MY201106A - High-rate cmp polishing method - Google Patents
High-rate cmp polishing methodInfo
- Publication number
- MY201106A MY201106A MYPI2018001185A MYPI2018001185A MY201106A MY 201106 A MY201106 A MY 201106A MY PI2018001185 A MYPI2018001185 A MY PI2018001185A MY PI2018001185 A MYPI2018001185 A MY PI2018001185A MY 201106 A MY201106 A MY 201106A
- Authority
- MY
- Malaysia
- Prior art keywords
- polishing
- polishing pad
- grooves
- wafer
- rotating
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title abstract 11
- 238000000034 method Methods 0.000 title abstract 3
- 230000003287 optical effect Effects 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Landscapes
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Abstract
The invention provides a method for polishing or planarizing a wafer of at least one of semiconductor, optical and magnetic substrates. The method includes rotating a polishing pad having radial feeder grooves in the polishing layer separating the polishing layer into polishing regions. The radial feeder grooves include a series of biased grooves connecting a pair of adjacent radial feeder grooves. A majority of the biased grooves have either an inward bias toward the center or an outward bias toward the outer edge of the polishing pad. Pressing and rotating the wafer against the rotating polishing pad for multiple rotations of the polishing pad at a fixed distance from the center of the polishing pad increases polishing or planarizing removal rate of the wafer. (Fig. 1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
MYPI2018001185A MY201106A (en) | 2018-06-28 | 2018-06-28 | High-rate cmp polishing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
MYPI2018001185A MY201106A (en) | 2018-06-28 | 2018-06-28 | High-rate cmp polishing method |
Publications (1)
Publication Number | Publication Date |
---|---|
MY201106A true MY201106A (en) | 2024-02-06 |
Family
ID=90885550
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2018001185A MY201106A (en) | 2018-06-28 | 2018-06-28 | High-rate cmp polishing method |
Country Status (1)
Country | Link |
---|---|
MY (1) | MY201106A (en) |
-
2018
- 2018-06-28 MY MYPI2018001185A patent/MY201106A/en unknown
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