JP2006196784A - Substrate surface processor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate surface processor capable of preventing the detour of processing liquid to a non-processing surface at the opposite side of the processing surface of a substrate upon conveying the substrate to effect one side processing. <P>SOLUTION: The substrate surface processor 20 for processing the surface of the substrate 21 is constituted of a processing liquid tank 23 for receiving the processing liquid 22, a plurality of conveyance rollers 24 whose one part or the whole of them are dipped into the processing liquid 22 received in the processing liquid tank 23, and which are provided so as to be free of rotation to convey the substrate 21; and a roller driving means for driving the rotation of the conveyance rollers 24. In this case, the length W2 in the rotating axial direction of the conveyance rollers 24 is longer than the width W1 of the substrate 21, and recesses and projections constituting grooves extended into the rotary axial line direction are formed on the surface of the conveyance rollers 24. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a substrate surface treatment apparatus used for chemically treating the surface of a substrate such as a silicon wafer.

  For example, in the manufacturing process of an electronic device, chemical surface treatment for a substrate which is a member constituting the device is frequently used. The chemical surface treatment for the substrate can be divided into a dry process using a reactive gas and a wet process using a chemical chemical. From the viewpoint of the number of processing substrates and the processing surface of the substrate, batch processing in which a plurality of flat substrates are simultaneously immersed in the processing liquid to process the entire surface, or only one surface of the flat substrate is in contact with the processing liquid for processing. Divided into single wafer processing.

  Processes for processing only one side of a substrate having a flat plate shape are frequently used for glass substrates, silicon wafers, etc., for example, for cleaning, removal of a surface-affected layer, thinning, surface shape processing, and the like.

  Normally, when chemical treatment is applied to only one side, a masking tape that is resistant to the treatment liquid is applied to the side that does not require treatment or the surface to be protected, or a resin protective film such as wax or resist is formed. A method of immersing in a liquid is employed. However, such a method requires a masking tape or a resin protective film forming step, a peeling step after the surface treatment, and a cleaning step depending on the state after peeling. There is a problem that the manufacturing cost increases because extra material costs such as the material and the stripping treatment liquid are required.

  On the other hand, in the dry process using a reactive gas, the substrate is placed in close contact with the substrate stage, and the processing gas hardly reaches the back side that is in close contact with the substrate stage. It is easy to carry out only the processing. However, as compared with the wet process, the dry process apparatus has a problem that the equipment cost is high and the material gas cost is high because the equipment such as the vacuum exhaust system and the gas supply system is large. Also, in the dry process, it is difficult for the reactive gas to reach the back surface, and if it is not allowed to slightly wrap around the back surface, add a special back surface wrap prevention mechanism or provide a protective mask. There is a problem that it is necessary to form.

  As a conventional technique for solving such problems, a method has been proposed in which a chemical-resistant hygroscopic substance is impregnated with a chemical, and only one side of the substrate is brought into contact with the hygroscopic substance to perform surface treatment (patent). Reference 1). However, in the method disclosed in Patent Document 1, it is difficult to quickly replace the liquid impregnated in the hygroscopic substance. Accordingly, when the concentration of the processing liquid is reduced during continuous processing, the processing liquid cannot be replaced quickly. Therefore, there is a problem that the continuous processing is performed while the concentration is reduced, and the processing speed is slowed down. In addition, in order to transport the substrate onto the hygroscopic substance, a large-scale transport robot equipped with a suction hand or the like is required, and there is a problem that the equipment cost increases.

  In order to solve such a problem, one-side processing by the following substrate surface processing apparatus has been attempted. FIG. 5 is a diagram showing a simplified configuration of a conventional substrate surface processing apparatus 1. FIG. 5A shows a cross-sectional view of the conventional substrate surface treatment apparatus 1 as viewed from the side, and FIG. 5B shows a top view of the conventional substrate surface treatment apparatus 1. A conventional substrate surface treatment apparatus 1 includes a treatment liquid tank 4 that contains a treatment liquid 3 for chemically treating the surface of a substrate 2, a plurality of conveyance rollers 5 that are rotatably provided and convey a substrate, and a conveyance roller. And drive means (not shown) for driving 5.

