NL7812069A - Draagstrookstelsel voor ronde geleiders. - Google Patents

Draagstrookstelsel voor ronde geleiders.

Info

Publication number
NL7812069A
NL7812069A NL7812069A NL7812069A NL7812069A NL 7812069 A NL7812069 A NL 7812069A NL 7812069 A NL7812069 A NL 7812069A NL 7812069 A NL7812069 A NL 7812069A NL 7812069 A NL7812069 A NL 7812069A
Authority
NL
Netherlands
Prior art keywords
carrying strap
round guides
guides
round
strap
Prior art date
Application number
NL7812069A
Other languages
English (en)
Original Assignee
Beckman Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Beckman Instruments Inc filed Critical Beckman Instruments Inc
Publication of NL7812069A publication Critical patent/NL7812069A/nl

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4885—Wire-like parts or pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4825—Connection or disconnection of other leads to or from flat leads, e.g. wires, bumps, other flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/003—Placing of components on belts holding the terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405—Edge mounted components, e.g. terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10386—Clip leads; Terminals gripping the edge of a substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10424—Frame holders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
    • Y10T29/49171—Assembling electrical component directly to terminal or elongated conductor with encapsulating
    • Y10T29/49172—Assembling electrical component directly to terminal or elongated conductor with encapsulating by molding of insulating material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
    • Y10T29/49222—Contact or terminal manufacturing by assembling plural parts forming array of contacts or terminals

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Insertion, Bundling And Securing Of Wires For Electric Apparatuses (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Lead Frames For Integrated Circuits (AREA)
NL7812069A 1977-12-27 1978-12-12 Draagstrookstelsel voor ronde geleiders. NL7812069A (nl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/864,184 US4196959A (en) 1977-12-27 1977-12-27 Carrier strip for round lead pins and method for making the same

Publications (1)

Publication Number Publication Date
NL7812069A true NL7812069A (nl) 1979-06-29

Family

ID=25342703

Family Applications (1)

Application Number Title Priority Date Filing Date
NL7812069A NL7812069A (nl) 1977-12-27 1978-12-12 Draagstrookstelsel voor ronde geleiders.

Country Status (7)

Country Link
US (1) US4196959A (nl)
JP (1) JPS611759Y2 (nl)
CA (1) CA1112312A (nl)
DE (1) DE2855838C2 (nl)
FR (1) FR2413849A1 (nl)
GB (1) GB2011192B (nl)
NL (1) NL7812069A (nl)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2524447A1 (fr) * 1982-03-31 1983-10-07 Trubuil Mecanique Gle Precisio Dispositif d'alimentation d'un poste de travail en produits solidaires les uns des autres sous forme de bande continue et utilisation de ce dispositif dans des machines de sertissage de cosses ou analogues sur des fils electriques
US4816427A (en) * 1986-09-02 1989-03-28 Dennis Richard K Process for connecting lead frame to semiconductor device
US4766478A (en) * 1986-09-02 1988-08-23 Dennis Richard K Lead frame for semi-conductor device and process of connecting same
US4846700A (en) * 1987-04-06 1989-07-11 Dennis Richard K Lead frame for semi-conductor device
US4782589A (en) * 1987-04-06 1988-11-08 Dennis Richard K Process of connecting lead frame to a semi-conductor device and a device to effect same
US4799589A (en) * 1987-08-07 1989-01-24 Bead Chain Manufacturing Co. Resilient electronic bandolier carrier strip and method of using the same
DE4014557C1 (en) * 1990-05-07 1991-10-02 Wieslaw 7534 Birkenfeld De Kramski Mfg. contact pins for plug and socket connector - stamping out along metal band at necessary distance and carrying away by transverse conveyor belt
JPH071669B2 (ja) * 1992-03-25 1995-01-11 協伸工業株式会社 ヒューズクリップの取付方法及びヒューズクリップ組合せ体
GB2282089B (en) * 1993-08-19 1996-08-28 Junichi Nakazawa Electronic lead elements and the production method thereof
DE19711128C1 (de) * 1997-03-10 1998-07-30 Krone Ag Verteilerleiste für die Telekommunikations- und Datentechnik
US6003369A (en) * 1997-05-19 1999-12-21 Continental Teves, Inc. Method for manufacturing encapsulated semiconductor devices
DE19734175C1 (de) * 1997-08-07 1998-09-17 Harting Kgaa Doppelkontaktelement
EP1104016A1 (en) * 1999-11-25 2001-05-30 General Semiconductor of Taiwan, Ltd. Lead assembly for semiconductor devices and assembling method therefor
JP4329967B2 (ja) * 2000-04-28 2009-09-09 古河電気工業株式会社 プラスチック基板に設けられるピングリッドアレイ用ｉｃリードピンに適した銅合金線材
US7430925B2 (en) * 2005-05-18 2008-10-07 Pressure Profile Systems, Inc. Hybrid tactile sensor
KR20090082783A (ko) * 2008-01-28 2009-07-31 삼성전자주식회사 Ｅｄｓ 공정용 프로브 카드 어셈블리

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3158418A (en) * 1962-02-02 1964-11-24 Thomas L Rush Pin contact for printed circuit boards
US3374536A (en) * 1964-10-29 1968-03-26 Sprague Electric Co Incapsulation of electrical units
US3557431A (en) * 1965-07-08 1971-01-26 Nat Semiconductor Corp Apparatus for assembling semiconductor device components
FR1486141A (fr) * 1965-07-08 1967-06-23 Nat Semiconductor Corp Perfectionnements à la fabrication des dispositifs semi-conducteurs
FR1467190A (fr) * 1965-12-15 1967-01-27 Radiotechnique Coprim Rtc Dispositif et procédé permettant de relier des plaquettes porteuses de microcircuits à des dispositifs électriques extérieurs
US3544857A (en) * 1966-08-16 1970-12-01 Signetics Corp Integrated circuit assembly with lead structure and method
US3808578A (en) * 1970-12-14 1974-04-30 Essex International Inc Printed circuit board connector
US3689684A (en) * 1971-02-05 1972-09-05 Du Pont Lead frame connector and electronic packages containing same
US3864008A (en) * 1973-08-07 1975-02-04 Du Pont Lead wire assembly
DE2435399A1 (de) * 1974-07-23 1976-02-05 Siemens Ag Anschlussdraehte zum anloeten an flache schaltungstraeger
US4012765A (en) * 1975-09-24 1977-03-15 Motorola, Inc. Lead frame for plastic encapsulated semiconductor assemblies
DE7615812U1 (de) * 1976-05-18 1976-10-14 Weber, Guenther, Dipl.-Ing., 2201 Kollmar Elektrisches Gerät, z.B. elektronisches Schaltgerät

Also Published As

Publication number Publication date
FR2413849A1 (fr) 1979-07-27
JPS54105860U (nl) 1979-07-25
FR2413849B1 (nl) 1982-07-09
GB2011192A (en) 1979-07-04
CA1112312A (en) 1981-11-10
JPS611759Y2 (nl) 1986-01-21
US4196959A (en) 1980-04-08
DE2855838A1 (de) 1979-06-28
DE2855838C2 (de) 1985-12-19
GB2011192B (en) 1982-08-18

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Legal Events

Date Code Title Description
A1A A request for search or an international-type search has been filed
BB A search report has been drawn up
A85 Still pending on 85-01-01
BC A request for examination has been filed
BV The patent application has lapsed