FR2413849A1 - Bande de support pour broches conductrices rondes et methode de fabrication - Google Patents

Bande de support pour broches conductrices rondes et methode de fabrication

Info

Publication number
FR2413849A1
FR2413849A1 FR7836361A FR7836361A FR2413849A1 FR 2413849 A1 FR2413849 A1 FR 2413849A1 FR 7836361 A FR7836361 A FR 7836361A FR 7836361 A FR7836361 A FR 7836361A FR 2413849 A1 FR2413849 A1 FR 2413849A1
Authority
FR
France
Prior art keywords
band
manufacturing
conductive pins
support tape
round conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7836361A
Other languages
English (en)
Other versions
FR2413849B1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Beckman Coulter Inc
Original Assignee
Beckman Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Beckman Instruments Inc filed Critical Beckman Instruments Inc
Publication of FR2413849A1 publication Critical patent/FR2413849A1/fr
Application granted granted Critical
Publication of FR2413849B1 publication Critical patent/FR2413849B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4885—Wire-like parts or pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4825—Connection or disconnection of other leads to or from flat leads, e.g. wires, bumps, other flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/003—Placing of components on belts holding the terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405—Edge mounted components, e.g. terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10386—Clip leads; Terminals gripping the edge of a substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10424—Frame holders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
    • Y10T29/49171—Assembling electrical component directly to terminal or elongated conductor with encapsulating
    • Y10T29/49172—Assembling electrical component directly to terminal or elongated conductor with encapsulating by molding of insulating material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
    • Y10T29/49222—Contact or terminal manufacturing by assembling plural parts forming array of contacts or terminals

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Insertion, Bundling And Securing Of Wires For Electric Apparatuses (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

L'INVENTION CONCERNE UNE BANDE DE SUPPORT D'UN COMPOSANT ELECTRIQUE. SELON L'INVENTION, ELLE COMPREND UNE BANDE CENTRALE DE SUPPORT 10; PLUSIEURS SEGMENTS DE FILS RONDS 24 TRANSVERSALEMENT MONTES SUR LA BANDE, CHAQUE SEGMENT AYANT UNE EXTREMITE LIBRE S'ETENDANT AU-DELA DE LA BANDE; ET UNE PINCE 34 INTEGRALEMENT FORMEE SUR CHAQUE EXTREMITE LIBRE POUR CONNEXION AU BORD D'UN SUBSTRAT 42 D'UN COMPOSANT ELECTRIQUE, CHAQUE PINCE ETANT CONSTRUITE DE FACON QUE CHAQUE SEGMENT DE FIL ROND SOIT ALIGNE AVEC L'AXE DU BORD DU SUBSTRAT. L'INVENTION S'APPLIQUE NOTAMMENT A L'ELECTRONIQUE.
FR7836361A 1977-12-27 1978-12-26 Bande de support pour broches conductrices rondes et methode de fabrication Granted FR2413849A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/864,184 US4196959A (en) 1977-12-27 1977-12-27 Carrier strip for round lead pins and method for making the same

Publications (2)

Publication Number Publication Date
FR2413849A1 true FR2413849A1 (fr) 1979-07-27
FR2413849B1 FR2413849B1 (fr) 1982-07-09

Family

ID=25342703

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7836361A Granted FR2413849A1 (fr) 1977-12-27 1978-12-26 Bande de support pour broches conductrices rondes et methode de fabrication

Country Status (7)