  The conveyance roller 5 includes an elongated round bar-shaped shaft 6 and a ring-shaped roller member 7 having an outer diameter larger than the diameter of the shaft 6, and a plurality of conveyance rollers (one conveyance in the case of FIG. 5). Three roller members 7 with respect to the roller 5 are mounted on the shaft 6 at a predetermined interval. The transport roller 5 is rotatably supported by a bearing (not shown) provided with a shaft 6 that is sealed so that the processing liquid 3 does not leak into the processing liquid tank 4, and is driven by driving means provided outside the processing liquid layer 4. Connected and driven to rotate in the direction of arrow 8 by the driving means. The substrate 2 is placed on the transport roller 5 and transported in the direction of the arrow 9 by the transport roller 5 rotating in the direction of the arrow 8.

  In the example shown in FIG. 5, the liquid of the processing liquid 3 in the processing liquid tank 4 so that the roller member 7 of the transporting roller 5 strictly immerses in the processing liquid 3 about ½ in the diameter direction. The surface position is set. That is, a gap is formed between the surface 2 a of the substrate 2 placed on the transport roller 5 and facing the processing liquid 3 (hereinafter referred to as the processing surface 2 a) and the liquid surface position of the processing liquid 3. Is set as follows. With such a setting, the liquid contact of the processing liquid 3 with respect to the processing surface 2a of the substrate 2 placed on the transport roller 5 is, for example, simultaneously with the processing liquid 3 being placed on the transport roller 5. The liquid level position is raised to a position in contact with the processing surface 2a of the substrate 2, and then the liquid level position of the processing liquid 3 is lowered so that the gap is formed. The treatment liquid 3 that has once contacted the treatment surface 2a of the substrate 2 due to the rise of the treatment liquid 3 is transferred to the direction of the arrow 9 by the surface tension even after the liquid surface position is lowered. Since it is adsorbed and held by 2 a, the processing surface 2 a is single-sided by the processing liquid 3.

  However, in the conventional substrate surface treatment apparatus 1, since the shaft 6 of the transport roller 5 is configured to have a small diameter, the shaft 6 is bent due to, for example, the weight of the transport roller 5 itself. In order to prevent the deflection of the shaft 6, the diameter of the shaft 6 must be increased. Therefore, the diameter of the roller member 7 must also be increased, and the entire apparatus becomes larger and the apparatus cost increases.

  In recent years, the substrate 2 has become larger, but in the case of a large substrate 2, if the mounting interval between the roller members 7 mounted on one shaft 6 is long, the substrate 2 is bent, so that the substrate 2 is mounted. The number of roller members 7 to be increased must be increased to shorten the interval between the roller members 7, or the width of the roller members 7 must be increased. Further, when a part of the substrate 2 is chipped, if the width of the roller member 7 is narrow, the substrate 2 does not rest on the roller member 7, and is detached from the transport roller 5, causing a device trouble.

  In order to solve such a problem, single-sided processing by the substrate surface processing apparatus 10 that has been further studied has been attempted. FIG. 6 is a perspective view showing a simplified configuration of a main part of another conventional substrate surface processing apparatus 10. The substrate surface processing apparatus 10 has a feature in the configuration of the transport roller 11 and is configured in the same manner as the substrate surface processing apparatus 1 except for the transport roller 11. Only the substrate 2 is represented.

  The conveyance roller 11 provided in the substrate surface treatment apparatus 10 has a roller length W2 that is equal to or greater than the substrate width W1, which is the length in the width direction that is a direction orthogonal to the direction (arrow 9 direction) in which the substrate 2 is conveyed. Then, it is formed as a columnar or cylindrical bar member having a uniform diameter in the axial direction. That is, by using a rod-shaped member having a uniform diameter (thickness), the conveyance roller 11 is hardly deflected, and the substrate 2 is not easily detached from the conveyance roller 11.

  In the substrate surface processing apparatus 10 having such a configuration, when the one-side processing is performed while the transport roller 11 is rotated in the direction of arrow 8 and the substrate 2 is transported in the direction of arrow 9, the substrate transported by the transport roller 11. When the rear end 2b of 2 is going to be separated from the transport roller 11, a phenomenon occurs in which the processing liquid 3 turns into the non-processing surface 2c opposite to the processing surface 2a.

