FR2646289A1 - Circuit integre du type mosfet, en particulier inverseur logique - Google Patents
Circuit integre du type mosfet, en particulier inverseur logique Download PDFInfo
- Publication number
- FR2646289A1 FR2646289A1 FR9005083A FR9005083A FR2646289A1 FR 2646289 A1 FR2646289 A1 FR 2646289A1 FR 9005083 A FR9005083 A FR 9005083A FR 9005083 A FR9005083 A FR 9005083A FR 2646289 A1 FR2646289 A1 FR 2646289A1
- Authority
- FR
- France
- Prior art keywords
- type
- mosfet
- semiconductor substrate
- conductivity
- depletion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims abstract description 88
- 239000012535 impurity Substances 0.000 claims abstract description 48
- 239000004065 semiconductor Substances 0.000 claims abstract description 46
- 238000002955 isolation Methods 0.000 claims abstract description 14
- 230000005669 field effect Effects 0.000 claims abstract description 7
- 238000009413 insulation Methods 0.000 claims description 5
- 108091006146 Channels Proteins 0.000 description 49
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 40
- 239000010408 film Substances 0.000 description 33
- 230000006870 function Effects 0.000 description 22
- 239000007788 liquid Substances 0.000 description 21
- 229910052757 nitrogen Inorganic materials 0.000 description 20
- 229910025794 LaB6 Inorganic materials 0.000 description 18
- 238000000034 method Methods 0.000 description 16
- 239000000463 material Substances 0.000 description 14
- 150000002500 ions Chemical class 0.000 description 11
- 239000010410 layer Substances 0.000 description 9
- 229910052785 arsenic Inorganic materials 0.000 description 8
- 229910052698 phosphorus Inorganic materials 0.000 description 8
- 230000010354 integration Effects 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 108090000699 N-Type Calcium Channels Proteins 0.000 description 5
- 102000004129 N-Type Calcium Channels Human genes 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 238000010276 construction Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Substances [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 238000005566 electron beam evaporation Methods 0.000 description 3
- 238000002513 implantation Methods 0.000 description 3
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000005468 ion implantation Methods 0.000 description 2
- 229910052746 lanthanum Inorganic materials 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 229910052684 Cerium Inorganic materials 0.000 description 1
- 229910052691 Erbium Inorganic materials 0.000 description 1
- -1 LaB6 Chemical class 0.000 description 1
- 229910052779 Neodymium Inorganic materials 0.000 description 1
- 108010075750 P-Type Calcium Channels Proteins 0.000 description 1
- 229910052777 Praseodymium Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000000779 depleting effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 229910052706 scandium Inorganic materials 0.000 description 1
- 229910052711 selenium Inorganic materials 0.000 description 1
- 229910021332 silicide Inorganic materials 0.000 description 1
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/80—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs
- H10D84/82—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components
- H10D84/83—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components of only insulated-gate FETs [IGFET]
- H10D84/84—Combinations of enhancement-mode IGFETs and depletion-mode IGFETs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/60—Electrodes characterised by their materials
- H10D64/66—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/60—Electrodes characterised by their materials
- H10D64/66—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes
- H10D64/661—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes the conductor comprising a layer of silicon contacting the insulator, e.g. polysilicon having vertical doping variation
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/60—Electrodes characterised by their materials
- H10D64/66—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes
- H10D64/667—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes the conductor comprising a layer of alloy material, compound material or organic material contacting the insulator, e.g. TiN workfunction layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/60—Electrodes characterised by their materials
- H10D64/66—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes
- H10D64/667—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes the conductor comprising a layer of alloy material, compound material or organic material contacting the insulator, e.g. TiN workfunction layers
- H10D64/668—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes the conductor comprising a layer of alloy material, compound material or organic material contacting the insulator, e.g. TiN workfunction layers the layer being a silicide, e.g. TiSi2
