KR20170021984A - Wet type auto cutting laminating apparatus for bonding board and film - Google Patents

Wet type auto cutting laminating apparatus for bonding board and film Download PDF

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Publication number
KR20170021984A
KR20170021984A KR1020150116391A KR20150116391A KR20170021984A KR 20170021984 A KR20170021984 A KR 20170021984A KR 1020150116391 A KR1020150116391 A KR 1020150116391A KR 20150116391 A KR20150116391 A KR 20150116391A KR 20170021984 A KR20170021984 A KR 20170021984A
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KR
South Korea
Prior art keywords
film
substrate
board
pressure roller
moisture
Prior art date
Application number
KR1020150116391A
Other languages
Korean (ko)
Inventor
임갑수
Original Assignee
(주) 고송이엔지
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by (주) 고송이엔지 filed Critical (주) 고송이엔지
Priority to KR1020150116391A priority Critical patent/KR20170021984A/en
Publication of KR20170021984A publication Critical patent/KR20170021984A/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0038—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving application of liquid to the layers prior to lamination, e.g. wet laminating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0007—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality
    • B32B37/003—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality to avoid air inclusion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0046—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by constructional aspects of the apparatus
    • B32B37/0053—Constructional details of laminating machines comprising rollers; Constructional features of the rollers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil

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  • Engineering & Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)

Abstract

A wet automatic cutting laminating apparatus for board-film bonding is disclosed. The disclosed wet automatic cutting laminating apparatus for board-film bonding includes: a transport roller transporting a board as an object of film attachment; a moisture supply member supplying moisture to a surface of the board transported by the transport roller; a film supply member supplying a film onto the board to which the moisture has been supplied by the moisture supply member; a pressing roller pressing the board where the film supplied by the film supply member is placed such that the board and the film come into close contact with each other while the moisture between the board and the film is removed; and a board sagging prevention member supporting the board directed toward the pressing roller such that unexpected sagging of the board directed toward the pressing roller via the transport roller can be prevented. According to the disclosed wet automatic cutting laminating apparatus for board-film bonding, the wet automatic cutting laminating apparatus for board-film bonding includes the transport roller, the moisture supply member, the film supply member, the pressing roller, and the board sagging prevention member. Accordingly, moisture supply and film attachment can be performed on the board in a state where the board is transported in a stable manner. Therefore, a board defect such as bubbling attributable to a wide gap between the board and the film can be minimized.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a wet type automatic cutting laminating apparatus for bonding a substrate film,

The present invention relates to a wet automatic cutting laminating apparatus for substrate film adhering.

When a film is adhered on a substrate, a wet laminating method is often used for adhesion between the substrate and the film.

The wet laminating method is a method in which moisture is supplied between a substrate and a film, and then the substrate and the film are closely contacted with each other without bubbles by using a pressure roller.

Conventional wet autoclaving laminating apparatuses for substrate film adhesion for performing the wet laminating method include the following patent documents.

However, according to the conventional wet automatic laminator for adhering a substrate film, when a substrate in a state in which moisture is supplied to the surface thereof and the film is adhered passes through the feed roller and reaches the pressure roller, And there is often a case where the substrate enters the pressing roller in a state in which the gap between the substrate and the film is widened. In this case, defects are generated at the substrate end, which causes a problem of quality defects.

Registered Patent No. 10-1327404, Registered on April 11, 2013, entitled: Wet Laminator Registered Utility Model No. 20-0440443, Date of Registration: 2008.06.05., Name of Design: Feeder for printed circuit board laminator

It is an object of the present invention to provide a wet automatic cutting laminating apparatus for substrate film adhering which can minimize the substrate defects such as bubbling due to the spreading between the substrate and the film.

