FR2487123B1 - Dispositif semi-conducteur et procede pour relier celui-ci a un support - Google Patents

Dispositif semi-conducteur et procede pour relier celui-ci a un support

Info

Publication number
FR2487123B1
FR2487123B1 FR8114001A FR8114001A FR2487123B1 FR 2487123 B1 FR2487123 B1 FR 2487123B1 FR 8114001 A FR8114001 A FR 8114001A FR 8114001 A FR8114001 A FR 8114001A FR 2487123 B1 FR2487123 B1 FR 2487123B1
Authority
FR
France
Prior art keywords
major surface
semiconductor device
support
same
adhesive layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR8114001A
Other languages
English (en)
Other versions
FR2487123A1 (fr
Inventor
Everhardus Petrus Carolus Ven
Antonius Jogannes Uyen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Publication of FR2487123A1 publication Critical patent/FR2487123A1/fr
Application granted granted Critical
Publication of FR2487123B1 publication Critical patent/FR2487123B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/492—Bases or plates or solder therefor
    • H01L23/4924—Bases or plates or solder therefor characterised by the materials
    • H01L23/4926—Bases or plates or solder therefor characterised by the materials the materials containing semiconductor material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
    • H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
    • H01L21/28512—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table
    • H01L21/28525—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table the conductive layers comprising semiconducting material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83191—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on the semiconductor or solid-state body

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)
  • Electrodes Of Semiconductors (AREA)
FR8114001A 1980-07-18 1981-07-17 Dispositif semi-conducteur et procede pour relier celui-ci a un support Expired FR2487123B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL8004139A NL8004139A (nl) 1980-07-18 1980-07-18 Halfgeleiderinrichting.

Publications (2)

Publication Number Publication Date
FR2487123A1 FR2487123A1 (fr) 1982-01-22
FR2487123B1 true FR2487123B1 (fr) 1986-06-20

Family

ID=19835640

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8114001A Expired FR2487123B1 (fr) 1980-07-18 1981-07-17 Dispositif semi-conducteur et procede pour relier celui-ci a un support

Country Status (8)

Country Link
US (1) US4476483A (fr)
JP (1) JPS5752144A (fr)
CA (1) CA1176764A (fr)
DE (1) DE3124879A1 (fr)
FR (1) FR2487123B1 (fr)
GB (1) GB2080028B (fr)
IE (1) IE51997B1 (fr)
NL (1) NL8004139A (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3335184A1 (de) * 1983-09-28 1985-04-04 Siemens AG, 1000 Berlin und 8000 München Verfahren zum herstellen von halbleiterbausteinen
US4905075A (en) * 1986-05-05 1990-02-27 General Electric Company Hermetic semiconductor enclosure
DE3823347A1 (de) * 1988-07-09 1990-01-11 Semikron Elektronik Gmbh Leistungs-halbleiterelement
JP2731040B2 (ja) * 1991-02-05 1998-03-25 三菱電機株式会社 半導体装置の製造方法
US5441914A (en) * 1994-05-02 1995-08-15 Motorola Inc. Method of forming conductive interconnect structure
US5998237A (en) * 1996-09-17 1999-12-07 Enthone-Omi, Inc. Method for adding layers to a PWB which yields high levels of copper to dielectric adhesion
US7635635B2 (en) * 2006-04-06 2009-12-22 Fairchild Semiconductor Corporation Method for bonding a semiconductor substrate to a metal substrate

