MY201367A - Uniform cmp polishing method - Google Patents

Uniform cmp polishing method

Info

Publication number
MY201367A
MY201367A MYPI2018001182A MYPI2018001182A MY201367A MY 201367 A MY201367 A MY 201367A MY PI2018001182 A MYPI2018001182 A MY PI2018001182A MY PI2018001182 A MYPI2018001182 A MY PI2018001182A MY 201367 A MY201367 A MY 201367A
Authority
MY
Malaysia
Prior art keywords
polishing
grooves
wafer
rotating
radial feeder
Prior art date
Application number
MYPI2018001182A
Inventor
John Vu Nguyen Mr
Tony Quan Tran Mr
Jeffrey James Hendron Mr
Jeffrey Robert Stack Mr
Original Assignee
Rohm & Haas Elect Materials Cmp Holdings Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm & Haas Elect Materials Cmp Holdings Inc filed Critical Rohm & Haas Elect Materials Cmp Holdings Inc
Priority to MYPI2018001182A priority Critical patent/MY201367A/en
Publication of MY201367A publication Critical patent/MY201367A/en

Links

Landscapes

  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)

Abstract

The invention provides a method for polishing or planarizing a wafer of at least one of semiconductor, optical and magnetic substrates. The method includes rotating a polishing pad (10) having radial feeder grooves in a polishing layer (12) separating the polishing layer (12) into polishing regions (40, 42, 44, 46, 48, 50, 52 and 54). The radial feeder grooves (20, 22, 24, 26, 28, 30, 32 and 34) extend at least from a location adjacent the center (16) to a location adjacent the outer edge (18). Each polishing region includes a series of biased grooves connecting a pair of adjacent radial feeder grooves. The series of biased grooves separate a land area and have inner walls closer to the center (16) and outer walls closer to the outer edge (18). Pressing and rotating the wafer against the rotating polishing pad (10) for multiple rotations polishes or planarizes the wafer with land areas wet by the overflowing polishing fluid. (Fig.1)
MYPI2018001182A 2018-06-28 2018-06-28 Uniform cmp polishing method MY201367A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
MYPI2018001182A MY201367A (en) 2018-06-28 2018-06-28 Uniform cmp polishing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
MYPI2018001182A MY201367A (en) 2018-06-28 2018-06-28 Uniform cmp polishing method

Publications (1)

Publication Number Publication Date
MY201367A true MY201367A (en) 2024-02-20

Family

ID=90885548

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2018001182A MY201367A (en) 2018-06-28 2018-06-28 Uniform cmp polishing method

Country Status (1)

Country Link
MY (1) MY201367A (en)

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