  When the substrate 2 is a glass substrate made of low-temperature polysilicon used for a liquid crystal display device, for example, and the treatment liquid 3 is a hydrofluoric acid chemical solution, when a part of the treatment liquid 3 wraps around the non-treatment surface 2c. Since the portion in contact with the processing liquid 3 is eroded, processing unevenness occurs, and it causes deterioration of characteristics when the substrate 2 is used as a device component. When the substrate 2 is, for example, a semiconductor wafer and the processing liquid 3 is an etching liquid, when a part of the processing liquid 3 is introduced into the non-processing surface 2c, the portion in contact with the processing liquid 3 is eroded and the characteristics are lost. Further, when the treatment liquid 3 is pure water, when the pure water flows into the non-treatment surface 2c, it becomes a water mark, causing unevenness of cleaning, and deterioration of the characteristics of the substrate 2 due to the unevenness of cleaning.

  Therefore, if the conveying roller 11 is simply composed of a rod-like member having a uniform diameter in the axial direction, a part of the processing liquid 3 wraps around the non-processing surface 2c side of the substrate 2 to cause processing unevenness and characteristic deterioration. There is a problem.

JP 58-48425 A

  An object of the present invention is to provide a substrate surface that can prevent the processing liquid from flowing into a non-processing surface opposite to the processing surface of the substrate without causing an apparatus trouble when carrying the substrate and performing single-side processing. It is to provide a processing device.

The present invention provides a substrate surface treatment apparatus for treating the surface of a substrate having a flat plate shape,
A treatment liquid tank for containing a treatment liquid used for substrate surface treatment;
A plurality of conveyance rollers that convey the substrate, and a plurality of conveyance rollers that are rotatably provided by being partially or fully immersed in the treatment liquid stored in the treatment liquid tank;
Roller driving means for rotating the transport roller,
The length of the transport roller in the rotation axis direction is
It is not less than the substrate width that is the length in the width direction that is the direction orthogonal to the direction in which the substrate is conveyed,
On the surface of the transport roller,
The substrate surface treatment apparatus is characterized in that irregularities constituting a groove are formed.

  Further, the invention is characterized in that the unevenness on the surface of the conveying roller constituting the groove has a maximum height Rmax of 1 μm or more.

  Further, the invention is characterized in that the extending direction of the groove is parallel to the extending direction of the rotation axis of the conveying roller.

In the present invention, the treatment liquid is
1 or 2 or more selected from the group consisting of hydrofluoric acid, nitric acid, hydrochloric acid, sodium hydroxide solution, potassium hydroxide solution and pure water.

In the invention, it is preferable that at least a portion in contact with the processing liquid is polytetrafluoroethylene or vinyl chloride.
In the present invention, the substrate is a silicon wafer or glass.

  According to the present invention, the transport roller that is rotatably provided in the substrate surface processing apparatus for processing the surface of the substrate having a flat plate shape and transports the substrate has a length in the rotation axis direction equal to or larger than the substrate width. The surface is provided with irregularities constituting grooves. By providing the transport roller having a length longer than the width of the substrate in this way, the substrate can be transported smoothly without being bent, and troubles in the apparatus during transport can be prevented. In addition, the processing liquid flows over the surface of the transport roller and is smoothly drained by the irregularities forming the grooves on the surface of the transport roller, so that the processing liquid is circulated against the non-processing surface opposite to the processing surface of the substrate. Can be prevented.

  Further, according to the present invention, the unevenness on the surface of the conveying roller constituting the groove is formed so that the maximum height Rmax is 1 μm or more, so that the processing liquid on the surface of the conveying roller can be drained more smoothly. Can do.

  According to the present invention, the groove is formed so as to extend in parallel with the direction in which the rotation axis of the transport roller extends, and the processing liquid on the surface of the transport roller is easily drained from the end surface in the axial direction of the transport roller. It is possible to ensure that the liquid does not flow into the non-treated surface.

  According to the invention, one or more selected from the group consisting of hydrofluoric acid, nitric acid, hydrochloric acid, sodium hydroxide solution, potassium hydroxide solution and pure water is used as the treatment liquid. By using such a treatment liquid, a substrate surface treatment apparatus capable of performing various surface treatments such as cleaning, etching, and surface shape processing is realized.

