FR2658003B1 - Dispositif de commutation de puissance a semiconducteur. - Google Patents

Dispositif de commutation de puissance a semiconducteur.

Info

Publication number
FR2658003B1
FR2658003B1 FR9016416A FR9016416A FR2658003B1 FR 2658003 B1 FR2658003 B1 FR 2658003B1 FR 9016416 A FR9016416 A FR 9016416A FR 9016416 A FR9016416 A FR 9016416A FR 2658003 B1 FR2658003 B1 FR 2658003B1
Authority
FR
France
Prior art keywords
switching elements
control circuits
metal substrate
power switching
noise
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
FR9016416A
Other languages
English (en)
Other versions
FR2658003A1 (fr
Inventor
Fukunaga Masanori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of FR2658003A1 publication Critical patent/FR2658003A1/fr
Application granted granted Critical
Publication of FR2658003B1 publication Critical patent/FR2658003B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/142—Metallic substrates having insulating layers
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H—ELECTRICITY
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    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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    • H01L25/162—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits the devices being mounted on two or more different substrates
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
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    • H01L2924/19101—Disposition of discrete passive components
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    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Inverter Devices (AREA)
  • Power Conversion In General (AREA)
  • Semiconductor Integrated Circuits (AREA)
FR9016416A 1990-01-25 1990-12-28 Dispositif de commutation de puissance a semiconducteur. Expired - Lifetime FR2658003B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1665390 1990-01-25

Publications (2)

Publication Number Publication Date
FR2658003A1 FR2658003A1 (fr) 1991-08-09
FR2658003B1 true FR2658003B1 (fr) 1995-10-20

Family

ID=11922303

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9016416A Expired - Lifetime FR2658003B1 (fr) 1990-01-25 1990-12-28 Dispositif de commutation de puissance a semiconducteur.

Country Status (3)

Country Link
US (1) US5077595A (fr)
DE (1) DE4034674C2 (fr)
FR (1) FR2658003B1 (fr)