The wet automatic cutting laminating apparatus for bonding a substrate film according to the present invention comprises: a conveying roller for conveying a substrate to which a film is adhered; A moisture supply member for supplying moisture to the surface of the substrate conveyed by the conveying roller; A film supply member for supplying a film onto the substrate to which moisture is supplied by the moisture supply member; A pressure roller for pressing the substrate on which the film supplied by the film supply member is placed, so that moisture between the substrate and the film is removed so that the substrate and the film are in close contact with each other; And a substrate deflection preventing member for supporting the substrate toward the pressure roller so that any deflection of the substrate toward the pressure roller via the conveying roller is prevented.

According to one aspect of the present invention, there is provided a wet automatic cutting laminating apparatus for bonding a substrate film, wherein the wet automatic cutting laminating apparatus for bonding a substrate film includes a feed roller, a moisture supply member, a film supply member, a pressure roller, Accordingly, since moisture can be supplied onto the substrate and the film can be adhered to the substrate in a state where the substrate is stably transported, defects in the substrate such as bubbles due to the expansion between the substrate and the film can be minimized.

1 is a perspective view showing a main configuration of a wet automatic laminating apparatus for adhering a substrate film according to an embodiment of the present invention;
2 is a front view showing a main configuration of a wet automatic laminating apparatus for adhering a substrate film according to an embodiment of the present invention;
3 is an enlarged view of a main part of a wet automatic laminating apparatus for bonding a substrate film according to an embodiment of the present invention.

Hereinafter, a wet automatic cutting laminating apparatus for bonding a substrate film according to an embodiment of the present invention will be described with reference to the drawings.

FIG. 1 is a perspective view showing a main configuration of a wet automatic cutting laminating apparatus for adhering a substrate film according to an embodiment of the present invention, FIG. 2 is a perspective view of a main part of a wet automatic cutting laminating apparatus for adhering a substrate film according to an embodiment of the present invention, FIG. 3 is an enlarged view of a main part of a wet automatic cutting laminating apparatus for bonding a substrate film according to an embodiment of the present invention.

1 to 3, a wet automatic cutting laminating apparatus 100 for bonding a substrate film according to an embodiment of the present invention includes a feed roller 110, a moisture supply member 130, a film supply member 140, A pressure roller 150, and a substrate deflection preventing member 160.

The conveying rollers 110 are composed of a plurality of conveying rollers 110 to convey the substrate to which the film is adhered toward the pressing roller 150. Although not shown, it is preferable that a plurality of the conveying rollers 110 are installed in front of the moisture supplying member 130.

Reference numeral 115 denotes a driving member such as a motor for rotating the conveying roller 110.

The moisture supplying member 130 supplies moisture to the surface of the substrate conveyed by the conveying roller 110.

Reference numeral 120 denotes a water storage member for storing moisture supplied to the water supply member 130. Reference numeral 126 denotes a water supply member which is accommodated in the water storage member 120, And numeral 125 is a supply pump for supplying the water stored in the water storage member 120 to the water supply member 130. [

The moisture stored in the moisture storage member 120 and supplied to the moisture supply member 130 by the supply pump 125 is sprayed with water on the surface of the substrate transferred by the transfer roller 110 give.

The moisture remaining in the substrate is reduced again to the moisture storage member (120).

The film supply member 140 supplies the film onto the substrate to which moisture is supplied by the moisture supply member 130.

The film supply member 140 may be arranged in a pair so as to be symmetrical with respect to the movement path of the substrate so that the film may be supplied to both the upper and lower surfaces of the substrate.

The pressing roller 150 presses the substrate on which the film supplied by the film supply member 140 is placed so that the film is adhered to the substrate while the moisture between the substrate and the film is removed.

The pressing rollers 150 are formed as a pair and press the film and the substrate together on the upper side and the lower side of the substrate on which the film is placed so that water supplied between the film and the substrate is released to the outside, So that the substrate and the film are brought into close contact with each other without bubbles. The pressure roller 150 may be rotated together with the driving member 115 or may be rotated by a separate driving unit.

Reference numeral 151 denotes a heating element disposed on the pressure roller 150 to generate heat. The heating element 151 generates heat, so that the pressure roller 150 is heated, so that adhesion between the film and the substrate can be improved .