  In addition, according to the present invention, the conveyance roller is formed of polytetrafluoroethylene or vinyl chloride at least at a portion in contact with the treatment liquid, and therefore has excellent durability even when various chemicals are used as the treatment liquid. Can be expressed.

  Moreover, according to this invention, the substrate surface processing apparatus suitable for the single-sided process of a silicon wafer or a glass substrate is provided.

  FIG. 1 is a diagram showing a simplified configuration of a substrate surface processing apparatus 20 according to an embodiment of the present invention, and FIG. 2 shows a configuration of a transport roller 24 provided in the substrate surface processing apparatus 20 shown in FIG. It is a perspective view.

  The substrate surface treatment apparatus 20 is an apparatus used for single-sided treatment of the surface of a substrate 21 having a flat plate shape, and includes a treatment liquid tank 23 that contains a treatment liquid 22 used for surface treatment of the substrate 21, and a substrate 21. A plurality of transport rollers 24 that are partly or wholly immersed in the processing liquid 22 accommodated in the processing liquid tank 23 and that are rotatably provided. And the roller driving means shown.

  Examples of the substrate 21 to be surface-treated in the substrate surface treatment apparatus 20 include a silicon wafer or glass. Examples of the surface treatment of the silicon wafer or glass can include cleaning, removal of a surface altered layer by etching, thinning, surface shape processing, and the like. Surface treatment can be performed.

Examples of the treatment liquid 22 used for the surface treatment of the substrate 21 include one or more selected from the group consisting of hydrofluoric acid, nitric acid, hydrochloric acid, sodium hydroxide solution, potassium hydroxide solution, and pure water. Pure water is water having a specific resistance of, for example, 1.0 × 10 ⁶ Ω · cm or more, and is used for the cleaning treatment of the substrate 21 and as a solvent for the other treatment liquids. The acid hydrofluoric acid, nitric acid, hydrochloric acid, and the alkali sodium hydroxide solution and potassium hydroxide solution are used for etching the substrate 21.

  The processing liquid tank 23 for storing the processing liquid 22 is a box-shaped container having a substantially rectangular parallelepiped shape. In the present embodiment, the processing liquid tank 23 is formed of vinyl chloride that has excellent resistance to the processing liquids 22 described above. In addition, the raw material of the processing liquid tank 23 is not limited to vinyl chloride, for example, stainless steel coated with polytetrafluoroethylene (abbreviated as PTFE) having excellent resistance to the processing liquids 22 is used. May be. Through holes are formed in opposite positions on both side walls 23a and 23b in the longitudinal direction of the treatment liquid tank 23, and bearings (not shown) are provided in the through holes. In addition, a fluid seal member is provided in the mounting portion of the bearing with respect to the side walls 23a and 23b, and configured to prevent leakage of the processing liquid 22 accommodated in the processing liquid tank 23.

  The transport roller 24 is rotatably supported by bearings provided on the side walls 23 a and 23 b of the processing liquid tank 23. A plurality of transport rollers 24 are provided, and the arrangement interval in the substrate transport direction is determined so that the target substrate 21 to be surface-treated can simultaneously contact at least three transport rollers 24. Further, the plurality of transport rollers 24 are provided such that a virtual line 35 (which becomes a pass line for transporting the substrate 21) connecting the rotation tops thereof is parallel to the liquid surface of the processing liquid 22, that is, the horizontal surface. The transport roller 24 is connected to roller driving means and is driven to rotate in the direction of the arrow 25. The substrate 21 is placed on the transport roller 24 and is transported in the apparatus in the direction of the arrow 26 by the transport roller 24 rotating in the direction of the arrow 25, and is placed facing the processing liquid 22 in the course of the transport. The surface 21a (hereinafter referred to as the processing surface 21a) is subjected to surface treatment.

  The conveyance roller 24 includes a columnar shaft portion 31 and a cylindrical roller portion 32 provided so as to be stacked on the shaft portion 31. The conveyance roller 24 is formed of PTFE or vinyl chloride at least at a portion in contact with the treatment liquid 22. Here, the portion of the transport roller 24 that is in contact with at least the treatment liquid 22 is a portion that is immersed in the treatment liquid 22 and is in contact with the treatment liquid 22, and a portion that is outside the treatment liquid 22. Is used to include a wetted portion, and does not necessarily indicate the entire material of the conveying roller 24, but may be only the surface portion in contact with the processing liquid 22. However, in the present embodiment, the conveying roller 24 is formed by integrally forming the shaft portion 31 and the roller portion 32 from vinyl chloride.