Families Citing this family (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2875076B2 (ja) * 1990-11-29 1999-03-24 三井化学株式会社 フレキシブル配線基板
US5296735A (en) * 1991-01-21 1994-03-22 Mitsubishi Denki Kabushiki Kaisha Power semiconductor module with multiple shielding layers
US5459348A (en) * 1991-05-24 1995-10-17 Astec International, Ltd. Heat sink and electromagnetic interference shield assembly
JPH0513562A (ja) * 1991-07-05 1993-01-22 Hitachi Ltd 駆動制御装置
US5151775A (en) * 1991-10-07 1992-09-29 Tektronix, Inc. Integrated circuit device having improved substrate capacitance isolation
JP2772184B2 (ja) * 1991-11-07 1998-07-02 株式会社東芝 半導体装置
JP2656416B2 (ja) * 1991-12-16 1997-09-24 三菱電機株式会社 半導体装置および半導体装置の製造方法、並びに半導体装置に用いられる複合基板および複合基板の製造方法
JP2854757B2 (ja) * 1992-06-17 1999-02-03 三菱電機株式会社 半導体パワーモジュール
TW238419B (fr) * 1992-08-21 1995-01-11 Olin Corp
DE4418426B4 (de) * 1993-09-08 2007-08-02 Mitsubishi Denki K.K. Halbleiterleistungsmodul und Verfahren zur Herstellung des Halbleiterleistungsmoduls
DE69306919T2 (de) * 1992-11-18 1997-05-15 Fuji Electric Co Ltd Halbleiter-Umwandlungsvorrichtung
US5559374A (en) * 1993-03-25 1996-09-24 Sanyo Electric Co., Ltd. Hybrid integrated circuit
JP2912526B2 (ja) * 1993-07-05 1999-06-28 三菱電機株式会社 半導体パワーモジュールおよび複合基板
US5360942A (en) * 1993-11-16 1994-11-01 Olin Corporation Multi-chip electronic package module utilizing an adhesive sheet
DE4421319A1 (de) * 1994-06-17 1995-12-21 Abb Management Ag Niederinduktives Leistungshalbleitermodul
US5455387A (en) * 1994-07-18 1995-10-03 Olin Corporation Semiconductor package with chip redistribution interposer
DE19523010A1 (de) * 1995-04-25 1996-11-07 Duerrwaechter E Dr Doduco Schaltungsanordnung aus einem Leistungshalbleiter und einer Ansteuerschaltung dafür
US5534356A (en) * 1995-04-26 1996-07-09 Olin Corporation Anodized aluminum substrate having increased breakdown voltage
DE19542943C2 (de) * 1995-11-17 2001-03-08 Daimler Chrysler Ag Verfahren zur Herstellung eines mikroelektronischen Bauteils mit einer mehrlagigen Komposit-Struktur
JP3394377B2 (ja) * 1996-01-09 2003-04-07 三菱電機株式会社 半導体装置および半導体モジュール
DE19725836C2 (de) * 1997-06-18 2001-10-04 Infineon Technologies Ag Leistungshalbleiter-Anordnung auf DCB-Substrat
JPH11233712A (ja) 1998-02-12 1999-08-27 Hitachi Ltd 半導体装置及びその製法とそれを使った電気機器
JP3625692B2 (ja) * 1999-05-28 2005-03-02 三菱電機株式会社 車載用電力変換装置
DE60031762T2 (de) 1999-06-18 2007-08-23 Matsushita Electric Industrial Co., Ltd., Kadoma Ausgangssteuereinheit
DE10158185B4 (de) * 2000-12-20 2005-08-11 Semikron Elektronik Gmbh Leistungshalbleitermodul mit hoher Isolationsfestigkeit
US7003970B2 (en) 2001-07-09 2006-02-28 Daikin Industries, Ltd. Power module and air conditioner
DE10227658B4 (de) * 2002-06-20 2012-03-08 Curamik Electronics Gmbh Metall-Keramik-Substrat für elektrische Schaltkreise -oder Module, Verfahren zum Herstellen eines solchen Substrates sowie Modul mit einem solchen Substrat
US6905979B2 (en) * 2002-12-23 2005-06-14 Intel Corporation Apparatus and method for improving AC coupling on circuit boards
DE10316136A1 (de) * 2003-04-09 2004-11-18 Ixys Semiconductor Gmbh Gekapselte Leistungshalbleiteranordnung
US6975513B2 (en) * 2003-05-14 2005-12-13 Cyntec Co., Ltd. Construction for high density power module package
US6775145B1 (en) * 2003-05-14 2004-08-10 Cyntec Co., Ltd. Construction for high density power module package (case II)
DE102005016830A1 (de) * 2004-04-14 2005-11-03 Denso Corp., Kariya Halbleitervorrichtung und Verfahren zu ihrer Herstellung
JP4083142B2 (ja) * 2004-06-02 2008-04-30 富士通株式会社 半導体装置
DE112006002488B4 (de) * 2005-09-21 2014-05-28 International Rectifier Corp. Halbleiter-Baueinheit
JP4764365B2 (ja) * 2007-02-28 2011-08-31 三菱重工業株式会社 インバータ一体型電動圧縮機
EP1968188B1 (fr) * 2007-03-09 2012-08-08 HÜTTINGER Elektronik GmbH + Co. KG Agencement d'amplificateur de classe D
DE102008026347B4 (de) * 2008-05-31 2010-08-19 Semikron Elektronik Gmbh & Co. Kg Leistungselektronische Anordnung mit einem Substrat und einem Grundkörper
KR101890966B1 (ko) 2011-02-08 2018-08-22 캠브리지 나노썸 리미티드 비금속성 코팅 및 이의 제조방법
FR2990795B1 (fr) * 2012-05-16 2015-12-11 Sagem Defense Securite Agencement de module electronique de puissance
CN104465603A (zh) 2013-09-23 2015-03-25 台达电子企业管理（上海）有限公司 功率模块
US10411609B2 (en) * 2017-12-22 2019-09-10 Panasonic Intellectual Property Management Co., Ltd. Substrate mounted inverter device
JP2022057424A (ja) * 2020-09-30 2022-04-11 シャープセミコンダクターイノベーション株式会社 パワーモジュール

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3518504A (en) * 1966-11-15 1970-06-30 Int Standard Electric Corp Transistor with lead-in electrodes
US4168507A (en) * 1977-11-21 1979-09-18 Motorola, Inc. Structure and technique for achieving reduced inductive effect of undesired components of common lead inductance in a semiconductive RF power package
JPS56114381A (en) * 1980-02-15 1981-09-08 Toshiba Corp Semiconductor device
US4851831A (en) * 1981-05-13 1989-07-25 Drexelbrook Engineering Co. Two-wire level measuring instrument
JPS5994849A (ja) * 1982-11-24 1984-05-31 Nec Corp 半導体集積回路装置
US4847603A (en) * 1986-05-01 1989-07-11 Blanchard Clark E Automatic closed loop scaling and drift correcting system and method particularly for aircraft head up displays
JPH0691160B2 (ja) * 1986-05-27 1994-11-14 日本電気株式会社 多層配線の形成方法
JPS63124555A (ja) * 1986-11-14 1988-05-28 Sumitomo Electric Ind Ltd 半導体装置用基板
JPS63265461A (ja) * 1986-12-15 1988-11-01 Fuji Electric Co Ltd 半導体装置
JP2584986B2 (ja) * 1987-03-10 1997-02-26 三菱電機株式会社 半導体装置の配線構造

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US5077595A (en) 1991-12-31
DE4034674C2 (de) 1995-11-16
DE4034674A1 (de) 1991-08-01
FR2658003A1 (fr) 1991-08-09

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