FR2646289B1 - - Google Patents

Info

Publication number
FR2646289B1
FR2646289B1 FR9005083A FR9005083A FR2646289B1 FR 2646289 B1 FR2646289 B1 FR 2646289B1 FR 9005083 A FR9005083 A FR 9005083A FR 9005083 A FR9005083 A FR 9005083A FR 2646289 B1 FR2646289 B1 FR 2646289B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9005083A
Other languages
French (fr)
Other versions
FR2646289A1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MASU KASUYA
TSUBOUCHT KAZUO
Original Assignee
MASU KASUYA
TSUBOUCHT KAZUO
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MASU KASUYA, TSUBOUCHT KAZUO filed Critical MASU KASUYA
Publication of FR2646289A1 publication Critical patent/FR2646289A1/fr
Application granted granted Critical
Publication of FR2646289B1 publication Critical patent/FR2646289B1/fr
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/80Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs
    • H10D84/82Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components
    • H10D84/83Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components of only insulated-gate FETs [IGFET]
    • H10D84/84Combinations of enhancement-mode IGFETs and depletion-mode IGFETs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/60Electrodes characterised by their materials
    • H10D64/66Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/60Electrodes characterised by their materials
    • H10D64/66Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes
    • H10D64/661Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes the conductor comprising a layer of silicon contacting the insulator, e.g. polysilicon having vertical doping variation
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/60Electrodes characterised by their materials
    • H10D64/66Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes
    • H10D64/667Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes the conductor comprising a layer of alloy material, compound material or organic material contacting the insulator, e.g. TiN workfunction layers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/60Electrodes characterised by their materials
    • H10D64/66Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes
    • H10D64/667Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes the conductor comprising a layer of alloy material, compound material or organic material contacting the insulator, e.g. TiN workfunction layers
    • H10D64/668Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes the conductor comprising a layer of alloy material, compound material or organic material contacting the insulator, e.g. TiN workfunction layers the layer being a silicide, e.g. TiSi2
FR9005083A 1989-04-21 1990-04-20 Circuit integre du type mosfet, en particulier inverseur logique Granted FR2646289A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10215689 1989-04-21

Publications (2)

Publication Number Publication Date
FR2646289A1 FR2646289A1 (fr) 1990-10-26
FR2646289B1 true FR2646289B1 (enrdf_load_stackoverflow) 1994-08-19

Family

ID=14319867

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9005083A Granted FR2646289A1 (fr) 1989-04-21 1990-04-20 Circuit integre du type mosfet, en particulier inverseur logique

Country Status (6)

Country Link
JP (1) JPH0348460A (enrdf_load_stackoverflow)
CA (1) CA2014296C (enrdf_load_stackoverflow)
DE (1) DE4012681A1 (enrdf_load_stackoverflow)
FR (1) FR2646289A1 (enrdf_load_stackoverflow)
GB (1) GB2231720B (enrdf_load_stackoverflow)
NL (1) NL9000949A (enrdf_load_stackoverflow)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2243948B (en) * 1990-04-20 1994-06-08 Nobuo Mikoshiba Integrated circuit
JPH1168105A (ja) 1997-08-26 1999-03-09 Mitsubishi Electric Corp 半導体装置
US7064050B2 (en) * 2003-11-28 2006-06-20 International Business Machines Corporation Metal carbide gate structure and method of fabrication
US7667277B2 (en) * 2005-01-13 2010-02-23 International Business Machines Corporation TiC as a thermally stable p-metal carbide on high k SiO2 gate stacks
US8063450B2 (en) 2006-09-19 2011-11-22 Qunano Ab Assembly of nanoscaled field effect transistors
JP2022175792A (ja) * 2021-05-14 2022-11-25 国立大学法人東京工業大学 半導体装置および浮遊ゲートデバイスの製造方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2012712B2 (de) * 1970-03-17 1972-11-02 Siemens AG, 1000 Berlin und 8000 München Integrierte bistabile kippschaltung mit feldeffekttransistoren
JPS5214383A (en) * 1975-07-24 1977-02-03 Fujitsu Ltd Mis-type semiconductor device
JPS56165358A (en) * 1980-05-23 1981-12-18 Nec Corp Semiconductor device
JPS56165359A (en) * 1980-05-23 1981-12-18 Nec Corp Semiconductor device
JPS57128967A (en) * 1981-02-02 1982-08-10 Nec Corp Integrated semiconductor device
JPS5925273A (ja) * 1982-08-03 1984-02-09 Toshiba Corp 半導体装置及びその製造方法
JPS59168666A (ja) * 1983-03-15 1984-09-22 Toshiba Corp 半導体装置
DE3330851A1 (de) * 1983-08-26 1985-03-14 Siemens AG, 1000 Berlin und 8000 München Verfahren zum herstellen von hochintegrierten komplementaeren mos-feldeffekttransistorschaltungen
JPS60100474A (ja) * 1983-11-04 1985-06-04 Shindengen Electric Mfg Co Ltd 半導体圧力センサ
JPS60100473A (ja) * 1983-11-05 1985-06-04 Mitsubishi Electric Corp 電界効果トランジスタ
JPS61137317A (ja) * 1984-12-10 1986-06-25 Agency Of Ind Science & Technol 半導体装置用電極材料
JPS62219966A (ja) * 1986-03-22 1987-09-28 Toshiba Corp 半導体装置
JPS63113895A (ja) * 1986-10-30 1988-05-18 Nec Corp Mos型半導体集積回路装置

Also Published As

Publication number Publication date
NL9000949A (nl) 1990-11-16
FR2646289A1 (fr) 1990-10-26
GB2231720B (en) 1993-08-11
JPH0348460A (ja) 1991-03-01
DE4012681A1 (de) 1990-10-25
CA2014296C (en) 2000-08-01
GB2231720A (en) 1990-11-21
GB9008525D0 (en) 1990-06-13
CA2014296A1 (en) 1990-10-21

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Legal Events

Date Code Title Description
TP Transmission of property
ST Notification of lapse