Landscapes
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Logic Circuits (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10215689 | 1989-04-21 |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2646289A1 true FR2646289A1 (fr) | 1990-10-26 |
FR2646289B1 FR2646289B1 (enrdf_load_stackoverflow) | 1994-08-19 |
Family
ID=14319867
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR9005083A Granted FR2646289A1 (fr) | 1989-04-21 | 1990-04-20 | Circuit integre du type mosfet, en particulier inverseur logique |
Country Status (6)
Country | Link |
---|---|
JP (1) | JPH0348460A (enrdf_load_stackoverflow) |
CA (1) | CA2014296C (enrdf_load_stackoverflow) |
DE (1) | DE4012681A1 (enrdf_load_stackoverflow) |
FR (1) | FR2646289A1 (enrdf_load_stackoverflow) |
GB (1) | GB2231720B (enrdf_load_stackoverflow) |
NL (1) | NL9000949A (enrdf_load_stackoverflow) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2243948B (en) * | 1990-04-20 | 1994-06-08 | Nobuo Mikoshiba | Integrated circuit |
JPH1168105A (ja) | 1997-08-26 | 1999-03-09 | Mitsubishi Electric Corp | 半導体装置 |
US7064050B2 (en) * | 2003-11-28 | 2006-06-20 | International Business Machines Corporation | Metal carbide gate structure and method of fabrication |
US7667277B2 (en) * | 2005-01-13 | 2010-02-23 | International Business Machines Corporation | TiC as a thermally stable p-metal carbide on high k SiO2 gate stacks |
US8063450B2 (en) | 2006-09-19 | 2011-11-22 | Qunano Ab | Assembly of nanoscaled field effect transistors |
JP2022175792A (ja) * | 2021-05-14 | 2022-11-25 | 国立大学法人東京工業大学 | 半導体装置および浮遊ゲートデバイスの製造方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2083351A1 (enrdf_load_stackoverflow) * | 1970-03-17 | 1971-12-17 | Siemens Ag | |
JPS56165359A (en) * | 1980-05-23 | 1981-12-18 | Nec Corp | Semiconductor device |
JPS56165358A (en) * | 1980-05-23 | 1981-12-18 | Nec Corp | Semiconductor device |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5214383A (en) * | 1975-07-24 | 1977-02-03 | Fujitsu Ltd | Mis-type semiconductor device |
JPS57128967A (en) * | 1981-02-02 | 1982-08-10 | Nec Corp | Integrated semiconductor device |
JPS5925273A (ja) * | 1982-08-03 | 1984-02-09 | Toshiba Corp | 半導体装置及びその製造方法 |
JPS59168666A (ja) * | 1983-03-15 | 1984-09-22 | Toshiba Corp | 半導体装置 |
DE3330851A1 (de) * | 1983-08-26 | 1985-03-14 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zum herstellen von hochintegrierten komplementaeren mos-feldeffekttransistorschaltungen |
JPS60100474A (ja) * | 1983-11-04 | 1985-06-04 | Shindengen Electric Mfg Co Ltd | 半導体圧力センサ |
JPS60100473A (ja) * | 1983-11-05 | 1985-06-04 | Mitsubishi Electric Corp | 電界効果トランジスタ |
JPS61137317A (ja) * | 1984-12-10 | 1986-06-25 | Agency Of Ind Science & Technol | 半導体装置用電極材料 |
JPS62219966A (ja) * | 1986-03-22 | 1987-09-28 | Toshiba Corp | 半導体装置 |
JPS63113895A (ja) * | 1986-10-30 | 1988-05-18 | Nec Corp | Mos型半導体集積回路装置 |
-
1990
- 1990-04-10 CA CA002014296A patent/CA2014296C/en not_active Expired - Fee Related
- 1990-04-17 GB GB9008525A patent/GB2231720B/en not_active Expired - Fee Related
- 1990-04-20 NL NL9000949A patent/NL9000949A/nl not_active Application Discontinuation
- 1990-04-20 DE DE4012681A patent/DE4012681A1/de not_active Withdrawn
- 1990-04-20 JP JP2105038A patent/JPH0348460A/ja active Pending
- 1990-04-20 FR FR9005083A patent/FR2646289A1/fr active Granted
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2083351A1 (enrdf_load_stackoverflow) * | 1970-03-17 | 1971-12-17 | Siemens Ag | |
JPS56165359A (en) * | 1980-05-23 | 1981-12-18 | Nec Corp | Semiconductor device |
JPS56165358A (en) * | 1980-05-23 | 1981-12-18 | Nec Corp | Semiconductor device |
Non-Patent Citations (4)
Title |
---|
IBM TECHNICAL DISCLOSURE BULLETIN, vol. 8, no. 4, septembre 1965, pages 677-678, Armonk, NY, US; H.S. LEHMAN et al.: "Fabrication on field effect transistors" * |
IEEE TRANSACTIONS ON ELECTRON DEVICES, vol ED-34, no. 1, janvier 1987, pages 28-38, New York, NY, US; J.J. WATT et al.: "A low-temperature NMOS technology with cesium-implanted load devices" * |
PATENT ABSTRACTS OF JAPAN, vol. 6, no. 52 (E-100)[930], 7 avril 1982; & JP-A-56 165 358 (NIPPON DENKI K.K.) 18-12-1981 * |
PATENT ABSTRACTS OF JAPAN, vol. 6, no. 52 (E-100)[930], 7 avril 1982; & JP-A-56 165 359 (NIPPON DENKI K.K.) 18-12-1981 * |
Also Published As
Publication number | Publication date |
---|---|
NL9000949A (nl) | 1990-11-16 |
GB2231720B (en) | 1993-08-11 |
JPH0348460A (ja) | 1991-03-01 |
DE4012681A1 (de) | 1990-10-25 |
CA2014296C (en) | 2000-08-01 |
GB2231720A (en) | 1990-11-21 |
GB9008525D0 (en) | 1990-06-13 |
CA2014296A1 (en) | 1990-10-21 |
FR2646289B1 (enrdf_load_stackoverflow) | 1994-08-19 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
TP | Transmission of property | ||
ST | Notification of lapse |