FR2377677A1 - Dispositif de visualisation a diodes luminescentes, et son procede de fabrication - Google Patents

Dispositif de visualisation a diodes luminescentes, et son procede de fabrication

Info

Publication number
FR2377677A1
FR2377677A1 FR7801164A FR7801164A FR2377677A1 FR 2377677 A1 FR2377677 A1 FR 2377677A1 FR 7801164 A FR7801164 A FR 7801164A FR 7801164 A FR7801164 A FR 7801164A FR 2377677 A1 FR2377677 A1 FR 2377677A1
Authority
FR
France
Prior art keywords
display device
manufacturing process
luminescent diodes
wafer
diodes display
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7801164A
Other languages
English (en)
French (fr)
Other versions
FR2377677B1 (enExample
Inventor
Terence Frederick Knibb
Richard George O'rourke
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Plessey Handel und Investments AG
Original Assignee
Plessey Handel und Investments AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Plessey Handel und Investments AG filed Critical Plessey Handel und Investments AG
Publication of FR2377677A1 publication Critical patent/FR2377677A1/fr
Application granted granted Critical
Publication of FR2377677B1 publication Critical patent/FR2377677B1/fr
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R13/00—Arrangements for displaying electric variables or waveforms
    • G01R13/40—Arrangements for displaying electric variables or waveforms using modulation of a light beam otherwise than by mechanical displacement, e.g. by Kerr effect
    • G01R13/404—Arrangements for displaying electric variables or waveforms using modulation of a light beam otherwise than by mechanical displacement, e.g. by Kerr effect for discontinuous display, i.e. display of discrete values
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Led Device Packages (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
FR7801164A 1977-01-17 1978-01-17 Dispositif de visualisation a diodes luminescentes, et son procede de fabrication Granted FR2377677A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB1756/77A GB1597712A (en) 1977-01-17 1977-01-17 Display devices

Publications (2)

Publication Number Publication Date
FR2377677A1 true FR2377677A1 (fr) 1978-08-11
FR2377677B1 FR2377677B1 (enExample) 1983-07-18

Family

ID=9727441

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7801164A Granted FR2377677A1 (fr) 1977-01-17 1978-01-17 Dispositif de visualisation a diodes luminescentes, et son procede de fabrication

Country Status (5)

Country Link
US (2) US4224116A (enExample)
JP (1) JPS53108398A (enExample)
DE (1) DE2801419A1 (enExample)
FR (1) FR2377677A1 (enExample)
GB (1) GB1597712A (enExample)

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Publication number Priority date Publication date Assignee Title
JPS55148482A (en) * 1979-05-08 1980-11-19 Canon Inc Semiconductor laser device
JPS5624969A (en) * 1979-08-09 1981-03-10 Canon Inc Semiconductor integrated circuit element
US4733127A (en) * 1984-06-12 1988-03-22 Sanyo Electric Co., Ltd. Unit of arrayed light emitting diodes
NL8901230A (nl) * 1989-05-17 1990-12-17 Oce Nederland Bv Belichtings- en afdrukinrichting.
NL9101745A (nl) * 1991-10-18 1993-05-17 Oce Nederland Bv Belichtings- en afdrukinrichting.
DE59308636D1 (de) * 1992-08-28 1998-07-09 Siemens Ag Leuchtdiode
US5683777A (en) * 1993-06-16 1997-11-04 Rhone-Poulenc Rhodia Ag Multiple width fiber strip and method and apparatus for its production
IL123207A0 (en) 1998-02-06 1998-09-24 Shellcase Ltd Integrated circuit device
KR100855015B1 (ko) * 2000-12-21 2008-08-28 테쎄라 테크놀로지스 헝가리 케이에프티. 패키징된 집적회로 및 그 제조 방법
DE10124426A1 (de) * 2001-05-18 2002-11-28 Omg Ag & Co Kg Oberflächenbeschichtung aus schwarzem Platin
JP2003046138A (ja) * 2001-08-01 2003-02-14 Sharp Corp Ｌｅｄランプ及びｌｅｄランプ製造方法
US6856007B2 (en) * 2001-08-28 2005-02-15 Tessera, Inc. High-frequency chip packages
US20040137656A1 (en) * 2003-01-15 2004-07-15 Gurbir Singh Low thermal resistance light emitting diode package and a method of making the same
US6972480B2 (en) * 2003-06-16 2005-12-06 Shellcase Ltd. Methods and apparatus for packaging integrated circuit devices
EP1493666A1 (en) * 2003-07-02 2005-01-05 Airbus Deutschland GmbH Multi-layered arrangement of foil layers for supplying power to light emitting diodes in aircraft cabin lighting
WO2005004195A2 (en) * 2003-07-03 2005-01-13 Shellcase Ltd. Method and apparatus for packaging integrated circuit devices
US20050067681A1 (en) * 2003-09-26 2005-03-31 Tessera, Inc. Package having integral lens and wafer-scale fabrication method therefor
WO2005031861A1 (en) * 2003-09-26 2005-04-07 Tessera, Inc. Structure and method of making capped chips including a flowable conductive medium
US20050139984A1 (en) * 2003-12-19 2005-06-30 Tessera, Inc. Package element and packaged chip having severable electrically conductive ties
US20050189635A1 (en) * 2004-03-01 2005-09-01 Tessera, Inc. Packaged acoustic and electromagnetic transducer chips
KR101085144B1 (ko) * 2004-04-29 2011-11-21 엘지디스플레이 주식회사 Ｌｅｄ 램프 유닛
US8143095B2 (en) * 2005-03-22 2012-03-27 Tessera, Inc. Sequential fabrication of vertical conductive interconnects in capped chips
US7566853B2 (en) * 2005-08-12 2009-07-28 Tessera, Inc. Image sensor employing a plurality of photodetector arrays and/or rear-illuminated architecture
US7936062B2 (en) * 2006-01-23 2011-05-03 Tessera Technologies Ireland Limited Wafer level chip packaging
US20070190747A1 (en) * 2006-01-23 2007-08-16 Tessera Technologies Hungary Kft. Wafer level packaging to lidded chips
US20080029879A1 (en) * 2006-03-01 2008-02-07 Tessera, Inc. Structure and method of making lidded chips
US8604605B2 (en) 2007-01-05 2013-12-10 Invensas Corp. Microelectronic assembly with multi-layer support structure
DE102007029369A1 (de) * 2007-06-26 2009-01-02 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauelement und Verfahren zur Herstellung eines optoelektronischen Halbleiterbauelements
US20090261708A1 (en) * 2008-04-21 2009-10-22 Motorola, Inc. Glass-phosphor capping structure for leds
CN102683543B (zh) * 2011-03-15 2015-08-12 展晶科技(深圳)有限公司 Led封装结构
DE102016124373A1 (de) * 2016-12-14 2018-06-14 Osram Opto Semiconductors Gmbh Strahlungsemittierende Vorrichtung, Pixelmodul, und Verfahren zur Herstellung einer strahlungsemittierenden Vorrichtung

