FR2371706A1 - Element producteur d'images par voie seche - Google Patents

Element producteur d'images par voie seche

Info

Publication number
FR2371706A1
FR2371706A1 FR7711275A FR7711275A FR2371706A1 FR 2371706 A1 FR2371706 A1 FR 2371706A1 FR 7711275 A FR7711275 A FR 7711275A FR 7711275 A FR7711275 A FR 7711275A FR 2371706 A1 FR2371706 A1 FR 2371706A1
Authority
FR
France
Prior art keywords
processing image
dry processing
image producer
derivatives
producer element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7711275A
Other languages
English (en)
French (fr)
Other versions
FR2371706B1 (de
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kimoto Co Ltd
Original Assignee
Kimoto Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kimoto Co Ltd filed Critical Kimoto Co Ltd
Publication of FR2371706A1 publication Critical patent/FR2371706A1/fr
Application granted granted Critical
Publication of FR2371706B1 publication Critical patent/FR2371706B1/fr
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/50—Mask blanks not covered by G03F1/20 - G03F1/34; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/54—Absorbers, e.g. of opaque materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/34—Imagewise removal by selective transfer, e.g. peeling away
    • G03F7/346—Imagewise removal by selective transfer, e.g. peeling away using photosensitive materials other than non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Non-Silver Salt Photosensitive Materials And Non-Silver Salt Photography (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Materials For Photolithography (AREA)
FR7711275A 1976-04-14 1977-04-14 Element producteur d'images par voie seche Granted FR2371706A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4208376A JPS52126220A (en) 1976-04-14 1976-04-14 Dry image forming material and method of forming image

Publications (2)

Publication Number Publication Date
FR2371706A1 true FR2371706A1 (fr) 1978-06-16
FR2371706B1 FR2371706B1 (de) 1980-04-25

Family

ID=12626139

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7711275A Granted FR2371706A1 (fr) 1976-04-14 1977-04-14 Element producteur d'images par voie seche

Country Status (12)

Country Link
JP (1) JPS52126220A (de)
BE (1) BE853618A (de)
CA (1) CA1094377A (de)
CH (1) CH628160A5 (de)
DD (1) DD130507A5 (de)
DE (1) DE2716422C2 (de)
FR (1) FR2371706A1 (de)
GB (1) GB1563010A (de)
IT (1) IT1094789B (de)
NL (1) NL185425C (de)
SE (1) SE435214B (de)
SU (1) SU948301A3 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5479027A (en) * 1977-12-05 1979-06-23 Kimoto Kk Dry picture forming material
JPS54179986U (de) * 1978-06-07 1979-12-19
EP0042632A1 (de) * 1980-06-20 1981-12-30 Agfa-Gevaert N.V. Aufzeichnungsmaterial und Verfahren zur Herstellung von Metallbildern
JPS5858546A (ja) * 1981-10-02 1983-04-07 Kimoto & Co Ltd 製版用感光性マスク材料
JPS59198445A (ja) * 1983-04-27 1984-11-10 Kimoto & Co Ltd 剥離による画像形成材料
JPS60238826A (ja) * 1984-05-14 1985-11-27 Kimoto & Co Ltd 画像形成材料
JPS61243603A (ja) * 1985-04-19 1986-10-29 岡村　一 ロ−ソク立
EP0758103B1 (de) * 1995-08-08 2001-12-12 Agfa-Gevaert N.V. Verfahren zur Bildung von metallischen Bildern
EP0762214A1 (de) * 1995-09-05 1997-03-12 Agfa-Gevaert N.V. Lichtempfindliches Element, das eine Bildaufbauschicht und eine photopolymerisierbare Schicht enthält
JP2001284350A (ja) * 2000-03-31 2001-10-12 Nitto Denko Corp パターン形成方法および薄膜剥離除去用接着シート
JP2009032912A (ja) * 2007-07-27 2009-02-12 Sony Corp 半導体装置の製造方法および有機発光装置の製造方法
US10349525B2 (en) 2013-10-30 2019-07-09 Nederlandse Organisatie Voor Toegepast-Natuurwetenschappelijk Onderzoek Tno Substrate comprising an electrical circuit pattern, method and system for providing same

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2999016A (en) * 1955-03-24 1961-09-05 Keuffel & Esser Co Drawing material
BE623972A (de) * 1961-10-23
DE1447012B2 (de) * 1963-07-20 1972-12-21 Kalle Ag, 6202 Wiesbaden-Biebrich Negativ arbeitende, sensibilisierte kupfer-aluminium-bimetallplatte
DE1572153B2 (de) * 1966-06-27 1971-07-22 E I Du Pont de Nemours and Co , Wilmington, Del (V St A ) Fotopolymerisierbares aufzeichnungsmaterial
DE1597644C3 (de) * 1966-11-03 1973-09-20 Teeg Research Inc., Detroit, Mich. (V.St.A.) Verfahren zur Herstellung von Rehefbildern
DE1671625A1 (de) * 1967-01-24 1971-09-16 Kalle Ag Verbundmaterial fuer die Herstellung von Mehrmetalldruckformen
ZA711869B (en) * 1970-05-27 1971-12-29 Gen Electric Aqueous electrocoating solutions and method of making and using same
JPS4837643A (de) * 1971-09-15 1973-06-02
JPS5821257B2 (ja) * 1974-04-25 1983-04-28 富士写真フイルム株式会社 キンゾクガゾウケイセイザイリヨウ
JPS516530A (ja) * 1974-07-04 1976-01-20 Toray Industries Gazokeiseizairyo

Also Published As

Publication number Publication date
SU948301A3 (ru) 1982-07-30
NL185425B (nl) 1989-11-01
JPS52126220A (en) 1977-10-22
CH628160A5 (en) 1982-02-15
JPS5613305B2 (de) 1981-03-27
FR2371706B1 (de) 1980-04-25
AU1946676A (en) 1978-06-29
DD130507A5 (de) 1978-04-05
DE2716422A1 (de) 1977-11-03
SE435214B (sv) 1984-09-10
CA1094377A (en) 1981-01-27
NL7704083A (nl) 1977-10-18
GB1563010A (en) 1980-03-19
DE2716422C2 (de) 1987-10-01
NL185425C (nl) 1990-04-02
BE853618A (fr) 1977-08-01
IT1094789B (it) 1985-08-02

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Legal Events

Date Code Title Description
ST Notification of lapse