a guide panel through which the substrate is guided through the water supply roller member 285 and water is guided. Reference numeral 235 denotes a guiding panel that guides the substrate through the water supply roller member 285 And discharging the substrate outward.

Hereinafter, the operation of the substrate water supply unit 230 for a wet automatic cutting laminating apparatus for adhering a substrate film according to the present embodiment will be described with reference to the drawings.

First, the substrate transferred by the transfer roller is engaged with the upper substrate drawing roller 281 and the lower substrate drawing roller 282, which are rotated in opposite directions to each other, and is drawn into the moisture supply roller member 285.

At this time, the surfaces of the respective rollers of the water supply roller member 285 are supplied with moisture by the water supply members 236 and 237, and moisture is accumulated.

In this state, the substrate is engaged with the lower water supply roller 287 and the upper water supply roller 286, which are rotated in opposite directions to each other, and discharged to the outside, so that moisture is uniformly wetted on the surface of the substrate.

As described above, the substrate water supply unit 230 for the wet automatic cutting laminating apparatus for adhering the substrate film includes the moisture supply roller member 285; The water supplied to the water supply roller member 285 from the water supply members 236 and 237 is supplied to the water supply roller member 285 as the water supply members 236 and 237 Since the moisture supply roller member 285 may be rotated while the moisture supply roller member 285 contacts the substrate, the moisture supply roller member 285 may be deposited on the substrate surface by an appropriate amount So that it can be uniformly supplied.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood by those of ordinary skill in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention as defined by the following claims And can be changed. However, it is intended that the present invention covers the modifications and variations of this invention provided they come within the scope of the appended claims and their equivalents.

According to one aspect of the present invention, a substrate water supply unit for a wet automatic cutting laminating apparatus for bonding a substrate film can uniformly supply moisture to a substrate in an appropriate amount for adhesion to the substrate, It is highly likely to use the award.

230: Wet automatic cutting for substrate film lamination Board water supply unit for laminating machine
236, 237: water supply member
280: substrate drawing roller member
285: Water supply roller member

Claims (4)

The present invention is applied to a wet automatic cutting laminating apparatus for adhering a film to a substrate and capable of supplying moisture to the surface of the substrate for adhering the film,
A water supply roller member rotated while contacting with the substrate; And
And a water supply member for supplying water to the water supply roller member,
The moisture supplied to the moisture supply roller member from the moisture supply member is supplied to the moisture supply roller member and the moisture supply roller member is rotated so that when the moisture supply roller member contacts the substrate, And,
The wet automatic cutting laminating apparatus for bonding a substrate film
A transfer roller for transferring the substrate,
A water supply member for supplying water to the surface of the substrate conveyed by the conveying roller,
A film supply member for supplying the film onto the substrate to which moisture is supplied by the moisture supply member,
A pressing roller which presses the substrate on which the film supplied by the film supply member is placed so that the substrate and the film are in close contact with each other while moisture is removed between the substrate and the film,
A substrate deflection preventing member for supporting the substrate toward the pressure roller so as to prevent any sagging of the substrate toward the pressure roller via the conveying roller;
And a pressure roller side film guide which is disposed on the pressure roller side and guides the film supplied from the film supply member toward the pressure roller and has a smooth curved surface so as to gradually approach the pressure roller surface toward the pressure roller side, A member,
And a substrate deflection preventing member side film guiding member disposed on the substrate deflection preventing member and guiding the film supplied from the film supplying member toward the pressure roller,
Wherein the substrate deflection preventing member includes a pair of substrate deflection preventing members arranged to be spaced apart from each other,
The substrate passes through a pair of the substrate deflection preventing members so that the substrate can be directed to the pressure roller without being sagged,
Wherein a gap between the pair of the substrate deflection preventing members is wider than a thickness of the substrate and an inlet portion of a gap of a pair of the substrate deflecting members is smoothly drawn in and penetrated inward It is formed in a shape becoming narrower and smaller,
Wherein the film supplied from the film supply member is guided to the pressure roller while passing between the pressure roller side film guide member and the substrate deflection preventing member side film guide member,
Wherein the film supply member, the pressure roller side film guide member, and the substrate deflection preventing member side film guide member are arranged in pairs so as to be symmetrical to each other with reference to the moving path of the substrate,
Wherein the substrate deflection preventing member includes a pair of film guiding bodies spaced apart from each other between the substrate deflection preventing member and the pressure roller,
Wherein each of the film guiding members is disposed on the same line as each of the substrate deflection preventing members and is separately formed from each of the substrate deflection preventing members, Wherein the pressure roller side end portion of the guide body is formed in a tapered shape so as to be relatively thinner toward the pressure roller so that the pressure roller side film guide member and the substrate deflection preventing member side film guide member Wherein the film guided to the pressure roller is guided by the film guide body and is drawn into the pressure roller while being in contact with the substrate guided by the substrate deflection preventing member at the entrance portion of the pressure roller Board water supply unit for wet automatic cutting laminating equipment for substrate film bonding. The method according to claim 1,
The water supply roller member
A lower water supply roller which is brought into contact with a bottom surface of the substrate,
And an upper moisture supply roller which is brought into contact with an upper surface of the substrate,
The water supply member
A lower water supply member for spraying water to the lower water supply roller,
And an upper water supply body for dropping moisture into the upper water supply roller,
The substrate water supply unit for the wet automatic cutting laminating apparatus for bonding the substrate film
And a substrate inlet roller member for allowing the substrate to be drawn into the moisture supply roller member,
The substrate drawing roller member
A lower substrate pull-in roller brought into contact with a bottom surface of the substrate,
And an upper substrate pull-in roller brought into contact with an upper surface of the substrate,
The lower substrate drawing roller and the upper substrate drawing roller are engaged with each other while the lower and upper water supply rollers are wet by the moisture supplied from the lower and upper water supply bodies respectively Wherein the substrate is wetted while passing through the lower water supply roller and the upper water supply roller. ≪ Desc / Clms Page number 19 > 3. The method of claim 2,
The substrate water supply unit for the wet automatic cutting laminating apparatus for bonding the substrate film
An interlocking roller interlocking member for interlockingly rotating the lower substrate drawing roller and the upper substrate drawing roller in opposite directions; And
And a water supply roller interlocking member for allowing the lower water supply roller and the upper water supply roller to rotate in an opposite direction to each other. 3. The method of claim 2,
Wherein the surface of the substrate pulling-in roller member is made of at least one of urethane and sponge for preventing slipping of the substrate,
Wherein the surface of the moisture supply roller member is made of at least one of a sponge and a fabric for moisture content.

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