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1514111C3 (de) * 1965-01-29 1973-09-20 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Verfahren zur Verlotung von Halbleiterscheiben mit ihren Anschluß elektroden
GB1039257A (en) * 1965-05-21 1966-08-17 Standard Telephones Cables Ltd Semiconductor devices
DE1283970B (de) * 1966-03-19 1968-11-28 Siemens Ag Metallischer Kontakt an einem Halbleiterbauelement
DE1806980A1 (de) * 1967-11-15 1969-06-19 Fairchild Camera Instr Co Halbleiter-Bauelement
DE1614668B2 (de) * 1967-12-01 1974-08-29 Semikron Gesellschaft Fuer Gleichrichterbau Und Elektronik Mbh, 8500 Nuernberg Halbleiter-Anordnung mit Großflächigen, gut lötbaren Kontaktelektroden und Verfahren zu ihrer Herstellung
DE1803489A1 (de) * 1968-10-17 1970-05-27 Siemens Ag Verfahren zum Herstellen eines Halbleiterbauelementes
FR2085358A1 (fr) * 1970-04-13 1971-12-24 Comp Generale Electricite
DE2031078A1 (en) * 1970-06-24 1971-12-30 Licentia Gmbh Semiconductor diode - with migration - inhibiting intermediate contact layers
DE2109508C2 (de) * 1971-03-01 1985-04-04 General Electric Co., Schenectady, N.Y. Thyristor
DE7216704U (de) * 1971-05-03 1972-08-10 Motorola Inc Halbleiteranordnung mit flachliegender grenzschicht
US4106051A (en) * 1972-11-08 1978-08-08 Ferranti Limited Semiconductor devices
DE2930779C2 (de) * 1978-07-28 1983-08-04 Tokyo Shibaura Denki K.K., Kawasaki, Kanagawa Halbleitervorrichtung
US4251287A (en) * 1979-10-01 1981-02-17 The University Of Delaware Amorphous semiconductor solar cell

Also Published As

Publication number Publication date
DE3124879C2 (fr) 1991-01-31
IE51997B1 (en) 1987-05-13
GB2080028A (en) 1982-01-27
FR2487123A1 (fr) 1982-01-22
JPS6322458B2 (fr) 1988-05-12
DE3124879A1 (de) 1982-03-18
NL8004139A (nl) 1982-02-16
JPS5752144A (en) 1982-03-27
IE811621L (en) 1982-01-18
US4476483A (en) 1984-10-09
GB2080028B (en) 1984-03-28
CA1176764A (fr) 1984-10-23

Similar Documents

Publication Publication Date Title
AU511235B2 (en) Semiconductor device including an amorphous silicon layer
DE3585239D1 (de) Transistorschaltung fuer halbleitervorrichtung mit hysterese-verhalten und ihre herstellungsverfahren.
FR2480501B1 (fr)
AT387105B (de) Halbleiteranordnung mit herabgesetzter oberflaechenfeldstaerke
KR900008918A (ko) 배선기판과 그 제조방법, 박막 캐리어, 반도체 장치 및 그 장착구조와 반도체 장치장착 방법
FR2399130A1 (fr) Dispositif semi-conducteur photovoltaique
DE3681832D1 (de) Traegerfilm mit klebstoff fuer halbleiterscheibe.
DE3280202D1 (de) Heterouebergang-halbleitereinrichtung mit hoher elektronenbeweglichkeit.
KR860005438A (ko) 반도체칩과 기판과의 접합구조가 개선된 반도체장치
FR2487123B1 (fr) Dispositif semi-conducteur et procede pour relier celui-ci a un support
JPS52101967A (en) Semiconductor device
DE69013646D1 (de) Integrierte Halbleiterschaltungsvorrichtung mit Kontaktierungsflächen am Rande des Halbleiterchips.
DE3574528D1 (de) Diffusionsbariereschicht fuer integrierte schaltungsanordnungen.
DE3165313D1 (en) Semiconductor memory device with substrate voltage biasing
DE3485520D1 (de) Herstellungsverfahren fuer halbleitervorrichtung.
JPS55121669A (en) Method of forming inactive layer on integrated circuit device having substrate of semiconductor material
DE3381695D1 (de) Halbleiterbauelement mit kontaktloch.
DE3170941D1 (en) Semiconductor device with a heat dissipating substrate
JPS6459841A (en) Semiconductor device
JPS57104279A (en) Photo isolator
FR2767966B1 (fr) Dispositif a circuit integre securise et procede de fabrication
JPS53110371A (en) Ceramic package type semiconductor device
DE2961197D1 (en) Method and device for manufacturing an intermediate mounting element for semiconductor chips
JPS56146256A (en) Hybrid ic device
JPS57117280A (en) Semiconductor device and manufacture thereof

Legal Events

Date Code Title Description
ST Notification of lapse