FR2326039B1 - - Google Patents

Info

Publication number
FR2326039B1
FR2326039B1 FR7628209A FR7628209A FR2326039B1 FR 2326039 B1 FR2326039 B1 FR 2326039B1 FR 7628209 A FR7628209 A FR 7628209A FR 7628209 A FR7628209 A FR 7628209A FR 2326039 B1 FR2326039 B1 FR 2326039B1
Authority
FR
France
Prior art keywords
lead frame
heat sink
metallic
frame structure
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7628209A
Other languages
English (en)
French (fr)
Other versions
FR2326039A1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Motorola Solutions Inc
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of FR2326039A1 publication Critical patent/FR2326039A1/fr
Application granted granted Critical
Publication of FR2326039B1 publication Critical patent/FR2326039B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
FR7628209A 1975-09-24 1976-09-20 Cadre conducteur pour semi-conducteurs Granted FR2326039A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/616,456 US4012765A (en) 1975-09-24 1975-09-24 Lead frame for plastic encapsulated semiconductor assemblies

Publications (2)

Publication Number Publication Date
FR2326039A1 FR2326039A1 (fr) 1977-04-22
FR2326039B1 true FR2326039B1 (https=) 1979-09-07

Family

ID=24469540

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7628209A Granted FR2326039A1 (fr) 1975-09-24 1976-09-20 Cadre conducteur pour semi-conducteurs

Country Status (4)

Country Link
US (1) US4012765A (https=)
JP (1) JPS5240975A (https=)
DE (1) DE2636450C2 (https=)
FR (1) FR2326039A1 (https=)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53143564U (https=) * 1977-04-18 1978-11-13
US4196959A (en) * 1977-12-27 1980-04-08 Beckman Instruments, Inc. Carrier strip for round lead pins and method for making the same
JPS55141744A (en) * 1979-04-23 1980-11-05 Hitachi Ltd Semiconductor device
FR2462024A1 (fr) * 1979-07-17 1981-02-06 Thomson Csf Plate-forme support de grille de connexion, notamment pour boitier de circuits integres, et boitier comportant une telle plate-forme
JPS578739U (https=) * 1980-06-16 1982-01-18
JPS5753947A (en) * 1980-09-17 1982-03-31 Hitachi Ltd Transistor and electronic device containing it
US4506238A (en) * 1981-12-14 1985-03-19 Toko, Inc. Hybrid circuit device
NL8202154A (nl) * 1982-05-26 1983-12-16 Asm Fico Tooling Geleiderframe.
FR2538164B1 (fr) * 1982-12-21 1985-06-07 Thomson Csf Procede d'encapsulation et circuit integre sous boitier encapsule par ce procede
JPS60113957A (ja) * 1983-11-26 1985-06-20 Toshiba Corp リ−ドフレ−ム
IT1213139B (it) * 1984-02-17 1989-12-14 Ates Componenti Elettron Componente elettronico integrato di tipo "single-in-line" eprocedimento per la sua fabbricazione.
FR2588122B1 (fr) * 1985-10-01 1988-06-24 Radiotechnique Compelec Dispositif semi-conducteur de puissance pour montage en surface
JPS61257443A (ja) * 1985-05-08 1986-11-14 Mitsubishi Shindo Kk 半導体装置用Ｃｕ合金リ−ド素材
US4631819A (en) * 1985-05-29 1986-12-30 Motorola, Inc. Low stress, tolerance free method for mounting power devices
US4935803A (en) * 1988-09-09 1990-06-19 Motorola, Inc. Self-centering electrode for power devices
US5001545A (en) * 1988-09-09 1991-03-19 Motorola, Inc. Formed top contact for non-flat semiconductor devices
US5266834A (en) * 1989-03-13 1993-11-30 Hitachi Ltd. Semiconductor device and an electronic device with the semiconductor devices mounted thereon
US5041902A (en) * 1989-12-14 1991-08-20 Motorola, Inc. Molded electronic package with compression structures
US4991002A (en) * 1990-02-14 1991-02-05 Motorola Inc. Modular power device assembly
US5083368A (en) * 1990-02-14 1992-01-28 Motorola Inc. Method of forming modular power device assembly
JPH0787160B2 (ja) * 1990-06-08 1995-09-20 株式会社村田製作所 電子部品
US5166570A (en) * 1990-06-08 1992-11-24 Murata Manufacturing Co. Ltd. Electronic component
US5786985A (en) * 1991-05-31 1998-07-28 Fujitsu Limited Semiconductor device and semiconductor device unit
JP3096824B2 (ja) * 1992-04-17 2000-10-10 ローム株式会社 Ｌｅｄ製造用フレームおよびこれを用いたｌｅｄの製造方法
US5394607A (en) * 1993-05-20 1995-03-07 Texas Instruments Incorporated Method of providing low cost heat sink
JP2781783B2 (ja) * 1996-07-30 1998-07-30 山形日本電気株式会社 半導体装置用パッケージ
FR2782573B1 (fr) * 1998-08-24 2003-10-17 Possehl Electronic France Sa Support metallique, notamment pour composants electroniques de puissance
US6436736B1 (en) * 2000-11-13 2002-08-20 Semiconductor Components Industries Llc Method for manufacturing a semiconductor package on a leadframe
ITMI20011965A1 (it) * 2001-09-21 2003-03-21 St Microelectronics Srl Conduttori di un contenitore del tipo no-lead di un dispositivo semiconduttore
US20040113240A1 (en) 2002-10-11 2004-06-17 Wolfgang Hauser An electronic component with a leadframe
US20050048349A1 (en) * 2003-08-28 2005-03-03 Fannon Megan A. Method of manufacturing a fuel cell array and a related array
US7602054B2 (en) * 2005-10-05 2009-10-13 Semiconductor Components Industries, L.L.C. Method of forming a molded array package device having an exposed tab and structure
CN101458366B (zh) * 2007-12-13 2010-12-01 旭丽电子(广州)有限公司 光耦合器导线架料带
CN102034782A (zh) * 2009-09-30 2011-04-27 万国半导体有限公司 一种用于功率半导体器件的混合合金引线框架
TWI413226B (zh) * 2009-11-09 2013-10-21 萬國半導體有限公司 一種用於功率半導體裝置的混合合金引線框架及其製作方法
US9978613B1 (en) * 2017-03-07 2018-05-22 Texas Instruments Incorporated Method for making lead frames for integrated circuit packages