  Note that the configuration of the transport roller 24 is not limited to the above, which is integrally formed of vinyl chloride. The roller portion 32 is made of stainless steel whose surface is covered with PTFE in order to increase rigidity. Further, a configuration using vinyl chloride may be used, or the shaft portion 31 and the roller portion 32 integrally formed of stainless steel may be covered with PTFE, and various modifications are allowed.

  The length in the rotational axis direction of the transport roller 24, more precisely, the length W2 in the rotational axis direction of the roller portion 32 that contacts the processing surface 21a of the substrate 21 and transmits the transport driving force to the substrate 21 is as follows. 21 is formed so as to have a substrate width W1 or more (W2 ≧ W1) which is a length in the width direction which is a direction orthogonal to the direction 26 in which the sheet 21 is conveyed. As described above, the substrate 21 is bent by providing the transport roller 24 having the uniform thickness and forming the rod portion 32 having the length equal to or larger than the substrate width W1. Therefore, it is possible to convey smoothly and prevent troubles of the apparatus during transportation.

  Further, the most notable aspect of the transport roller 24 is that the surface of the roller portion 32 of the transport roller 24 is formed with unevenness that forms a groove 33 extending parallel to the direction of the rotation axis 34 of the transport roller 24. The unevenness on the surface of the conveying roller 24 constituting the groove 33 is preferably such that the maximum height Rmax measured by scanning the surface roughness meter in the circumferential direction of the conveying roller 24 is 1 μm (1.0 S) or more. . By setting the maximum height Rmax of the unevenness of the groove 33 to 1 μm or more, it is possible to effectively drain the excess processing liquid 22 from the surface of the roller portion 32 from the end portion in the direction of the rotation axis 34 of the roller portion 32. it can. Here, the maximum height Rmax is defined in Japanese Industrial Standard (JIS) B0601.

  By forming a groove 33 extending in the direction of the rotation axis 34 in the roller portion 32 of the conveyance roller 24, the rotating conveyance roller 24 is held on the surface of the roller portion 32 when it is immersed in the treatment liquid 22 and further pulled up. The processing liquid 22 flows over the surface of the conveying roller through the groove 33 and is smoothly drained from the end portion in the axial direction of the roller portion 32. Therefore, even when the tail 21b of the substrate 21 is about to be separated from the transport roller 24, excess processing liquid 22 on the surface of the transport roller 24 is drained by the groove 33, so that the non-process on the side opposite to the processing surface 21a is not performed. It is possible to prevent the processing liquid 22 from entering the surface 21c. This eliminates the need for a process of forming a protective film on the non-processed surface 21c of the substrate 21, a process of removing the protective film, and the like even when performing single-sided processing of the substrate 21. Can be simplified.

  Note that the upper limit of the maximum height Rmax of the unevenness forming the groove 33 of the transport roller 24 is not particularly limited, but is desirably 100 μm or less. This is because if the maximum height Rmax of the unevenness is too large, the draining action from the surface of the transport roller 24 is too effective, and it may be difficult to hold the processing liquid 22 on the processing surface 21a.

  The groove 33 of the roller portion 32 having the desired maximum height Rmax is formed by polishing the surface of the roller portion 32 in the direction of the rotation axis 34 of the conveying roller 24 using, for example, water resistant paper selected as an appropriate count. Realized. The groove 33 having the desired maximum height Rmax can also be formed by cutting with a shaper or the like without being limited to polishing with water-resistant paper.

