FR2739490B1 - Procede de mise sous vide et d'etancheification de modules notamment d'affichage par emission de champ, et modules obtenus - Google Patents

Procede de mise sous vide et d'etancheification de modules notamment d'affichage par emission de champ, et modules obtenus

Info

Publication number
FR2739490B1
FR2739490B1 FR9611880A FR9611880A FR2739490B1 FR 2739490 B1 FR2739490 B1 FR 2739490B1 FR 9611880 A FR9611880 A FR 9611880A FR 9611880 A FR9611880 A FR 9611880A FR 2739490 B1 FR2739490 B1 FR 2739490B1
Authority
FR
France
Prior art keywords
modules
vacuuming
field emission
emission display
particular field
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9611880A
Other languages
English (en)
Other versions
FR2739490A1 (fr
Inventor
Danny Dynka
David A Cathey
Larry D Kinsman
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Micron Technology Inc
Original Assignee
Micron Display Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micron Display Technology Inc filed Critical Micron Display Technology Inc
Publication of FR2739490A1 publication Critical patent/FR2739490A1/fr
Application granted granted Critical
Publication of FR2739490B1 publication Critical patent/FR2739490B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/38—Exhausting, degassing, filling, or cleaning vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/24—Manufacture or joining of vessels, leading-in conductors or bases
    • H01J9/26—Sealing together parts of vessels
    • H01J9/261—Sealing together parts of vessels the vessel being for a flat panel display
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J1/00—Details of electrodes, of magnetic control means, of screens, or of the mounting or spacing thereof, common to two or more basic types of discharge tubes or lamps
    • H01J1/02—Main electrodes
    • H01J1/30—Cold cathodes, e.g. field-emissive cathode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/38—Exhausting, degassing, filling, or cleaning vessels
    • H01J9/385—Exhausting vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2329/00—Electron emission display panels, e.g. field emission display panels

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacture Of Electron Tubes, Discharge Lamp Vessels, Lead-In Wires, And The Like (AREA)
  • Cathode-Ray Tubes And Fluorescent Screens For Display (AREA)
  • Cold Cathode And The Manufacture (AREA)
  • Vessels, Lead-In Wires, Accessory Apparatuses For Cathode-Ray Tubes (AREA)
FR9611880A 1995-09-29 1996-09-30 Procede de mise sous vide et d'etancheification de modules notamment d'affichage par emission de champ, et modules obtenus Expired - Fee Related FR2739490B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/538,498 US5697825A (en) 1995-09-29 1995-09-29 Method for evacuating and sealing field emission displays

Publications (2)

Publication Number Publication Date
FR2739490A1 FR2739490A1 (fr) 1997-04-04
FR2739490B1 true FR2739490B1 (fr) 2006-06-02

Family

ID=24147165

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9611880A Expired - Fee Related FR2739490B1 (fr) 1995-09-29 1996-09-30 Procede de mise sous vide et d'etancheification de modules notamment d'affichage par emission de champ, et modules obtenus

Country Status (5)

Country Link
US (3) US5697825A (fr)
JP (1) JP3128564B2 (fr)
KR (1) KR100229586B1 (fr)
FR (1) FR2739490B1 (fr)
TW (1) TW367523B (fr)

