FR2326039A1 - Cadre conducteur pour semi-conducteurs - Google Patents
Cadre conducteur pour semi-conducteursInfo
- Publication number
- FR2326039A1 FR2326039A1 FR7628209A FR7628209A FR2326039A1 FR 2326039 A1 FR2326039 A1 FR 2326039A1 FR 7628209 A FR7628209 A FR 7628209A FR 7628209 A FR7628209 A FR 7628209A FR 2326039 A1 FR2326039 A1 FR 2326039A1
- Authority
- FR
- France
- Prior art keywords
- lead frame
- heat sink
- metallic
- frame structure
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49121—Beam lead frame or beam lead device
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Lead Frames For Integrated Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US05/616,456 US4012765A (en) | 1975-09-24 | 1975-09-24 | Lead frame for plastic encapsulated semiconductor assemblies |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2326039A1 true FR2326039A1 (fr) | 1977-04-22 |
FR2326039B1 FR2326039B1 (fr) | 1979-09-07 |
Family
ID=24469540
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7628209A Granted FR2326039A1 (fr) | 1975-09-24 | 1976-09-20 | Cadre conducteur pour semi-conducteurs |
Country Status (4)
Country | Link |
---|---|
US (1) | US4012765A (fr) |
JP (1) | JPS5240975A (fr) |
DE (1) | DE2636450C2 (fr) |
FR (1) | FR2326039A1 (fr) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2413849A1 (fr) * | 1977-12-27 | 1979-07-27 | Beckman Instruments Inc | Bande de support pour broches conductrices rondes et methode de fabrication |
EP0023165A1 (fr) * | 1979-07-17 | 1981-01-28 | Thomson-Csf | Plate-forme support de grille de connexion, notamment pour boîtier de circuits intégrés, et boîtier comportant une telle plate-forme |
EP0095223A2 (fr) * | 1982-05-26 | 1983-11-30 | ASM Fico Tooling B.V. | Cadre de connexion |
FR2538164A1 (fr) * | 1982-12-21 | 1984-06-22 | Thomson Csf | Procede d'encapsulation et circuit integre sous boitier encapsule par ce procede |
EP0143441A2 (fr) * | 1983-11-26 | 1985-06-05 | Kabushiki Kaisha Toshiba | Cadre de connexion et procédé pour sa fabrication |
EP0460559A2 (fr) * | 1990-06-08 | 1991-12-11 | Murata Manufacturing Co., Ltd. | Composant électrique à sorties radiales à insérer dans une plaquette de circuit imprimé |
US5166570A (en) * | 1990-06-08 | 1992-11-24 | Murata Manufacturing Co. Ltd. | Electronic component |
Families Citing this family (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53143564U (fr) * | 1977-04-18 | 1978-11-13 | ||
JPS55141744A (en) * | 1979-04-23 | 1980-11-05 | Hitachi Ltd | Semiconductor device |
JPS578739U (fr) * | 1980-06-16 | 1982-01-18 | ||
JPS5753947A (en) * | 1980-09-17 | 1982-03-31 | Hitachi Ltd | Transistor and electronic device containing it |
US4506238A (en) * | 1981-12-14 | 1985-03-19 | Toko, Inc. | Hybrid circuit device |
IT1213139B (it) * | 1984-02-17 | 1989-12-14 | Ates Componenti Elettron | Componente elettronico integrato di tipo "single-in-line" eprocedimento per la sua fabbricazione. |
FR2588122B1 (fr) * | 1985-10-01 | 1988-06-24 | Radiotechnique Compelec | Dispositif semi-conducteur de puissance pour montage en surface |
JPS61257443A (ja) * | 1985-05-08 | 1986-11-14 | Mitsubishi Shindo Kk | 半導体装置用Cu合金リ−ド素材 |
US4631819A (en) * | 1985-05-29 | 1986-12-30 | Motorola, Inc. | Low stress, tolerance free method for mounting power devices |
US5001545A (en) * | 1988-09-09 | 1991-03-19 | Motorola, Inc. | Formed top contact for non-flat semiconductor devices |
US4935803A (en) * | 1988-09-09 | 1990-06-19 | Motorola, Inc. | Self-centering electrode for power devices |
US5266834A (en) * | 1989-03-13 | 1993-11-30 | Hitachi Ltd. | Semiconductor device and an electronic device with the semiconductor devices mounted thereon |
US5041902A (en) * | 1989-12-14 | 1991-08-20 | Motorola, Inc. | Molded electronic package with compression structures |