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3444441A (en) * 1965-06-18 1969-05-13 Motorola Inc Semiconductor devices including lead and plastic housing structure suitable for automated process construction
US3574815A (en) * 1966-07-13 1971-04-13 Motorola Inc Method of fabricating a plastic encapsulated semiconductor assembly
US3423516A (en) * 1966-07-13 1969-01-21 Motorola Inc Plastic encapsulated semiconductor assemblies
US3507242A (en) * 1967-03-17 1970-04-21 Mcmullen John J Tanker for the transportation of liquefied gases
US3581387A (en) * 1967-11-29 1971-06-01 Gen Motors Corp Method of making strip mounted semiconductor device
US3698074A (en) * 1970-06-29 1972-10-17 Motorola Inc Contact bonding and packaging of integrated circuits
US3736367A (en) * 1971-04-09 1973-05-29 Amp Inc Lead frames and method of making same
US3829598A (en) * 1972-09-25 1974-08-13 Hutson Ind Inc Copper heat sinks for electronic devices and method of making same
JPS501320U (https=) * 1973-04-27 1975-01-08
US3902189A (en) * 1974-04-10 1975-08-26 Hunt Electronics Prefabricated article and methods of maintaining the orientation of parts being bonded thereto
US3922712A (en) * 1974-05-01 1975-11-25 Gen Motors Corp Plastic power semiconductor flip chip package

Also Published As

Publication number Publication date
DE2636450A1 (de) 1977-04-07
FR2326039A1 (fr) 1977-04-22
DE2636450C2 (de) 1981-10-08
US4012765A (en) 1977-03-15
JPS5240975A (en) 1977-03-30

Similar Documents

Publication Publication Date Title
FR2326039B1 (https=)
US3606673A (en) Plastic encapsulated semiconductor devices
BE857399A (fr) Module semi-conducteur refroidi par conduction et son procede de fabrication
ATE59733T1 (de) Ein verfahren zum herstellen einer halbleiteranordnung mit leiter-steckerstiften.
EP0257681A3 (en) Method for manufacturing plastic encapsulated semiconductor devices and devices obtained thereby
US3836825A (en) Heat dissipation for power integrated circuit devices
US3574815A (en) Method of fabricating a plastic encapsulated semiconductor assembly
US4820658A (en) Method of making a packaged IC chip
US3839782A (en) Method for using a lead frame for the manufacture of electric devices having semiconductor chips placed in a face-to-face relation
US4554404A (en) Support for lead frame for IC chip carrier
US5384286A (en) Process for encapsulating a semiconductor chip, leadframe and heatsink
BR7605354A (pt) Conjunto semicondutor encapsulado e passivado e processo de fabrica-lo
US4663651A (en) Segmented lead frame strip for IC chip carrier
DE3377438D1 (en) Resin-molded semiconductor devices and a process for manufacturing the same
BR6912979D0 (pt) Processo de fabricacao de dispositivo semicondutor dispositivo semicondutor fabricado pelo mesmo
GB1189904A (en) Process for Encapsulating Electronic Devices in Plastics and Devices so Produced
EP0443044A4 (en) Lead frame for semiconductor device and semiconductor device using the lead frame
BE763330A (fr) Dispositif a semiconducteur a grande-tension electrique de claquage a la jonction et son procede de fabrication
GB1194452A (en) Improvements in or relating to methods of Encapsulating Electrical Components in Hardenable Synthetic Material
JP2585771B2 (ja) 半導体装置の製造方法
US3602985A (en) Method of producing semiconductor devices
CH418449A (de) Elektrische Anlage mit mehreren mit Kühlkörpern verbundenen Halbleiterbauelementen und Verfahren zum Herstellen einer solchen elektrischen Anlage
JPS51112273A (en) Lead frame for resin mold type semiconductor device
JPS5813029B2 (ja) 樹脂モ−ルド型半導体装置の製造方法
JPH04167378A (ja) モールドパワーモジュールの製造方法

Legal Events

Date Code Title Description
ST Notification of lapse