Families Citing this family (80)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5697825A (en) * 1995-09-29 1997-12-16 Micron Display Technology, Inc. Method for evacuating and sealing field emission displays
US5807154A (en) * 1995-12-21 1998-09-15 Micron Display Technology, Inc. Process for aligning and sealing field emission displays
US5827102A (en) * 1996-05-13 1998-10-27 Micron Technology, Inc. Low temperature method for evacuating and sealing field emission displays
FR2755294A1 (fr) * 1996-10-25 1998-05-01 Pixtech Sa Procede et dispositif d'assemblage d'un ecran plat de visualisation
FR2755295B1 (fr) * 1996-10-28 1998-11-27 Commissariat Energie Atomique Procede de fabrication d'un dispositif a emission de champ sous vide et appareils pour la mise en oeuvre de ce procede
US6109994A (en) * 1996-12-12 2000-08-29 Candescent Technologies Corporation Gap jumping to seal structure, typically using combination of vacuum and non-vacuum environments
US5977706A (en) 1996-12-12 1999-11-02 Candescent Technologies Corporation Multi-compartment getter-containing flat-panel device
US5820435A (en) * 1996-12-12 1998-10-13 Candescent Technologies Corporation Gap jumping to seal structure including tacking of structure
EP0944912B1 (fr) * 1996-12-12 2009-12-16 Canon Kabushiki Kaisha Procede de saut d'interstice de scellement de structures de plaques
US6129603A (en) * 1997-06-24 2000-10-10 Candescent Technologies Corporation Low temperature glass frit sealing for thin computer displays
JPH11135018A (ja) 1997-08-29 1999-05-21 Canon Inc 画像形成装置の製造方法、製造装置および画像形成装置
AU9600598A (en) * 1997-10-01 1999-04-23 Screen Developments Ltd Visual display
US6319436B1 (en) * 1997-10-27 2001-11-20 Trw Inc. Method for making floor fan seal plug with thermoexpanding seal ring and axial guide members
KR100273139B1 (ko) 1997-11-25 2000-12-01 정선종 전계방출디스플레이의패키징방법
US6370019B1 (en) 1998-02-17 2002-04-09 Sarnoff Corporation Sealing of large area display structures
US6897855B1 (en) * 1998-02-17 2005-05-24 Sarnoff Corporation Tiled electronic display structure
JP3896686B2 (ja) * 1998-03-27 2007-03-22 双葉電子工業株式会社 真空外周器の真空方法
KR100270888B1 (ko) * 1998-04-08 2000-12-01 윤종용 노운 굿 다이 제조장치
DE19817478B4 (de) * 1998-04-20 2004-03-18 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Flache Entladungslampe und Verfahren zu ihrer Herstellung
JP3057081B2 (ja) * 1998-05-18 2000-06-26 キヤノン株式会社 気密容器の製造方法および該気密容器を用いる画像形成装置の製造方法
JP3465634B2 (ja) * 1998-06-29 2003-11-10 富士通株式会社 プラズマディスプレイパネルの製造方法
FR2781308A1 (fr) * 1998-07-15 2000-01-21 Thomson Plasma Procede de realisation de moyens d'entretoisement pour panneaux de visualisation
JP3428931B2 (ja) * 1998-09-09 2003-07-22 キヤノン株式会社 フラットパネルディスプレイの解体処理方法
DE19845075A1 (de) * 1998-09-30 2000-04-13 Siemens Ag Verfahren zum Herstellen eines Bauelementes und Bauelement
US6396207B1 (en) * 1998-10-20 2002-05-28 Canon Kabushiki Kaisha Image display apparatus and method for producing the same
WO2000045411A1 (fr) * 1999-01-29 2000-08-03 Hitachi, Ltd. Ecran de type a decharge gazeuse et procede de production de ce dernier
US6533632B1 (en) 1999-02-18 2003-03-18 Micron Technology, Inc. Method of evacuating and sealing flat panel displays and flat panel displays using same
US6030267A (en) * 1999-02-19 2000-02-29 Micron Technology, Inc. Alignment method for field emission and plasma displays
US6908354B1 (en) * 1999-03-10 2005-06-21 Canon Kabushiki Kaisha Method of producing flat panel displays
KR100491913B1 (ko) * 1999-03-31 2005-05-27 가부시끼가이샤 도시바 평판형 화상 표시 장치의 제조 방법 및 평판형 화상 표시장치
US6354899B1 (en) 1999-04-26 2002-03-12 Chad Byron Moore Frit-sealing process used in making displays
FR2793068B1 (fr) * 1999-04-28 2001-05-25 Commissariat Energie Atomique Dispositif a emission de champ utilisant un gaz reducteur et fabrication d'un tel dispositif
US6930446B1 (en) 1999-08-31 2005-08-16 Micron Technology, Inc. Method for improving current stability of field emission displays
AT408157B (de) 1999-10-15 2001-09-25 Electrovac Verfahren zur herstellung eines feldemissions-displays
KR100352160B1 (ko) * 1999-11-16 2002-09-12 권상직 진공 인라인 방식의 평판 표시소자 제작을 위한 실링용페이스트의 제조 방법 및 상기 실링용 페이스트를 이용한실링 방법
KR100527081B1 (ko) * 1999-12-21 2005-11-09 비오이 하이디스 테크놀로지 주식회사 전계 방출 표시 패널의 제조 방법
JP2001210258A (ja) * 2000-01-24 2001-08-03 Toshiba Corp 画像表示装置およびその製造方法
DE60133331T3 (de) 2000-02-15 2012-12-06 Nsk Ltd. Lenkung für ein Automobil
JP3754859B2 (ja) * 2000-02-16 2006-03-15 キヤノン株式会社 画像表示装置の製造法
JP3754883B2 (ja) * 2000-03-23 2006-03-15 キヤノン株式会社 画像表示装置の製造法