US5083368A (en) * | 1990-02-14 | 1992-01-28 | Motorola Inc. | Method of forming modular power device assembly |
US4991002A (en) * | 1990-02-14 | 1991-02-05 | Motorola Inc. | Modular power device assembly |
US5786985A (en) * | 1991-05-31 | 1998-07-28 | Fujitsu Limited | Semiconductor device and semiconductor device unit |
JP3096824B2 (ja) * | 1992-04-17 | 2000-10-10 | ローム株式会社 | Led製造用フレームおよびこれを用いたledの製造方法 |
US5394607A (en) * | 1993-05-20 | 1995-03-07 | Texas Instruments Incorporated | Method of providing low cost heat sink |
JP2781783B2 (ja) * | 1996-07-30 | 1998-07-30 | 山形日本電気株式会社 | 半導体装置用パッケージ |
FR2782573B1 (fr) * | 1998-08-24 | 2003-10-17 | Possehl Electronic France Sa | Support metallique, notamment pour composants electroniques de puissance |
US6436736B1 (en) * | 2000-11-13 | 2002-08-20 | Semiconductor Components Industries Llc | Method for manufacturing a semiconductor package on a leadframe |
ITMI20011965A1 (it) * | 2001-09-21 | 2003-03-21 | St Microelectronics Srl | Conduttori di un contenitore del tipo no-lead di un dispositivo semiconduttore |
US20040113240A1 (en) | 2002-10-11 | 2004-06-17 | Wolfgang Hauser | An electronic component with a leadframe |
US20050048349A1 (en) * | 2003-08-28 | 2005-03-03 | Fannon Megan A. | Method of manufacturing a fuel cell array and a related array |
US7602054B2 (en) * | 2005-10-05 | 2009-10-13 | Semiconductor Components Industries, L.L.C. | Method of forming a molded array package device having an exposed tab and structure |
CN101458366B (zh) * | 2007-12-13 | 2010-12-01 | 旭丽电子(广州)有限公司 | 光耦合器导线架料带 |
CN102034782A (zh) * | 2009-09-30 | 2011-04-27 | 万国半导体有限公司 | 一种用于功率半导体器件的混合合金引线框架 |
TWI413226B (zh) * | 2009-11-09 | 2013-10-21 | Alpha & Omega Semiconductor | 一種用於功率半導體裝置的混合合金引線框架及其製作方法 |
US9978613B1 (en) * | 2017-03-07 | 2018-05-22 | Texas Instruments Incorporated | Method for making lead frames for integrated circuit packages |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3444441A (en) * | 1965-06-18 | 1969-05-13 | Motorola Inc | Semiconductor devices including lead and plastic housing structure suitable for automated process construction |
US3574815A (en) * | 1966-07-13 | 1971-04-13 | Motorola Inc | Method of fabricating a plastic encapsulated semiconductor assembly |
US3423516A (en) * | 1966-07-13 | 1969-01-21 | Motorola Inc | Plastic encapsulated semiconductor assemblies |
US3507242A (en) * | 1967-03-17 | 1970-04-21 | Mcmullen John J | Tanker for the transportation of liquefied gases |
US3581387A (en) * | 1967-11-29 | 1971-06-01 | Gen Motors Corp | Method of making strip mounted semiconductor device |
US3698074A (en) * | 1970-06-29 | 1972-10-17 | Motorola Inc | Contact bonding and packaging of integrated circuits |
US3736367A (en) * | 1971-04-09 | 1973-05-29 | Amp Inc | Lead frames and method of making same |
US3829598A (en) * | 1972-09-25 | 1974-08-13 | Hutson Ind Inc | Copper heat sinks for electronic devices and method of making same |
JPS501320U (fr) * | 1973-04-27 | 1975-01-08 | ||
US3902189A (en) * | 1974-04-10 | 1975-08-26 | Hunt Electronics | Prefabricated article and methods of maintaining the orientation of parts being bonded thereto |
US3922712A (en) * | 1974-05-01 | 1975-11-25 | Gen Motors Corp | Plastic power semiconductor flip chip package |
-
1975
- 1975-09-24 US US05/616,456 patent/US4012765A/en not_active Expired - Lifetime
-
1976
- 1976-08-13 DE DE2636450A patent/DE2636450C2/de not_active Expired
- 1976-09-20 FR FR7628209A patent/FR2326039A1/fr active Granted
- 1976-09-24 JP JP51114554A patent/JPS5240975A/ja active Pending
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2413849A1 (fr) * | 1977-12-27 | 1979-07-27 | Beckman Instruments Inc | Bande de support pour broches conductrices rondes et methode de fabrication |
