JPS53108398A - Display unit and its manufacturing method - Google Patents
Display unit and its manufacturing methodInfo
- Publication number
- JPS53108398A JPS53108398A JP366878A JP366878A JPS53108398A JP S53108398 A JPS53108398 A JP S53108398A JP 366878 A JP366878 A JP 366878A JP 366878 A JP366878 A JP 366878A JP S53108398 A JPS53108398 A JP S53108398A
- Authority
- JP
- Japan
- Prior art keywords
- manufacturing
- display unit
- display
- unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R13/00—Arrangements for displaying electric variables or waveforms
- G01R13/40—Arrangements for displaying electric variables or waveforms using modulation of a light beam otherwise than by mechanical displacement, e.g. by Kerr effect
- G01R13/404—Arrangements for displaying electric variables or waveforms using modulation of a light beam otherwise than by mechanical displacement, e.g. by Kerr effect for discontinuous display, i.e. display of discrete values
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
- H01L2224/45124—Aluminium (Al) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01057—Lanthanum [La]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB1756/77A GB1597712A (en) | 1977-01-17 | 1977-01-17 | Display devices |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS53108398A true JPS53108398A (en) | 1978-09-21 |
Family
ID=9727441
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP366878A Pending JPS53108398A (en) | 1977-01-17 | 1978-01-17 | Display unit and its manufacturing method |
Country Status (5)
Country | Link |
---|---|
US (2) | US4224116A (ja) |
JP (1) | JPS53108398A (ja) |
DE (1) | DE2801419A1 (ja) |
FR (1) | FR2377677A1 (ja) |
GB (1) | GB1597712A (ja) |
Families Citing this family (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55148482A (en) * | 1979-05-08 | 1980-11-19 | Canon Inc | Semiconductor laser device |
JPS5624969A (en) * | 1979-08-09 | 1981-03-10 | Canon Inc | Semiconductor integrated circuit element |
US4733127A (en) * | 1984-06-12 | 1988-03-22 | Sanyo Electric Co., Ltd. | Unit of arrayed light emitting diodes |
NL8901230A (nl) * | 1989-05-17 | 1990-12-17 | Oce Nederland Bv | Belichtings- en afdrukinrichting. |
NL9101745A (nl) * | 1991-10-18 | 1993-05-17 | Oce Nederland Bv | Belichtings- en afdrukinrichting. |
DE59308636D1 (de) * | 1992-08-28 | 1998-07-09 | Siemens Ag | Leuchtdiode |
US5683777A (en) * | 1993-06-16 | 1997-11-04 | Rhone-Poulenc Rhodia Ag | Multiple width fiber strip and method and apparatus for its production |
IL123207A0 (en) | 1998-02-06 | 1998-09-24 | Shellcase Ltd | Integrated circuit device |
US7408249B2 (en) * | 1998-02-06 | 2008-08-05 | Tessera Technologies Hungary Kft. | Packaged integrated circuits and methods of producing thereof |
DE10124426A1 (de) * | 2001-05-18 | 2002-11-28 | Omg Ag & Co Kg | Oberflächenbeschichtung aus schwarzem Platin |
JP2003046138A (ja) * | 2001-08-01 | 2003-02-14 | Sharp Corp | Ledランプ及びledランプ製造方法 |
US6856007B2 (en) * | 2001-08-28 | 2005-02-15 | Tessera, Inc. | High-frequency chip packages |
US20040137656A1 (en) * | 2003-01-15 | 2004-07-15 | Gurbir Singh | Low thermal resistance light emitting diode package and a method of making the same |
US6972480B2 (en) * | 2003-06-16 | 2005-12-06 | Shellcase Ltd. | Methods and apparatus for packaging integrated circuit devices |
EP1493666A1 (en) * | 2003-07-02 | 2005-01-05 | Airbus Deutschland GmbH | Multi-layered arrangement of foil layers for supplying power to light emitting diodes in aircraft cabin lighting |
JP2007528120A (ja) * | 2003-07-03 | 2007-10-04 | テッセラ テクノロジーズ ハンガリー コルラートルト フェレロェセーギュー タールシャシャーグ | 集積回路装置をパッケージングする方法及び装置 |
US7129576B2 (en) * | 2003-09-26 | 2006-10-31 | Tessera, Inc. | Structure and method of making capped chips including vertical interconnects having stud bumps engaged to surfaces of said caps |
US20050067681A1 (en) * | 2003-09-26 | 2005-03-31 | Tessera, Inc. | Package having integral lens and wafer-scale fabrication method therefor |
US20050139984A1 (en) * | 2003-12-19 | 2005-06-30 | Tessera, Inc. | Package element and packaged chip having severable electrically conductive ties |
US20050189622A1 (en) * | 2004-03-01 | 2005-09-01 | Tessera, Inc. | Packaged acoustic and electromagnetic transducer chips |
KR101085144B1 (ko) * | 2004-04-29 | 2011-11-21 | 엘지디스플레이 주식회사 | Led 램프 유닛 |
US8143095B2 (en) * | 2005-03-22 | 2012-03-27 | Tessera, Inc. | Sequential fabrication of vertical conductive interconnects in capped chips |
US7566853B2 (en) * | 2005-08-12 | 2009-07-28 | Tessera, Inc. | Image sensor employing a plurality of photodetector arrays and/or rear-illuminated architecture |