FR2809864A1 (fr) * 2000-05-30 2001-12-07 Pixtech Sa Outillage de pose d'espaceurs dans un ecran plat de visualisation
EP1410415A1 (fr) * 2000-06-01 2004-04-21 Complete Substrate Solutions Limited Ecran d'affichage
US6722937B1 (en) 2000-07-31 2004-04-20 Candescent Technologies Corporation Sealing of flat-panel device
US6507147B1 (en) * 2000-08-31 2003-01-14 Intevac, Inc. Unitary vacuum tube incorporating high voltage isolation
JP3754882B2 (ja) * 2000-09-29 2006-03-15 キヤノン株式会社 画像表示装置の製造法
US6383924B1 (en) 2000-12-13 2002-05-07 Micron Technology, Inc. Method of forming buried conductor patterns by surface transformation of empty spaces in solid state materials
WO2002054436A1 (fr) * 2000-12-28 2002-07-11 Jae-Hong Park Procede de scellement sous vide d'un ecran plat
JP2002245941A (ja) * 2001-02-13 2002-08-30 Nec Corp プラズマディスプレイパネルの製造方法
CN1306538C (zh) * 2001-04-23 2007-03-21 株式会社东芝 图像显示器件及其制造方法和制造装置
KR100554798B1 (ko) * 2001-05-08 2006-02-22 마츠시타 덴끼 산교 가부시키가이샤 플라즈마 디스플레이 장치의 제조 방법
US7142577B2 (en) 2001-05-16 2006-11-28 Micron Technology, Inc. Method of forming mirrors by surface transformation of empty spaces in solid state materials and structures thereon
US6898362B2 (en) * 2002-01-17 2005-05-24 Micron Technology Inc. Three-dimensional photonic crystal waveguide structure and method
JP4894987B2 (ja) * 2001-06-29 2012-03-14 三洋電機株式会社 表示用パネルの製造方法
JP2003017259A (ja) * 2001-06-29 2003-01-17 Sanyo Electric Co Ltd エレクトロルミネッセンス表示パネルの製造方法
JP4614588B2 (ja) 2001-06-29 2011-01-19 三洋電機株式会社 エレクトロルミネッセンス表示装置の製造方法
JP2003015552A (ja) * 2001-06-29 2003-01-17 Sanyo Electric Co Ltd 表示用パネルの製造方法
CN1213389C (zh) * 2001-08-31 2005-08-03 佳能株式会社 图像显示装置及其制造方法
US7288171B2 (en) * 2002-01-18 2007-10-30 University Of North Texas Method for using field emitter arrays in chemical and biological hazard mitigation and remediation
US6919678B2 (en) * 2002-09-03 2005-07-19 Bloomberg Lp Bezel-less electric display
AU2003225641A1 (en) * 2002-09-03 2004-03-29 Bloomberg Lp Bezel-less electronic display
US7501329B2 (en) 2003-05-21 2009-03-10 Micron Technology, Inc. Wafer gettering using relaxed silicon germanium epitaxial proximity layers
US7273788B2 (en) 2003-05-21 2007-09-25 Micron Technology, Inc. Ultra-thin semiconductors bonded on glass substrates
US7662701B2 (en) 2003-05-21 2010-02-16 Micron Technology, Inc. Gettering of silicon on insulator using relaxed silicon germanium epitaxial proximity layers
US7008854B2 (en) 2003-05-21 2006-03-07 Micron Technology, Inc. Silicon oxycarbide substrates for bonded silicon on insulator
US6929984B2 (en) 2003-07-21 2005-08-16 Micron Technology Inc. Gettering using voids formed by surface transformation
US6903860B2 (en) * 2003-11-01 2005-06-07 Fusao Ishii Vacuum packaged micromirror arrays and methods of manufacturing the same
US7153753B2 (en) 2003-08-05 2006-12-26 Micron Technology, Inc. Strained Si/SiGe/SOI islands and processes of making same
US20050238803A1 (en) * 2003-11-12 2005-10-27 Tremel James D Method for adhering getter material to a surface for use in electronic devices
US20060284556A1 (en) * 2003-11-12 2006-12-21 Tremel James D Electronic devices and a method for encapsulating electronic devices
US20060283546A1 (en) * 2003-11-12 2006-12-21 Tremel James D Method for encapsulating electronic devices and a sealing assembly for the electronic devices
JP5068924B2 (ja) * 2004-02-20 2012-11-07 中外炉工業株式会社 ガラスパネル組立体の連続封着処理炉および封着処理方法
JP2005251474A (ja) * 2004-03-02 2005-09-15 Toshiba Corp 画像表示装置の製造方法、および封着材充填装置
KR100575363B1 (ko) * 2004-04-13 2006-05-03 재단법인서울대학교산학협력재단 미소기계소자의 진공 실장방법 및 이 방법에 의해 진공실장된 미소기계소자
US20050253283A1 (en) * 2004-05-13 2005-11-17 Dcamp Jon B Getter deposition for vacuum packaging
US20070001579A1 (en) * 2005-06-30 2007-01-04 Eun-Suk Jeon Glass-to-glass joining method using laser, vacuum envelope manufactured by the method, electron emission display having the vacuum envelope
US8173995B2 (en) 2005-12-23 2012-05-08 E. I. Du Pont De Nemours And Company Electronic device including an organic active layer and process for forming the electronic device
US7993977B2 (en) * 2007-07-02 2011-08-09 Micron Technology, Inc. Method of forming molded standoff structures on integrated circuit devices
WO2009025161A1 (fr) * 2007-08-17 2009-02-26 Toppan Printing Co., Ltd. Gabarit indépendant d'un champ de réaction, et dispositif de traitement de puce de réaction utilisant le gabarit
CN101470040B (zh) * 2007-12-28 2011-05-25 中国航天科技集团公司第五研究院第五一〇研究所 一种用于危险气体安全测量的低压力规
US20090214726A1 (en) * 2008-02-26 2009-08-27 Ballman Darryl J Sugar free and sugar reduced aerated confections and methods of preparation