Reference numeral 155 denotes a suction member capable of sucking air such as a ring blower. The suction member 155 protrudes from the film and the substrate in the process of adhering the film to the substrate, . ≪ / RTI >

The substrate deflection preventing member 160 supports the substrate toward the pressure roller 150 so that any deflection of the substrate toward the pressure roller 150 is prevented through the conveying roller 110. [

In detail, the substrate deflection preventing member 160 includes a pair of substrate deflection preventing members 161 arranged to be spaced apart from each other, and the substrate passes through between the pair of substrate deflection preventing members 161, The substrate can be directed to the pressure roller 150 without being sagged.

The gap between the pair of the substrate deflection preventing members 161 is slightly wider than the thickness of the substrate and the inlet portion is formed to be narrowed toward the inner side so that the substrate can be smoothly inserted and penetrated .

The wet automatic cutting laminating apparatus 100 for bonding a substrate film further includes a film supply member 140, a pressure roller side film guide member 170, and a substrate deflection prevention member side film guide member 175.

The film supply member 140 supplies the film to the substrate facing the pressure roller 150.

The pressure roller side film guide member 170 is disposed on the side of the pressure roller 150 and guides the film supplied from the film supply member 140 toward the pressure roller 150.

The pressure roller-side film guide member 170 has a smooth curved surface so as to be closer to the surface of the pressure roller 150 toward the pressure roller 150.

The substrate deflection preventing member side film guide member 175 is disposed on the side of the substrate deflection preventing member 161 to guide the film supplied from the film supplying member 140 toward the pressing roller 150.

The film supplied from the film supply member 140 is guided to the pressure roller 150 while passing between the pressure roller side film guide member 170 and the substrate deflection prevention member side film guide member 175.

The film supply member 140, the pressure roller side film guide member 170, and the substrate deflection preventing member side film guide member 175 are arranged in pairs so as to be symmetrical to each other with respect to the moving path of the substrate .

The substrate deflection preventing member 160 includes a pair of film guides 162 spaced apart from each other between the substrate deflection preventing member 161 and the pressing roller 150.

Each of the film guide bodies 162 is disposed in the same line as the substrate deflection preventing bodies 161 and may be integrally formed with the substrate deflection preventing bodies 161, 161 and may be disposed on an extension of each of the substrate deflection preventing members 161 on the side of the pressure roller 150. [

The end portions of the film guide bodies 162 on the side of the pressure roller 150 are tapered so as to be relatively thinner toward the pressure roller 150 so that the film guide member 162 is supplied from the film supply member 140, The film guided by the side film guide member 170 and the film deflection prevention member side film guide member 175 toward the pressure roller 150 is guided by the film guide 162 so that the pressure roller 150 to the pressure roller 150 while being in contact with the substrate.

Hereinafter, the operation of the wet automatic laminating apparatus 100 for adhering a substrate film according to the present embodiment will be described with reference to the drawings.

First, the substrate placed on the conveying roller 110 is conveyed toward the pressure roller 150 in accordance with the rotation of the conveying roller 110.

When the substrate transferred as described above passes through the water supply member 130, moisture is supplied to the substrate surface from the water supply member 130 in the form of spray or the like.

The substrate to which the moisture has been supplied is continuously conveyed to the pressure roller 150. At this time, the substrate can be stably transported by the substrate deflection preventing member 160 without being sagged.

The film supplied from the film supply member 140 is placed on the surface of the substrate conveyed as described above. The film is drawn into the pressure roller 150 in this state and is pressed by the pressure roller 150, And moisture between the film and the film is removed, so that the substrate and the film can be brought into close contact with each other.

After the substrate and the film are adhered to each other as described above, the end of the film is automatically cut by cutting means (not shown) such as a separate blade constituting the wet automatic cutting laminating apparatus 100 for adhering the substrate film .

