GB2080028B - Adhesive layers for bonding metal layers to semiconductor - Google Patents
Adhesive layers for bonding metal layers to semiconductorInfo
- Publication number
- GB2080028B GB2080028B GB8121778A GB8121778A GB2080028B GB 2080028 B GB2080028 B GB 2080028B GB 8121778 A GB8121778 A GB 8121778A GB 8121778 A GB8121778 A GB 8121778A GB 2080028 B GB2080028 B GB 2080028B
- Authority
- GB
- United Kingdom
- Prior art keywords
- layers
- major surface
- semiconductor
- bonding metal
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 title abstract 4
- 239000012790 adhesive layer Substances 0.000 title abstract 3
- 239000010410 layer Substances 0.000 title abstract 3
- 239000002184 metal Substances 0.000 title abstract 3
- 229910021417 amorphous silicon Inorganic materials 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/492—Bases or plates or solder therefor
- H01L23/4924—Bases or plates or solder therefor characterised by the materials
- H01L23/4926—Bases or plates or solder therefor characterised by the materials the materials containing semiconductor material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
- H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
- H01L21/28512—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table
- H01L21/28525—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table the conductive layers comprising semiconducting material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83191—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on the semiconductor or solid-state body
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Die Bonding (AREA)
- Electrodes Of Semiconductors (AREA)
Abstract
The invention relates to a semiconductor device having a disk-shaped semiconductor body in which on the side of a first major surface at least one circuit element is formed and in which a second major surface present opposite to the first major surface is covered with an adhesive layer on which at least one metal layer is provided, which metal layer is bonded to a carrier. According to the invention, the adhesive layer is formed of doped amorphous silicon of the same conductivity type as the semiconductor body on the side of the second major surface.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL8004139A NL8004139A (en) | 1980-07-18 | 1980-07-18 | SEMICONDUCTOR DEVICE. |
Publications (2)
Publication Number | Publication Date |
---|---|
GB2080028A GB2080028A (en) | 1982-01-27 |
GB2080028B true GB2080028B (en) | 1984-03-28 |
Family
ID=19835640
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB8121778A Expired GB2080028B (en) | 1980-07-18 | 1981-07-15 | Adhesive layers for bonding metal layers to semiconductor |
Country Status (8)
Country | Link |
---|---|
US (1) | US4476483A (en) |
JP (1) | JPS5752144A (en) |
CA (1) | CA1176764A (en) |
DE (1) | DE3124879A1 (en) |
FR (1) | FR2487123B1 (en) |
GB (1) | GB2080028B (en) |
IE (1) | IE51997B1 (en) |
NL (1) | NL8004139A (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3335184A1 (en) * | 1983-09-28 | 1985-04-04 | Siemens AG, 1000 Berlin und 8000 München | METHOD FOR PRODUCING SEMICONDUCTOR COMPONENTS |
US4905075A (en) * | 1986-05-05 | 1990-02-27 | General Electric Company | Hermetic semiconductor enclosure |
DE3823347A1 (en) * | 1988-07-09 | 1990-01-11 | Semikron Elektronik Gmbh | Power semiconductor element |
JP2731040B2 (en) * | 1991-02-05 | 1998-03-25 | 三菱電機株式会社 | Method for manufacturing semiconductor device |
US5441914A (en) * | 1994-05-02 | 1995-08-15 | Motorola Inc. | Method of forming conductive interconnect structure |
US5998237A (en) * | 1996-09-17 | 1999-12-07 | Enthone-Omi, Inc. | Method for adding layers to a PWB which yields high levels of copper to dielectric adhesion |
US7635635B2 (en) * | 2006-04-06 | 2009-12-22 | Fairchild Semiconductor Corporation | Method for bonding a semiconductor substrate to a metal substrate |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1514111C3 (en) * | 1965-01-29 | 1973-09-20 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Method for soldering semiconductor wafers with their connection electrodes |
GB1039257A (en) * | 1965-05-21 | 1966-08-17 | Standard Telephones Cables Ltd | Semiconductor devices |
DE1283970B (en) * | 1966-03-19 | 1968-11-28 | Siemens Ag | Metallic contact on a semiconductor component |
DE1806980A1 (en) * | 1967-11-15 | 1969-06-19 | Fairchild Camera Instr Co | Semiconductor component |
DE1614668B2 (en) * | 1967-12-01 | 1974-08-29 | Semikron Gesellschaft Fuer Gleichrichterbau Und Elektronik Mbh, 8500 Nuernberg | Semiconductor arrangement with large-area, easily solderable contact electrodes and process for their production |
DE1803489A1 (en) * | 1968-10-17 | 1970-05-27 | Siemens Ag | Method for manufacturing a semiconductor component |
FR2085358A1 (en) * | 1970-04-13 | 1971-12-24 | Comp Generale Electricite | |
DE2031078A1 (en) * | 1970-06-24 | 1971-12-30 | Licentia Gmbh | Semiconductor diode - with migration - inhibiting intermediate contact layers |
DE2109508C2 (en) * | 1971-03-01 | 1985-04-04 | General Electric Co., Schenectady, N.Y. | Thyristor |
DE7216704U (en) * | 1971-05-03 | 1972-08-10 | Motorola Inc | SEMICONDUCTOR ARRANGEMENT WITH FLAT-LAYING BORDER LAYER |
US4106051A (en) * | 1972-11-08 | 1978-08-08 | Ferranti Limited | Semiconductor devices |
DE2930779C2 (en) * | 1978-07-28 | 1983-08-04 | Tokyo Shibaura Denki K.K., Kawasaki, Kanagawa | Semiconductor device |
US4251287A (en) * | 1979-10-01 | 1981-02-17 | The University Of Delaware | Amorphous semiconductor solar cell |
-
1980
- 1980-07-18 NL NL8004139A patent/NL8004139A/en not_active Application Discontinuation
-
1981
- 1981-06-25 DE DE19813124879 patent/DE3124879A1/en active Granted
- 1981-07-09 US US06/281,760 patent/US4476483A/en not_active Expired - Fee Related
- 1981-07-15 JP JP56110631A patent/JPS5752144A/en active Granted
- 1981-07-15 GB GB8121778A patent/GB2080028B/en not_active Expired
- 1981-07-16 CA CA000381832A patent/CA1176764A/en not_active Expired
- 1981-07-17 IE IE1621/81A patent/IE51997B1/en not_active IP Right Cessation
- 1981-07-17 FR FR8114001A patent/FR2487123B1/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
NL8004139A (en) | 1982-02-16 |
DE3124879A1 (en) | 1982-03-18 |
FR2487123A1 (en) | 1982-01-22 |
FR2487123B1 (en) | 1986-06-20 |
IE811621L (en) | 1982-01-18 |
DE3124879C2 (en) | 1991-01-31 |
CA1176764A (en) | 1984-10-23 |
US4476483A (en) | 1984-10-09 |
IE51997B1 (en) | 1987-05-13 |
GB2080028A (en) | 1982-01-27 |
JPS5752144A (en) | 1982-03-27 |
JPS6322458B2 (en) | 1988-05-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 19940715 |