MY201367A - Uniform cmp polishing method - Google Patents
Uniform cmp polishing methodInfo
- Publication number
- MY201367A MY201367A MYPI2018001182A MYPI2018001182A MY201367A MY 201367 A MY201367 A MY 201367A MY PI2018001182 A MYPI2018001182 A MY PI2018001182A MY PI2018001182 A MYPI2018001182 A MY PI2018001182A MY 201367 A MY201367 A MY 201367A
- Authority
- MY
- Malaysia
- Prior art keywords
- polishing
- grooves
- wafer
- rotating
- radial feeder
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title abstract 9
- 238000000034 method Methods 0.000 title abstract 3
- 239000012530 fluid Substances 0.000 abstract 1
- 230000003287 optical effect Effects 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Landscapes
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Abstract
The invention provides a method for polishing or planarizing a wafer of at least one of semiconductor, optical and magnetic substrates. The method includes rotating a polishing pad (10) having radial feeder grooves in a polishing layer (12) separating the polishing layer (12) into polishing regions (40, 42, 44, 46, 48, 50, 52 and 54). The radial feeder grooves (20, 22, 24, 26, 28, 30, 32 and 34) extend at least from a location adjacent the center (16) to a location adjacent the outer edge (18). Each polishing region includes a series of biased grooves connecting a pair of adjacent radial feeder grooves. The series of biased grooves separate a land area and have inner walls closer to the center (16) and outer walls closer to the outer edge (18). Pressing and rotating the wafer against the rotating polishing pad (10) for multiple rotations polishes or planarizes the wafer with land areas wet by the overflowing polishing fluid. (Fig.1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
MYPI2018001182A MY201367A (en) | 2018-06-28 | 2018-06-28 | Uniform cmp polishing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
MYPI2018001182A MY201367A (en) | 2018-06-28 | 2018-06-28 | Uniform cmp polishing method |
Publications (1)
Publication Number | Publication Date |
---|---|
MY201367A true MY201367A (en) | 2024-02-20 |
Family
ID=90885548
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2018001182A MY201367A (en) | 2018-06-28 | 2018-06-28 | Uniform cmp polishing method |
Country Status (1)
Country | Link |
---|---|
MY (1) | MY201367A (en) |
-
2018
- 2018-06-28 MY MYPI2018001182A patent/MY201367A/en unknown
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