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3501676A (en) * 1968-04-29 1970-03-17 Zenith Radio Corp Solid state matrix having an injection luminescent diode as the light source
FR2076284A5 (enExample) * 1970-01-08 1971-10-15 Radiotechnique Compelec
FR2123666A5 (enExample) * 1971-01-27 1972-09-15 Radiotechnique Compelec
FR2290721A1 (fr) * 1974-11-06 1976-06-04 Marconi Co Ltd Dispositif d'affichage a diodes emissives de lumiere

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1211663A (en) 1969-02-28 1970-11-11 Ibm Heat sink for semiconductor devices
BE793561A (fr) 1971-12-30 1973-04-16 Western Electric Co Dispositif d'affichage electroluminescent
US3911431A (en) * 1973-01-22 1975-10-07 Tokyo Shibaura Electric Co Light-emitting display device
US3938177A (en) 1973-06-25 1976-02-10 Amp Incorporated Narrow lead contact for automatic face down bonding of electronic chips
US4024627A (en) * 1974-04-29 1977-05-24 Amp Incorporated Package mounting of electronic chips, such as light emitting diodes
US4032963A (en) * 1974-09-03 1977-06-28 Motorola, Inc. Package and method for a semiconductor radiant energy emitting device
DE2450456A1 (de) * 1974-10-24 1976-05-06 Bosch Gmbh Robert Nebelscheinwerfer
US3964157A (en) * 1974-10-31 1976-06-22 Bell Telephone Laboratories, Incorporated Method of mounting semiconductor chips
US4000437A (en) * 1975-12-17 1976-12-28 Integrated Display Systems Incorporated Electric display device
JPS5282183A (en) * 1975-12-29 1977-07-09 Nec Corp Connecting wires for semiconductor devices
DE2634264A1 (de) * 1976-07-30 1978-02-02 Licentia Gmbh Halbleiter-lumineszenzbauelement
US4088546A (en) * 1977-03-01 1978-05-09 Westinghouse Electric Corp. Method of electroplating interconnections

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3501676A (en) * 1968-04-29 1970-03-17 Zenith Radio Corp Solid state matrix having an injection luminescent diode as the light source
FR2076284A5 (enExample) * 1970-01-08 1971-10-15 Radiotechnique Compelec
FR2123666A5 (enExample) * 1971-01-27 1972-09-15 Radiotechnique Compelec
FR2290721A1 (fr) * 1974-11-06 1976-06-04 Marconi Co Ltd Dispositif d'affichage a diodes emissives de lumiere

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
EXBK/73 *

Also Published As

Publication number Publication date
US4259679A (en) 1981-03-31
JPS53108398A (en) 1978-09-21
GB1597712A (en) 1981-09-09
FR2377677B1 (enExample) 1983-07-18
DE2801419A1 (de) 1978-07-20
DE2801419C2 (enExample) 1988-05-11
US4224116A (en) 1980-09-23

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Legal Events

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TP Transmission of property
ST Notification of lapse