FR2377677A1 - Dispositif de visualisation a diodes luminescentes, et son procede de fabrication - Google Patents
Dispositif de visualisation a diodes luminescentes, et son procede de fabricationInfo
- Publication number
- FR2377677A1 FR2377677A1 FR7801164A FR7801164A FR2377677A1 FR 2377677 A1 FR2377677 A1 FR 2377677A1 FR 7801164 A FR7801164 A FR 7801164A FR 7801164 A FR7801164 A FR 7801164A FR 2377677 A1 FR2377677 A1 FR 2377677A1
- Authority
- FR
- France
- Prior art keywords
- display device
- manufacturing process
- luminescent diodes
- wafer
- diodes display
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 abstract 2
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 abstract 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 abstract 1
- 229910052794 bromium Inorganic materials 0.000 abstract 1
- 239000004020 conductor Substances 0.000 abstract 1
- 238000009713 electroplating Methods 0.000 abstract 1
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 abstract 1
- 239000000126 substance Substances 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R13/00—Arrangements for displaying electric variables or waveforms
- G01R13/40—Arrangements for displaying electric variables or waveforms using modulation of a light beam otherwise than by mechanical displacement, e.g. by Kerr effect
- G01R13/404—Arrangements for displaying electric variables or waveforms using modulation of a light beam otherwise than by mechanical displacement, e.g. by Kerr effect for discontinuous display, i.e. display of discrete values
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
- H01L2224/45124—Aluminium (Al) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01057—Lanthanum [La]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
Dispositif de visualisation comportant au moins une diode luminescente en plaquette 4a, 4b, montée sur un substrat 1. La zone 2a, 2b, 2c du substrat 1 entourant chaque diode en plaquette 4a, 4b, ainsi que les conducteurs externes associés 5a, 5b, sont au moins en partie recouverts d'une couche à base d'une substance opaque. La couche opaque peut notamment être à base de noir de cbrome ou de noir de platine, appliquée par galvanoplastie. Application aux dispositifs de visualisation à diodes luminescentes, notamment pour des instruments et équipements électroniques pour l'aéronautique
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB1756/77A GB1597712A (en) | 1977-01-17 | 1977-01-17 | Display devices |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2377677A1 true FR2377677A1 (fr) | 1978-08-11 |
FR2377677B1 FR2377677B1 (fr) | 1983-07-18 |
Family
ID=9727441
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7801164A Granted FR2377677A1 (fr) | 1977-01-17 | 1978-01-17 | Dispositif de visualisation a diodes luminescentes, et son procede de fabrication |
Country Status (5)
Country | Link |
---|---|
US (2) | US4224116A (fr) |
JP (1) | JPS53108398A (fr) |
DE (1) | DE2801419A1 (fr) |
FR (1) | FR2377677A1 (fr) |
GB (1) | GB1597712A (fr) |
Families Citing this family (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55148482A (en) * | 1979-05-08 | 1980-11-19 | Canon Inc | Semiconductor laser device |
JPS5624969A (en) * | 1979-08-09 | 1981-03-10 | Canon Inc | Semiconductor integrated circuit element |
US4733127A (en) * | 1984-06-12 | 1988-03-22 | Sanyo Electric Co., Ltd. | Unit of arrayed light emitting diodes |
NL8901230A (nl) * | 1989-05-17 | 1990-12-17 | Oce Nederland Bv | Belichtings- en afdrukinrichting. |
NL9101745A (nl) * | 1991-10-18 | 1993-05-17 | Oce Nederland Bv | Belichtings- en afdrukinrichting. |
DE59308636D1 (de) * | 1992-08-28 | 1998-07-09 | Siemens Ag | Leuchtdiode |
US5683777A (en) * | 1993-06-16 | 1997-11-04 | Rhone-Poulenc Rhodia Ag | Multiple width fiber strip and method and apparatus for its production |
IL123207A0 (en) | 1998-02-06 | 1998-09-24 | Shellcase Ltd | Integrated circuit device |