As described above, the wet automatic cutting laminating apparatus 100 for adhering the substrate film is provided with the feed roller 110, the moisture supplying member 130, the film supplying member 140, the pressing roller 150, and the substrate deflection preventing member 160 It is possible to supply moisture and adhere the film onto the substrate in a state in which the substrate is stably transported, so that substrate defects such as bubbling due to the expansion between the substrate and the film can be minimized. .

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood by those of ordinary skill in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention as defined by the following claims And can be changed. However, it is intended that the present invention covers the modifications and variations of this invention provided they come within the scope of the appended claims and their equivalents.

According to one aspect of the present invention, the wet automatic cutting laminating apparatus for bonding a substrate film can minimize substrate defects such as bubbles due to a gap between a substrate and a film, and therefore, the use thereof is high in industry.

110: Feed roller 130: Water supply member
140: Film supply member 150: Pressure roller
160: Substrate deflection preventing member

Claims (3)

A transfer roller for transferring a substrate to which a film is adhered;
A moisture supply member for supplying moisture to the surface of the substrate conveyed by the conveying roller;
A film supply member for supplying a film onto the substrate to which moisture is supplied by the moisture supply member;
A pressure roller for pressing the substrate on which the film supplied by the film supply member is placed, so that moisture between the substrate and the film is removed so that the substrate and the film are in close contact with each other; And
And a substrate deflection preventing member for supporting the substrate toward the pressure roller so as to prevent any sagging of the substrate toward the pressure roller via the conveying roller. The method according to claim 1,
Wherein the substrate deflection preventing member includes a pair of substrate deflection preventing members arranged to be spaced apart from each other,
Wherein the substrate passes through a pair of the substrate deflection preventing members so that the substrate can be directed to the pressure roller without being sagged. 3. The method of claim 2,
The wet automatic cutting laminating apparatus for bonding a substrate film
A film supply member for supplying the film to the substrate facing the pressure roller;
A pressure roller side film guide member disposed on the pressure roller side and guiding the film supplied from the film supply member toward the pressure roller; And
And a substrate deflection preventing member side film guide member disposed on the substrate deflection preventing member for guiding the film supplied from the film supplying member toward the pressure roller,
Wherein the substrate deflection preventing member includes a pair of film guides arranged to be spaced apart from each other between the substrate deflection preventing member and the pressing roller,
Wherein the film supplied from the film supply member and guided to the pressure roller by the film guide member on the pressure roller side and the film guide member on the side of the substrate deflection prevention member is guided by the film guide body, Wherein the pressing roller is in contact with the substrate while being drawn into the pressure roller.
KR1020150116391A 2015-08-19 2015-08-19 Wet type auto cutting laminating apparatus for bonding board and film KR20170021984A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020150116391A KR20170021984A (en) 2015-08-19 2015-08-19 Wet type auto cutting laminating apparatus for bonding board and film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020150116391A KR20170021984A (en) 2015-08-19 2015-08-19 Wet type auto cutting laminating apparatus for bonding board and film

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR2020170001136U Division KR200485246Y1 (en) 2017-03-09 2017-03-09 Wet type auto cutting laminating apparatus for bonding board and film

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114851262A (en) * 2022-07-07 2022-08-05 南通君越新材料科技有限公司 Film cutting machine capable of degrading plastic film

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200440443Y1 (en) 2006-11-14 2008-06-13 씨 선 엠에프지 리미티드 Transferring apparatus of laminator for PCB
KR101327404B1 (en) 2011-05-18 2013-11-08 주식회사 리텍 Wet laminator

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200440443Y1 (en) 2006-11-14 2008-06-13 씨 선 엠에프지 리미티드 Transferring apparatus of laminator for PCB
KR101327404B1 (en) 2011-05-18 2013-11-08 주식회사 리텍 Wet laminator

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114851262A (en) * 2022-07-07 2022-08-05 南通君越新材料科技有限公司 Film cutting machine capable of degrading plastic film

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