Family Cites Families (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2882116A (en) * 1956-09-20 1959-04-14 Eitel Mccullough Inc Method of making electron tubes
US3330982A (en) * 1964-08-14 1967-07-11 Sylvania Electric Prod Hermetically encased electroluminescent display device
NL6909119A (fr) * 1969-06-13 1970-12-15
US4005920A (en) * 1975-07-09 1977-02-01 International Telephone And Telegraph Corporation Vacuum-tight metal-to-metal seal
JPS52130274A (en) * 1976-04-24 1977-11-01 Ise Electronics Corp Vacuum part and device for sealing same
US4018374A (en) * 1976-06-01 1977-04-19 Ford Aerospace & Communications Corporation Method for forming a bond between sapphire and glass
IT1160700B (it) * 1977-10-25 1987-03-11 Bfg Glassgroup Pannelli
US4259613A (en) * 1978-01-11 1981-03-31 Wagner Electric Corporation Fluorescent indicator and method of making same
JPS55151742A (en) * 1979-05-16 1980-11-26 Futaba Corp Manufacture of front part of plane type fluorescent display tube case
US4245273A (en) * 1979-06-29 1981-01-13 International Business Machines Corporation Package for mounting and interconnecting a plurality of large scale integrated semiconductor devices
US4417296A (en) * 1979-07-23 1983-11-22 Rca Corp Method of connecting surface mounted packages to a circuit board and the resulting connector
US4407658A (en) * 1981-03-02 1983-10-04 Beckman Instruments, Inc. Gas discharge display device sealing method for reducing gas contamination
US4665468A (en) * 1984-07-10 1987-05-12 Nec Corporation Module having a ceramic multi-layer substrate and a multi-layer circuit thereupon, and process for manufacturing the same
JPS6142837A (ja) * 1984-08-02 1986-03-01 Matsushita Electric Ind Co Ltd 画像表示装置の製造方法
JPS61118948A (ja) * 1984-11-14 1986-06-06 Matsushita Electronics Corp 撮像管
JPH063714B2 (ja) * 1985-03-25 1994-01-12 松下電器産業株式会社 画像表示装置
JPS62265796A (ja) * 1986-05-14 1987-11-18 株式会社住友金属セラミックス セラミツク多層配線基板およびその製造法
JPH02216732A (ja) * 1989-02-17 1990-08-29 Mitsubishi Electric Corp 発光素子の製造方法
JPH0311524A (ja) * 1989-06-08 1991-01-18 Nec Kagoshima Ltd 蛍光表示管の真空気密封止方法
JP2734760B2 (ja) * 1990-08-10 1998-04-02 松下電器産業株式会社 画像表示装置の製造方法
EP0729171B1 (fr) * 1990-12-28 2000-08-23 Sony Corporation Procédé de fabrication d'un dispositif d'affichage plat
US5519332A (en) * 1991-06-04 1996-05-21 Micron Technology, Inc. Carrier for testing an unpackaged semiconductor die
JPH05121013A (ja) * 1991-10-28 1993-05-18 Mitsubishi Electric Corp 平板型陰極線管
WO1993016484A1 (fr) * 1992-02-10 1993-08-19 Seiko Epson Corporation Ecran fluorescent et procede pour former une couche fluorescente dans cet ecran, procede de scellement sous vide et procede d'acceleration du niveau de vide pour l'espace contenu dans l'ecran
US5229331A (en) * 1992-02-14 1993-07-20 Micron Technology, Inc. Method to form self-aligned gate structures around cold cathode emitter tips using chemical mechanical polishing technology
US5205770A (en) * 1992-03-12 1993-04-27 Micron Technology, Inc. Method to form high aspect ratio supports (spacers) for field emission display using micro-saw technology
US5210472A (en) * 1992-04-07 1993-05-11 Micron Technology, Inc. Flat panel display in which low-voltage row and column address signals control a much pixel activation voltage
US5424605A (en) * 1992-04-10 1995-06-13 Silicon Video Corporation Self supporting flat video display
US5302238A (en) * 1992-05-15 1994-04-12 Micron Technology, Inc. Plasma dry etch to produce atomically sharp asperities useful as cold cathodes
JPH06111735A (ja) * 1992-09-25 1994-04-22 Futaba Corp 電界放出形陰極を実装した表示装置及び電界放出形陰極の実装方法
JP2722979B2 (ja) * 1993-01-18 1998-03-09 双葉電子工業株式会社 蛍光表示装置及び蛍光表示装置の製造方法
JP2832510B2 (ja) * 1994-05-10 1998-12-09 双葉電子工業株式会社 表示装置の製造方法
US5587622A (en) * 1994-07-12 1996-12-24 Fallon Luminous Products Low pressure gas discharge lamps with low profile sealing cover plate
US5541466A (en) * 1994-11-18 1996-07-30 Texas Instruments Incorporated Cluster arrangement of field emission microtips on ballast layer
US5766053A (en) * 1995-02-10 1998-06-16 Micron Technology, Inc. Internal plate flat-panel field emission display
US5697825A (en) * 1995-09-29 1997-12-16 Micron Display Technology, Inc. Method for evacuating and sealing field emission displays
US5827102A (en) * 1996-05-13 1998-10-27 Micron Technology, Inc. Low temperature method for evacuating and sealing field emission displays