EP0023165A1 (fr) * | 1979-07-17 | 1981-01-28 | Thomson-Csf | Plate-forme support de grille de connexion, notamment pour boîtier de circuits intégrés, et boîtier comportant une telle plate-forme |
FR2462024A1 (fr) * | 1979-07-17 | 1981-02-06 | Thomson Csf | Plate-forme support de grille de connexion, notamment pour boitier de circuits integres, et boitier comportant une telle plate-forme |
EP0095223A2 (fr) * | 1982-05-26 | 1983-11-30 | ASM Fico Tooling B.V. | Cadre de connexion |
EP0095223A3 (en) * | 1982-05-26 | 1984-01-04 | Asm-Fico Tooling B.V. | A lead frame |
FR2538164A1 (fr) * | 1982-12-21 | 1984-06-22 | Thomson Csf | Procede d'encapsulation et circuit integre sous boitier encapsule par ce procede |
EP0143441A2 (fr) * | 1983-11-26 | 1985-06-05 | Kabushiki Kaisha Toshiba | Cadre de connexion et procédé pour sa fabrication |
EP0143441A3 (fr) * | 1983-11-26 | 1986-08-20 | Kabushiki Kaisha Toshiba | Cadre de connexion et procédé pour sa fabrication |
EP0460559A2 (fr) * | 1990-06-08 | 1991-12-11 | Murata Manufacturing Co., Ltd. | Composant électrique à sorties radiales à insérer dans une plaquette de circuit imprimé |
EP0460559A3 (en) * | 1990-06-08 | 1992-05-13 | Murata Manufacturing Co., Ltd. | Radial terminals type electronic component to insert in a printed circuit board |
US5166570A (en) * | 1990-06-08 | 1992-11-24 | Murata Manufacturing Co. Ltd. | Electronic component |
Also Published As
Publication number | Publication date |
---|---|
DE2636450C2 (de) | 1981-10-08 |
FR2326039B1 (fr) | 1979-09-07 |
DE2636450A1 (de) | 1977-04-07 |
JPS5240975A (en) | 1977-03-30 |
US4012765A (en) | 1977-03-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
FR2326039A1 (fr) | Cadre conducteur pour semi-conducteurs | |
US3423516A (en) | Plastic encapsulated semiconductor assemblies | |
BE857399A (fr) | Module semi-conducteur refroidi par conduction et son procede de fabrication | |
US3836825A (en) | Heat dissipation for power integrated circuit devices | |
DE102015101674B4 (de) | Halbleiterchipgehäuse mit Kontaktstiften an kurzen Seitenrändern | |
US3574815A (en) | Method of fabricating a plastic encapsulated semiconductor assembly | |
US3665256A (en) | Heat dissipation for power integrated circuits | |
IT1252624B (it) | Dispositivo semiconduttore incapsulato in resina e elettricamente isolato di migliorate caratteristiche di isolamento,e relativo processo di fabbricazione | |
CH473478A (fr) | Procédé pour fabriquer dans un semi-conducteur un circuit intégré et circuit intégré obtenu | |
KR950021435A (ko) | 수지 봉지형 반도체 장치 및 그 제조 방법 | |
ATE59733T1 (de) | Ein verfahren zum herstellen einer halbleiteranordnung mit leiter-steckerstiften. | |
BR7605354A (pt) | Conjunto semicondutor encapsulado e passivado e processo de fabrica-lo | |
BR8403468A (pt) | Dispositivo com semicondutor de dois terminais e processo para sua fabricacao | |
US3629668A (en) | Semiconductor device package having improved compatibility properties | |
ATE27078T1 (de) | Stromrichteranordnung. | |
GB1246468A (en) | Electronic assembly | |
US11817360B2 (en) | Chip scale package semiconductor device and method of manufacture | |
US3602985A (en) | Method of producing semiconductor devices | |
JP2585771B2 (ja) | 半導体装置の製造方法 | |
BE763330A (fr) | Dispositif a semiconducteur a grande-tension electrique de claquage a la jonction et son procede de fabrication | |
FR1458890A (fr) | Module pour circuits électriques et son procédé de fabrication | |
FR2344126A1 (fr) | Procede de fabrication de dispositifs a semi-conducteurs presentant une faible resistance thermique et dispositifs obtenus par ledit procede | |
IT979081B (it) | Processo per la connessione elettrica di una piastrina di ma teriale semiconduttore a circui to integrato ad un substrato | |
KR940016724A (ko) | 표면 실장형 집적 회로 파워 패키지용 리드 프레임 어셈블리 | |
US3621114A (en) | Lead frame configuration |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |