FR2794538B1 - Composition de revetement de dessus pour photoreserve et procede pour former un motif fin en l'utilisant - Google Patents

Composition de revetement de dessus pour photoreserve et procede pour former un motif fin en l'utilisant

Info

Publication number
FR2794538B1
FR2794538B1 FR0007020A FR0007020A FR2794538B1 FR 2794538 B1 FR2794538 B1 FR 2794538B1 FR 0007020 A FR0007020 A FR 0007020A FR 0007020 A FR0007020 A FR 0007020A FR 2794538 B1 FR2794538 B1 FR 2794538B1
Authority
FR
France
Prior art keywords
photoresist
forming
same
fine pattern
covering composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0007020A
Other languages
English (en)
Other versions
FR2794538A1 (fr
Inventor
Jae Chang Jung
Keun Kyu Kong
Hyeong Soo Kim
Jin Soo Kim
Cha Won Koh
Sung Eun Hong
Geun Su Lee
Min Ho Jung
Ki Ho Baik
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SK Hynix Inc
Original Assignee
Hyundai Electronics Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hyundai Electronics Industries Co Ltd filed Critical Hyundai Electronics Industries Co Ltd
Publication of FR2794538A1 publication Critical patent/FR2794538A1/fr
Application granted granted Critical
Publication of FR2794538B1 publication Critical patent/FR2794538B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Materials For Photolithography (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Paints Or Removers (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
FR0007020A 1999-06-03 2000-05-31 Composition de revetement de dessus pour photoreserve et procede pour former un motif fin en l'utilisant Expired - Fee Related FR2794538B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR10-1999-0020538A KR100401116B1 (ko) 1999-06-03 1999-06-03 아민오염방지 물질 및 이를 이용한 미세패턴 형성방법

Publications (2)

Publication Number Publication Date
FR2794538A1 FR2794538A1 (fr) 2000-12-08
FR2794538B1 true FR2794538B1 (fr) 2004-08-20

Family

ID=19589910

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0007020A Expired - Fee Related FR2794538B1 (fr) 1999-06-03 2000-05-31 Composition de revetement de dessus pour photoreserve et procede pour former un motif fin en l'utilisant

Country Status (9)

Country Link
JP (1) JP2001022080A (fr)
KR (1) KR100401116B1 (fr)
CN (1) CN1215375C (fr)
DE (1) DE10027587A1 (fr)
FR (1) FR2794538B1 (fr)
GB (1) GB2352825B (fr)
IT (1) IT1320493B1 (fr)
NL (1) NL1015367C2 (fr)
TW (1) TWI266958B (fr)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100537181B1 (ko) * 1999-12-30 2005-12-16 주식회사 하이닉스반도체 노광후 현상 지연에 의한 패턴 불량을 방지할 수 있는포토레지스트 패턴 형성 방법
KR100390991B1 (ko) * 2001-05-29 2003-07-12 주식회사 하이닉스반도체 반도체소자의 감광막패턴 형성방법
KR100390998B1 (ko) * 2001-06-26 2003-07-12 주식회사 하이닉스반도체 반도체소자의 감광막패턴 형성방법
JP3476082B2 (ja) * 2001-11-05 2003-12-10 東京応化工業株式会社 パターン微細化用被覆形成剤およびそれを用いた微細パターンの形成方法
KR100642416B1 (ko) 2004-08-31 2006-11-03 주식회사 하이닉스반도체 상부 반사방지막 조성물 및 이를 이용한 반도체 소자의패턴 형성 방법
CN1786830A (zh) * 2004-12-09 2006-06-14 三洋电机株式会社 抗蚀剂图案形成方法
US8168367B2 (en) * 2008-07-11 2012-05-01 Shin-Etsu Chemical Co., Ltd. Resist composition and patterning process
WO2014115843A1 (fr) * 2013-01-24 2014-07-31 日産化学工業株式会社 Composition pour former un film de couche supérieure de résine lithographique et procédé de fabrication d'un dispositif à semi-conducteur consistant à l'utiliser
KR101756253B1 (ko) * 2013-01-31 2017-07-10 후지필름 가부시키가이샤 패턴형성방법, 이들을 사용한 전자 디바이스의 제조방법, 및 전자 디바이스

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3652273A (en) * 1967-09-11 1972-03-28 Ibm Process using polyvinyl butral topcoat on photoresist layer
JPS5034966B2 (fr) * 1972-07-24 1975-11-12
GB8700599D0 (en) * 1987-01-12 1987-02-18 Vickers Plc Printing plate precursors
DE3715790A1 (de) * 1987-05-12 1988-11-24 Hoechst Ag Strahlungsempfindliches aufzeichnungsmaterial
CA2090039A1 (fr) * 1990-09-18 1992-03-19 Willard Earl Conley Couche de finition et bouche-pores catalyses par un acide
JPH04204848A (ja) * 1990-11-30 1992-07-27 Matsushita Electric Ind Co Ltd 微細パターン形成方法
DE4117127A1 (de) * 1991-05-25 1992-11-26 Basf Ag Lichtempfindliche aufzeichnungselemente, verfahren zu ihrer herstellung und weiterverarbeitung sowie geraete fuer die durchfuehrung dieser verfahren
SG52770A1 (en) * 1992-07-10 1998-09-28 Hoechst Celanese Corp Metal ion reduction in top anti-reflective coatings for photoresists
JP3362797B2 (ja) * 1993-04-30 2003-01-07 東洋紡績株式会社 印刷原版用感光性樹脂積層体
US5631314A (en) * 1994-04-27 1997-05-20 Tokyo Ohka Kogyo Co., Ltd. Liquid coating composition for use in forming photoresist coating films and photoresist material using said composition
US5506090A (en) * 1994-09-23 1996-04-09 Minnesota Mining And Manufacturing Company Process for making shoot and run printing plates
JP3510003B2 (ja) * 1995-05-01 2004-03-22 クラリアント インターナショナル リミテッド 反射防止コーティング用組成物
JPH0971765A (ja) * 1995-06-29 1997-03-18 Nippon Zeon Co Ltd 粘着防止用組成物
JP3694703B2 (ja) * 1996-04-25 2005-09-14 Ａｚエレクトロニックマテリアルズ株式会社 反射防止コーティング用組成物
JPH10261574A (ja) * 1997-03-19 1998-09-29 Fujitsu Ltd 半導体装置の製造方法

Also Published As

Publication number Publication date
FR2794538A1 (fr) 2000-12-08
KR20010001380A (ko) 2001-01-05
ITTO20000510A0 (it) 2000-06-01
ITTO20000510A1 (it) 2001-12-01
NL1015367A1 (nl) 2000-12-06
GB2352825A (en) 2001-02-07
GB2352825B (en) 2003-12-17
NL1015367C2 (nl) 2001-05-17
JP2001022080A (ja) 2001-01-26
CN1215375C (zh) 2005-08-17
TWI266958B (en) 2006-11-21
KR100401116B1 (ko) 2003-10-10
CN1276541A (zh) 2000-12-13
GB0012727D0 (en) 2000-07-19
IT1320493B1 (it) 2003-12-10
DE10027587A1 (de) 2000-12-21

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Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20140131