WO2002051217A2 (fr) * | 2000-12-21 | 2002-06-27 | Shellcase Ltd. | Circuits integres sous boitier et procedes de production de ceux-ci |
DE10124426A1 (de) * | 2001-05-18 | 2002-11-28 | Omg Ag & Co Kg | Oberflächenbeschichtung aus schwarzem Platin |
JP2003046138A (ja) * | 2001-08-01 | 2003-02-14 | Sharp Corp | Ledランプ及びledランプ製造方法 |
US6856007B2 (en) * | 2001-08-28 | 2005-02-15 | Tessera, Inc. | High-frequency chip packages |
US20040137656A1 (en) * | 2003-01-15 | 2004-07-15 | Gurbir Singh | Low thermal resistance light emitting diode package and a method of making the same |
US6972480B2 (en) * | 2003-06-16 | 2005-12-06 | Shellcase Ltd. | Methods and apparatus for packaging integrated circuit devices |
EP1493666A1 (fr) * | 2003-07-02 | 2005-01-05 | Airbus Deutschland GmbH | Dispositif à multiples pistes conductives pour l'alimentation de l'éclairage à diodes électroluminescantes d'une cabine d'aéronef |
KR101078621B1 (ko) | 2003-07-03 | 2011-11-01 | 테쎄라 테크놀로지스 아일랜드 리미티드 | 집적회로 디바이스를 패키징하기 위한 방법 및 장치 |
WO2005031863A1 (fr) * | 2003-09-26 | 2005-04-07 | Tessera, Inc. | Structure et procede permettant de fabriquer des puces a capot dotees d'interconnecteurs verticaux |
US20050067681A1 (en) * | 2003-09-26 | 2005-03-31 | Tessera, Inc. | Package having integral lens and wafer-scale fabrication method therefor |
US20050139984A1 (en) * | 2003-12-19 | 2005-06-30 | Tessera, Inc. | Package element and packaged chip having severable electrically conductive ties |
US20050189635A1 (en) * | 2004-03-01 | 2005-09-01 | Tessera, Inc. | Packaged acoustic and electromagnetic transducer chips |
KR101085144B1 (ko) * | 2004-04-29 | 2011-11-21 | 엘지디스플레이 주식회사 | Led 램프 유닛 |
US8143095B2 (en) * | 2005-03-22 | 2012-03-27 | Tessera, Inc. | Sequential fabrication of vertical conductive interconnects in capped chips |
US7566853B2 (en) * | 2005-08-12 | 2009-07-28 | Tessera, Inc. | Image sensor employing a plurality of photodetector arrays and/or rear-illuminated architecture |
US20070190747A1 (en) * | 2006-01-23 | 2007-08-16 | Tessera Technologies Hungary Kft. | Wafer level packaging to lidded chips |
US7936062B2 (en) * | 2006-01-23 | 2011-05-03 | Tessera Technologies Ireland Limited | Wafer level chip packaging |
US20080029879A1 (en) * | 2006-03-01 | 2008-02-07 | Tessera, Inc. | Structure and method of making lidded chips |
US8604605B2 (en) | 2007-01-05 | 2013-12-10 | Invensas Corp. | Microelectronic assembly with multi-layer support structure |
DE102007029369A1 (de) * | 2007-06-26 | 2009-01-02 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauelement und Verfahren zur Herstellung eines optoelektronischen Halbleiterbauelements |
US20090261708A1 (en) * | 2008-04-21 | 2009-10-22 | Motorola, Inc. | Glass-phosphor capping structure for leds |
CN102683543B (zh) * | 2011-03-15 | 2015-08-12 | 展晶科技(深圳)有限公司 | Led封装结构 |
DE102016124373A1 (de) * | 2016-12-14 | 2018-06-14 | Osram Opto Semiconductors Gmbh | Strahlungsemittierende Vorrichtung, Pixelmodul, und Verfahren zur Herstellung einer strahlungsemittierenden Vorrichtung |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3501676A (en) * | 1968-04-29 | 1970-03-17 | Zenith Radio Corp | Solid state matrix having an injection luminescent diode as the light source |
FR2076284A5 (fr) * | 1970-01-08 | 1971-10-15 | Radiotechnique Compelec | |
FR2123666A5 (fr) * | 1971-01-27 | 1972-09-15 | Radiotechnique Compelec | |
FR2290721A1 (fr) * | 1974-11-06 | 1976-06-04 | Marconi Co Ltd | Dispositif d'affichage a diodes emissives de lumiere |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2402717A1 (de) * | 1973-01-22 | 1974-08-08 | Tokyo Shibaura Electric Co | Lichtemittierende anzeigevorrichtung und verfahren zu ihrer herstellung |
US4024627A (en) * | 1974-04-29 | 1977-05-24 | Amp Incorporated | Package mounting of electronic chips, such as light emitting diodes |