Hereinafter, the surface treatment operation of the substrate 21 by the substrate surface treatment apparatus 20 will be briefly described.
The processing liquid 22 is stored in the processing liquid tank 23 in advance. The processing liquid is set such that the distance h between the liquid surface position of the processing liquid 22 and the rotation top of the roller portion 32 of the transport roller 24, that is, the pass line 35 to which the substrate 21 is transported, is 0 to 5 mm, preferably 2 to 3 mm. The accommodation amount of the processing liquid 22 in the tank 23 is set. If the distance h is less than 0 mm, that is, if the transport roller 24 sinks deeply into the processing liquid 22 beyond the total immersion, the drainage action by the groove 33 formed in the transport roller 24 cannot be effectively expressed. Then, the processing liquid 22 turns into the non-processing surface 21c. If the distance h exceeds 5 mm, it becomes difficult to hold the processing liquid 22 on the processing surface 21a of the substrate 21 by surface tension.

  The substrate 21 that has been transported in the direction indicated by the arrow 26 in FIG. 1 from the loader side (not shown) provided on the left side of the paper surface of FIG. 1 is processed so that the processing surface 21a faces the processing liquid 22. 20 is charged. When the substrate 21 is loaded and placed on the transport roller 24, for example, the processing liquid 22 is brought into contact with the processing surface 21a of the substrate 21 as follows. When the supply means for supplying the processing liquid 22 into the processing liquid tank 23 and the discharging means for discharging the processing liquid 22 in the processing liquid tank 23 are operated and the substrate 21 is placed on the transport roller 24, the supply is performed. The liquid level position of the processing liquid 22 is raised to a height in contact with the processing surface 21a of the substrate 21 by means, and then the liquid level position of the processing liquid 22 is lowered to a height having a gap from the processing surface 21a of the substrate 21 by the discharging means.

  The contact between the processing surface 21 a of the substrate 21 and the processing liquid 22 is below the position where the substrate 21 is placed on the transport roller 24, and the processing liquid is blown into the processing liquid 22 in the processing liquid tank 23 in advance. A raising nozzle is provided, and the processing liquid 22 is blown up toward the processing surface 21 a of the substrate 21 by the nozzle, and the processing liquid 22 is brought into contact with and held on the processing surface 21 a of the substrate 21 by using the surface tension of the processing liquid 22. You may do it.

  With the processing liquid 22 held in contact with the processing surface 21 a of the substrate 21, the transport roller 24 is driven to rotate in the direction of the arrow 25 to transport the substrate 21 in the direction of the arrow 26. During this transfer period, the processing liquid 22 is maintained in contact with the processing surface 21a of the substrate 21 due to its surface tension. Only the processing surface 21a of the substrate 21 is surface-treated with the processing liquid 22 while the substrate 21 and the processing liquid 22 to be processed and the substrate 21 are transported with a predetermined time depending on the type of surface processing.

  Since the transport roller 24 is configured as described above, the processing liquid 22 is prevented from flowing into the non-processing surface 21c side when the tail 21b of the substrate 21 passes through the transport roller 24 and further leaves during the transport period. Is done. The substrate 21 transported over a predetermined time is transported to, for example, a washing tub provided on the right side of the sheet of FIG.

  According to the substrate surface processing apparatus 20, only the processing surface 21a, which is one side of the substrate 21, can be subjected to single wafer processing in this way.

  FIG. 3 is a diagram showing a simplified configuration of the substrate surface processing apparatus 40 according to the second embodiment of the present invention, and FIG. 4 shows a configuration of the transport roller 41 provided in the substrate surface processing apparatus 40 shown in FIG. It is a perspective view shown. The substrate surface treatment apparatus 40 of the present embodiment is similar to the substrate surface treatment apparatus 20 of the first embodiment, and corresponding portions are denoted by the same reference numerals and description thereof is omitted.

  The substrate surface treatment apparatus 40 is characterized by the configuration of the transport roller 41 and includes a discharge means 42 connected to the transport roller 41.

  The conveyance roller 41 provided in the substrate surface treatment apparatus 40 has the same configuration as the conveyance roller 24 of the first embodiment in that it includes a shaft portion 43 and a roller portion 44. However, the shaft portion 43 is formed with a discharge hole 46 that opens at one end portion and is bored over a length substantially corresponding to the length of the roller portion 44. The roller portion 44 is formed with a small discharge hole 47 that opens outwardly on the groove 33 formed in the roller portion 44 and penetrates to the discharge hole 46 formed in the shaft portion 43. In the present embodiment, five small discharge holes 47 are formed by arranging one groove 33 in the axial direction of the roller portion 44 for every third groove 33 formed in the roller portion 44. It should be noted that the number and arrangement of the small discharge holes 47 shown in FIG. 4 are only one example and are not limited thereto.