Also Published As

Publication number Publication date
KR970017805A (ko) 1997-04-30
JP3128564B2 (ja) 2001-01-29
KR100229586B1 (ko) 1999-11-15
US5697825A (en) 1997-12-16
FR2739490A1 (fr) 1997-04-04
JPH09171768A (ja) 1997-06-30
US5997378A (en) 1999-12-07
US5788551A (en) 1998-08-04
TW367523B (en) 1999-08-21

Similar Documents

Publication Publication Date Title
FR2739490B1 (fr) Procede de mise sous vide et d'etancheification de modules notamment d'affichage par emission de champ, et modules obtenus
AU4148597A (en) Method and apparatus for improved vacuum diode heat pump
AU6451996A (en) Method and apparatus for vacuum diode heat pump
AU4975996A (en) Method and device for administering analgesics
AU6693696A (en) Quantitative dental caries detection system and method
AU4184099A (en) Zero dead time architecture and method for flow cytometer
AU7450896A (en) Process for aligning and sealing field emission displays
GB9800382D0 (en) Permanent magnet array apparatus and method
IL124757A0 (en) Ultrasonic system and method
EP0830086A4 (fr) Procede permettant de detacher des polypes et de les accrocher et appareil correspondant
AU3888595A (en) System and method for providing secure internetwork services
AU1108100A (en) System and method for positioning teeth
AU6910096A (en) Method and apparatus for encapsulating particulates
AU7696198A (en) Apparatus and method for high efficiency hemofiltration
AU5659896A (en) Semiconductor device and method for making same
EP0723303A3 (fr) Dispositif semi-conducteur émetteur de lumière et méthode de fabrication
IT1296275B1 (it) Metodo e dispositivo per il taglio di film utilizzato per l'avvolgimento di gruppi di prodotti.
AU4900196A (en) Messaging system and method having roaming capability
AU2077999A (en) Device and method for cultivating shellfish
SG54364A1 (en) Refrigeration system and method for cooling a susceptor using a refrigeration system
EP0811994A4 (fr) Aimant permanent destine a des applications dans des conditions d'ultravide et procede de fabrication
AU6328899A (en) Pumping method and device
IT1273136B (it) Procedimento per la sigillatura di un connettore elettrico e connettore cosi' ottenuto
ITBO960254A0 (it) Metodo ed unita' per l'ordinamento di prodotti
FR2724278B1 (fr) Procede de reconstitution et de delivrance de messages segmentes

Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20101029