US4032963A (en) * | 1974-09-03 | 1977-06-28 | Motorola, Inc. | Package and method for a semiconductor radiant energy emitting device |
DE2450456A1 (de) * | 1974-10-24 | 1976-05-06 | Bosch Gmbh Robert | Nebelscheinwerfer |
US3964157A (en) * | 1974-10-31 | 1976-06-22 | Bell Telephone Laboratories, Incorporated | Method of mounting semiconductor chips |
US4000437A (en) * | 1975-12-17 | 1976-12-28 | Integrated Display Systems Incorporated | Electric display device |
JPS5282183A (en) * | 1975-12-29 | 1977-07-09 | Nec Corp | Connecting wires for semiconductor devices |
DE2634264A1 (de) * | 1976-07-30 | 1978-02-02 | Licentia Gmbh | Halbleiter-lumineszenzbauelement |
US4088546A (en) * | 1977-03-01 | 1978-05-09 | Westinghouse Electric Corp. | Method of electroplating interconnections |
-
1977
- 1977-01-17 GB GB1756/77A patent/GB1597712A/en not_active Expired
-
1978
- 1978-01-13 DE DE19782801419 patent/DE2801419A1/de active Granted
- 1978-01-17 JP JP366878A patent/JPS53108398A/ja active Pending
- 1978-01-17 FR FR7801164A patent/FR2377677A1/fr active Granted
-
1979
- 1979-04-13 US US06/029,878 patent/US4224116A/en not_active Expired - Lifetime
- 1979-04-13 US US06/029,879 patent/US4259679A/en not_active Expired - Lifetime
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3501676A (en) * | 1968-04-29 | 1970-03-17 | Zenith Radio Corp | Solid state matrix having an injection luminescent diode as the light source |
FR2076284A5 (fr) * | 1970-01-08 | 1971-10-15 | Radiotechnique Compelec | |
FR2123666A5 (fr) * | 1971-01-27 | 1972-09-15 | Radiotechnique Compelec | |
FR2290721A1 (fr) * | 1974-11-06 | 1976-06-04 | Marconi Co Ltd | Dispositif d'affichage a diodes emissives de lumiere |
Non-Patent Citations (1)
Title |
---|
EXBK/73 * |
Also Published As
Publication number | Publication date |
---|---|
JPS53108398A (en) | 1978-09-21 |
DE2801419C2 (fr) | 1988-05-11 |
FR2377677B1 (fr) | 1983-07-18 |
GB1597712A (en) | 1981-09-09 |
DE2801419A1 (de) | 1978-07-20 |
US4259679A (en) | 1981-03-31 |
US4224116A (en) | 1980-09-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
FR2377677A1 (fr) | Dispositif de visualisation a diodes luminescentes, et son procede de fabrication | |
FR2386145A1 (fr) | Dispositif electroluminescent a semi-conducteurs | |
DE69009216D1 (de) | Epitaxialstruktur für lichtemittierende Halbleiteranordnungen und lichtemittierende Halbleiteranordnung mit dieser Struktur. | |
TW350135B (en) | Semiconductor device and method of manufacturing the same the invention relates to a semiconductor device and method of manufacturing the same | |
KR910002020A (ko) | 화합물반도체장치 및 그 표면처리 가공방법 | |
FR2404308A1 (fr) | Arrangement de diodes emettrices de lumiere multicolores | |
KR920007135A (ko) | 반도체 장치용 리드프레임 | |
KR840003869A (ko) | 화살 표시장치 | |
KR890017802A (ko) | 반도체 장치용 리드프레임 | |
FR2349214A1 (fr) | Procede de realisation d'une jonction p-n a tension de claquage faible dans un substrat semi-conducteur et structures ainsi obtenues | |
KR920007254A (ko) | 반도체장치 | |
SE8007199L (sv) | Zener-diod | |
KR900005593A (ko) | 반도체장치 | |
JPS52156580A (en) | Semiconductor integrated circuit device and its production | |
FR2525031B1 (fr) | Dispositif a semi-conducteur dont le semi-conducteur est forme sur un substrat isolant et son procede de fabrication | |
JPS5681966A (en) | Input protecting circuit for semiconductor device | |
JPS57104279A (en) | Photo isolator | |
KR910009968A (ko) | 단결정 제조장치 | |
JPS57104283A (en) | Josephson junction element and manufacture thereof | |
SU637766A1 (ru) | Пассивный элемент интегральных оптоэлектронных устройств | |
JPS5339087A (en) | Integrated circuit | |
EP0374408A3 (en) | Field-effect transistor and method of producing the same | |
JPS5636157A (en) | Semiconductor device | |
JPS53121489A (en) | Semiconductor device | |
KR900017143A (ko) | 바이-씨모스 반도체소자 제조방법 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
TP | Transmission of property | ||
ST | Notification of lapse |