US7936062B2 (en) * | 2006-01-23 | 2011-05-03 | Tessera Technologies Ireland Limited | Wafer level chip packaging |
US20070190747A1 (en) * | 2006-01-23 | 2007-08-16 | Tessera Technologies Hungary Kft. | Wafer level packaging to lidded chips |
US20080002460A1 (en) * | 2006-03-01 | 2008-01-03 | Tessera, Inc. | Structure and method of making lidded chips |
US8604605B2 (en) | 2007-01-05 | 2013-12-10 | Invensas Corp. | Microelectronic assembly with multi-layer support structure |
DE102007029369A1 (de) * | 2007-06-26 | 2009-01-02 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauelement und Verfahren zur Herstellung eines optoelektronischen Halbleiterbauelements |
US20090261708A1 (en) * | 2008-04-21 | 2009-10-22 | Motorola, Inc. | Glass-phosphor capping structure for leds |
CN102683543B (zh) * | 2011-03-15 | 2015-08-12 | 展晶科技(深圳)有限公司 | Led封装结构 |
DE102016124373A1 (de) * | 2016-12-14 | 2018-06-14 | Osram Opto Semiconductors Gmbh | Strahlungsemittierende Vorrichtung, Pixelmodul, und Verfahren zur Herstellung einer strahlungsemittierenden Vorrichtung |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3501676A (en) * | 1968-04-29 | 1970-03-17 | Zenith Radio Corp | Solid state matrix having an injection luminescent diode as the light source |
FR2076284A5 (ja) * | 1970-01-08 | 1971-10-15 | Radiotechnique Compelec | |
FR2123666A5 (ja) * | 1971-01-27 | 1972-09-15 | Radiotechnique Compelec | |
US3911431A (en) * | 1973-01-22 | 1975-10-07 | Tokyo Shibaura Electric Co | Light-emitting display device |
US4024627A (en) * | 1974-04-29 | 1977-05-24 | Amp Incorporated | Package mounting of electronic chips, such as light emitting diodes |
US4032963A (en) * | 1974-09-03 | 1977-06-28 | Motorola, Inc. | Package and method for a semiconductor radiant energy emitting device |
DE2450456A1 (de) * | 1974-10-24 | 1976-05-06 | Bosch Gmbh Robert | Nebelscheinwerfer |
US3964157A (en) * | 1974-10-31 | 1976-06-22 | Bell Telephone Laboratories, Incorporated | Method of mounting semiconductor chips |
GB1522145A (en) * | 1974-11-06 | 1978-08-23 | Marconi Co Ltd | Light emissive diode displays |
US4000437A (en) * | 1975-12-17 | 1976-12-28 | Integrated Display Systems Incorporated | Electric display device |
JPS5282183A (en) * | 1975-12-29 | 1977-07-09 | Nec Corp | Connecting wires for semiconductor devices |
DE2634264A1 (de) * | 1976-07-30 | 1978-02-02 | Licentia Gmbh | Halbleiter-lumineszenzbauelement |
US4088546A (en) * | 1977-03-01 | 1978-05-09 | Westinghouse Electric Corp. | Method of electroplating interconnections |
-
1977
- 1977-01-17 GB GB1756/77A patent/GB1597712A/en not_active Expired
-
1978
- 1978-01-13 DE DE19782801419 patent/DE2801419A1/de active Granted
- 1978-01-17 FR FR7801164A patent/FR2377677A1/fr active Granted
- 1978-01-17 JP JP366878A patent/JPS53108398A/ja active Pending
-
1979
- 1979-04-13 US US06/029,878 patent/US4224116A/en not_active Expired - Lifetime
- 1979-04-13 US US06/029,879 patent/US4259679A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
FR2377677A1 (fr) | 1978-08-11 |
GB1597712A (en) | 1981-09-09 |
US4224116A (en) | 1980-09-23 |
FR2377677B1 (ja) | 1983-07-18 |
US4259679A (en) | 1981-03-31 |
DE2801419A1 (de) | 1978-07-20 |
DE2801419C2 (ja) | 1988-05-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS53108398A (en) | Display unit and its manufacturing method | |
JPS53138355A (en) | Single element production method and its device | |
JPS53117997A (en) | Display | |
JPS53142133A (en) | Display unit | |
JPS53141571A (en) | Display unit | |
JPS53114346A (en) | Display unit | |
JPS5414378A (en) | Complex and its manufacture | |
JPS5386595A (en) | Display and manufacturing method thereof | |
JPS5391698A (en) | Display apparatus and display element therefor | |
JPS53110456A (en) | Display unit | |
JPS53102325A (en) | Abrasionn and chemicallproof glass | |
JPS5667887A (en) | Display unit and producing same | |
JPS53108726A (en) | Display unit | |
JPS5452078A (en) | 11alkylimidazole and its manufacture | |
JPS53141278A (en) | Benzenesulfonylurea and its production | |
JPS53123095A (en) | Display | |
JPS53132993A (en) | Display | |
JPS54148395A (en) | Displaying method and device | |
JPS53128117A (en) | Combined panel and manufacturing method thereof | |
IE780374L (en) | Display unit | |
JPS5470608A (en) | Blockkbuild construction method and construction | |
JPS53111614A (en) | Ornamental panel and making method thereof | |
JPS53146433A (en) | Ornamental panel and making method thereof | |
JPS5667886A (en) | Display device and producing same | |
JPS53130999A (en) | Display |