Country Link
US (1) US4196959A (fr)
JP (1) JPS611759Y2 (fr)
CA (1) CA1112312A (fr)
DE (1) DE2855838C2 (fr)
FR (1) FR2413849A1 (fr)
GB (1) GB2011192B (fr)
NL (1) NL7812069A (fr)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2524447A1 (fr) * 1982-03-31 1983-10-07 Trubuil Mecanique Gle Precisio Dispositif d'alimentation d'un poste de travail en produits solidaires les uns des autres sous forme de bande continue et utilisation de ce dispositif dans des machines de sertissage de cosses ou analogues sur des fils electriques
US4816427A (en) * 1986-09-02 1989-03-28 Dennis Richard K Process for connecting lead frame to semiconductor device
US4766478A (en) * 1986-09-02 1988-08-23 Dennis Richard K Lead frame for semi-conductor device and process of connecting same
US4846700A (en) * 1987-04-06 1989-07-11 Dennis Richard K Lead frame for semi-conductor device
US4782589A (en) * 1987-04-06 1988-11-08 Dennis Richard K Process of connecting lead frame to a semi-conductor device and a device to effect same
US4799589A (en) * 1987-08-07 1989-01-24 Bead Chain Manufacturing Co. Resilient electronic bandolier carrier strip and method of using the same
DE4014557C1 (en) * 1990-05-07 1991-10-02 Wieslaw 7534 Birkenfeld De Kramski Mfg. contact pins for plug and socket connector - stamping out along metal band at necessary distance and carrying away by transverse conveyor belt
JPH071669B2 (ja) * 1992-03-25 1995-01-11 協伸工業株式会社 ヒューズクリップの取付方法及びヒューズクリップ組合せ体
GB2282089B (en) * 1993-08-19 1996-08-28 Junichi Nakazawa Electronic lead elements and the production method thereof
DE19711128C1 (de) * 1997-03-10 1998-07-30 Krone Ag Verteilerleiste für die Telekommunikations- und Datentechnik
US6003369A (en) * 1997-05-19 1999-12-21 Continental Teves, Inc. Method for manufacturing encapsulated semiconductor devices
DE19734175C1 (de) * 1997-08-07 1998-09-17 Harting Kgaa Doppelkontaktelement
EP1104016A1 (fr) * 1999-11-25 2001-05-30 General Semiconductor of Taiwan, Ltd. Structure d'assemblage de conducteurs pour dispositifs sémi-conducteurs et procédé pour sa fabrication
JP4329967B2 (ja) * 2000-04-28 2009-09-09 古河電気工業株式会社 プラスチック基板に設けられるピングリッドアレイ用ｉｃリードピンに適した銅合金線材
US7430925B2 (en) * 2005-05-18 2008-10-07 Pressure Profile Systems, Inc. Hybrid tactile sensor
KR20090082783A (ko) * 2008-01-28 2009-07-31 삼성전자주식회사 Ｅｄｓ 공정용 프로브 카드 어셈블리

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1486141A (fr) * 1965-07-08 1967-06-23 Nat Semiconductor Corp Perfectionnements à la fabrication des dispositifs semi-conducteurs
US3374536A (en) * 1964-10-29 1968-03-26 Sprague Electric Co Incapsulation of electrical units
FR2124508A1 (fr) * 1971-02-05 1972-09-22 Du Pont
FR2326039A1 (fr) * 1975-09-24 1977-04-22 Motorola Inc Cadre conducteur pour semi-conducteurs

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3158418A (en) * 1962-02-02 1964-11-24 Thomas L Rush Pin contact for printed circuit boards
US3557431A (en) * 1965-07-08 1971-01-26 Nat Semiconductor Corp Apparatus for assembling semiconductor device components
FR1467190A (fr) * 1965-12-15 1967-01-27 Radiotechnique Coprim Rtc Dispositif et procédé permettant de relier des plaquettes porteuses de microcircuits à des dispositifs électriques extérieurs
US3544857A (en) * 1966-08-16 1970-12-01 Signetics Corp Integrated circuit assembly with lead structure and method
US3808578A (en) * 1970-12-14 1974-04-30 Essex International Inc Printed circuit board connector
US3864008A (en) * 1973-08-07 1975-02-04 Du Pont Lead wire assembly
DE2435399A1 (de) * 1974-07-23 1976-02-05 Siemens Ag Anschlussdraehte zum anloeten an flache schaltungstraeger
DE7615812U1 (de) * 1976-05-18 1976-10-14 Weber, Guenther, Dipl.-Ing., 2201 Kollmar Elektrisches Gerät, z.B. elektronisches Schaltgerät

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3374536A (en) * 1964-10-29 1968-03-26 Sprague Electric Co Incapsulation of electrical units
FR1486141A (fr) * 1965-07-08 1967-06-23 Nat Semiconductor Corp Perfectionnements à la fabrication des dispositifs semi-conducteurs
FR2124508A1 (fr) * 1971-02-05 1972-09-22 Du Pont
FR2326039A1 (fr) * 1975-09-24 1977-04-22 Motorola Inc Cadre conducteur pour semi-conducteurs

Also Published As

Publication number Publication date
JPS611759Y2 (fr) 1986-01-21
US4196959A (en) 1980-04-08
CA1112312A (fr) 1981-11-10
GB2011192B (en) 1982-08-18
DE2855838A1 (de) 1979-06-28
FR2413849B1 (fr) 1982-07-09
NL7812069A (nl) 1979-06-29
DE2855838C2 (de) 1985-12-19
JPS54105860U (fr) 1979-07-25
GB2011192A (en) 1979-07-04

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Legal Events

Date Code Title Description
ST Notification of lapse