  The small discharge hole 47 communicating with the discharge hole 46 of the shaft 43 is formed in the roller portion 44, so that the processing liquid 22 held on the surface of the roller portion 44 passes through the groove 33 and is in the axial direction of the roller portion 44. In addition to draining from the end portion, draining is also performed from the small discharge hole 47. Further, the reaction surface 21a of the substrate 21 is generated by reacting with the treatment liquid 22, and the reaction gas existing in contact with the treatment surface 21a is discharged through the small discharge hole 47 and the discharge hole 46 by suction by the discharge means 42 described later. Therefore, the retention of the reaction gas on the processing surface 21a can be prevented, and the processing surface 21a can be processed uniformly.

  The discharge means 42 includes a pipe 48 connected to the discharge hole 46 of the shaft portion 43 of each conveyance roller 41 and a discharge pump 50 provided in a collective pipe 49 that collects the pipes 48. In such a substrate surface processing apparatus 40, the processing liquid 22 and the reactive gas are forcibly sucked and discharged through the small discharge hole 47 and the discharge hole 46 by the suction force of the discharge pump 50. It is possible to more reliably prevent the 22 from wrapping around the non-treated surface 21c, and to uniformly treat the treated surface 21a evenly.

  In addition to the discharge means 42 described above, the substrate surface treatment apparatus 40 is provided with a circulation means including a dust filter and the like on the downstream side of the discharge pump 50 of the collecting pipe 49 for returning the treatment liquid 22 to the treatment liquid tank 23. May be.

It is a figure which simplifies and shows the structure of the substrate surface processing apparatus 20 which is one Embodiment of this invention. It is a perspective view which shows the structure of the conveyance roller 24 provided in the substrate surface processing apparatus 20 shown in FIG. It is a figure which simplifies and shows the structure of the substrate surface processing apparatus 40 which is the 2nd Embodiment of this invention. It is a perspective view which shows the structure of the conveyance roller 41 provided in the substrate surface processing apparatus 40 shown in FIG. It is a figure which simplifies and shows the structure of the conventional board | substrate surface processing apparatus. It is a perspective view which simplifies and shows the principal part structure of another conventional substrate surface processing apparatus.

Explanation of symbols

20, 40 Substrate surface treatment device 21 Substrate 22 Treatment liquid 23 Treatment liquid tank 24, 41 Transport roller 42 Discharge means 31, 43 Shaft portion 32, 44 Roller portion 33 Groove 46 Discharge hole 47 Small discharge hole

Claims (6)

In a substrate surface processing apparatus for processing the surface of a substrate having a flat plate shape,
A treatment liquid tank for containing a treatment liquid used for substrate surface treatment;
A plurality of conveyance rollers that convey the substrate, and a plurality of conveyance rollers that are rotatably provided by being partially or fully immersed in the treatment liquid stored in the treatment liquid tank;
Roller driving means for rotating the transport roller,
The length of the transport roller in the rotation axis direction is
It is not less than the substrate width that is the length in the width direction that is the direction orthogonal to the direction in which the substrate is conveyed,
On the surface of the transport roller,
A substrate surface treatment apparatus, wherein irregularities constituting grooves are formed. Concavities and convexities on the surface of the transport roller constituting the groove are
2. The substrate surface processing apparatus according to claim 1, wherein the maximum height Rmax is 1 [mu] m or more. The direction in which the groove extends is
3. The substrate surface treatment apparatus according to claim 1, wherein the substrate surface treatment apparatus is parallel to a direction in which a rotation axis of the transport roller extends. Treatment liquid
It is 1 or 2 or more selected from the group consisting of hydrofluoric acid, nitric acid, hydrochloric acid, sodium hydroxide solution, potassium hydroxide solution and pure water. The substrate surface treatment apparatus as described. The transport roller
The substrate surface treatment apparatus according to claim 1, wherein at least a portion in contact with the treatment liquid is polytetrafluoroethylene or vinyl chloride. The board is
The substrate surface treatment apparatus according to claim 1, wherein the substrate surface treatment apparatus is a silicon wafer or glass.

Images