CN101458366B - 光耦合器导线架料带 - Google Patents
光耦合器导线架料带 Download PDFInfo
- Publication number
- CN101458366B CN101458366B CN2007100326171A CN200710032617A CN101458366B CN 101458366 B CN101458366 B CN 101458366B CN 2007100326171 A CN2007100326171 A CN 2007100326171A CN 200710032617 A CN200710032617 A CN 200710032617A CN 101458366 B CN101458366 B CN 101458366B
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- Prior art keywords
- lead frame
- transmitting terminal
- receiving end
- carrier strip
- serial
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 230000003287 optical effect Effects 0.000 title claims abstract description 32
- 239000000463 material Substances 0.000 claims abstract description 132
- 238000004080 punching Methods 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 238000005452 bending Methods 0.000 claims 1
- 239000004020 conductor Substances 0.000 claims 1
- 238000000034 method Methods 0.000 description 6
- 238000003825 pressing Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000084 colloidal system Substances 0.000 description 3
- 239000002699 waste material Substances 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 210000001503 joint Anatomy 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49565—Side rails of the lead frame, e.g. with perforations, sprocket holes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/12—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto
- H01L31/16—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto the semiconductor device sensitive to radiation being controlled by the light source or sources
- H01L31/167—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto the semiconductor device sensitive to radiation being controlled by the light source or sources the light sources and the devices sensitive to radiation all being semiconductor devices characterised by potential barriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Packages (AREA)
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
Abstract
Description
Claims (11)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2007100326171A CN101458366B (zh) | 2007-12-13 | 2007-12-13 | 光耦合器导线架料带 |
US12/153,543 US8390102B2 (en) | 2007-12-13 | 2008-05-21 | Optoisolator leadframe assembly |
JP2008004590U JP3144891U (ja) | 2007-12-13 | 2008-07-04 | 光アイソレーターのリードフレームアセンブリ |
US13/783,698 US8853837B2 (en) | 2007-12-13 | 2013-03-04 | Optoisolator leadframe assembly |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2007100326171A CN101458366B (zh) | 2007-12-13 | 2007-12-13 | 光耦合器导线架料带 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101458366A CN101458366A (zh) | 2009-06-17 |
CN101458366B true CN101458366B (zh) | 2010-12-01 |
Family
ID=40751735
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2007100326171A Active CN101458366B (zh) | 2007-12-13 | 2007-12-13 | 光耦合器导线架料带 |
Country Status (3)
Country | Link |
---|---|
US (2) | US8390102B2 (zh) |
JP (1) | JP3144891U (zh) |
CN (1) | CN101458366B (zh) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5875848B2 (ja) * | 2011-12-16 | 2016-03-02 | 株式会社東芝 | フォトカプラの製造方法及びフォトカプラ用リードフレームシート |
JP6114134B2 (ja) * | 2013-07-29 | 2017-04-12 | トヨタ自動車株式会社 | リードフレーム、電力変換装置、半導体装置及び半導体装置の製造方法 |
JP6281697B2 (ja) * | 2014-03-15 | 2018-02-21 | オムロン株式会社 | フォトセンサ |
CN104332451B (zh) * | 2014-11-24 | 2017-02-22 | 深圳市富美达五金有限公司 | 一种光耦封装支架 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0213105A2 (en) * | 1985-08-14 | 1987-03-04 | Quaestus Corporation | Method for assembling an optoisolator and leadframe therefor |
US6571040B2 (en) * | 2000-07-06 | 2003-05-27 | Corning Incorporated | Multiple planar complex optical devices and the process of manufacturing the same |
CN1612362A (zh) * | 2003-10-30 | 2005-05-04 | 夏普株式会社 | 制造引线架的方法以及使用这种引线架的光耦合器件 |
CN101029954A (zh) * | 2006-02-28 | 2007-09-05 | 住友电气工业株式会社 | 引线框架、使用引线框架的光耦合部件、以及光耦合部件的制造方法 |
Family Cites Families (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3808673A (en) * | 1971-03-17 | 1974-05-07 | Monsanto Co | Opto-isolator devices and method for the fabrication thereof |
US3839782A (en) * | 1972-03-15 | 1974-10-08 | M Lincoln | Method for using a lead frame for the manufacture of electric devices having semiconductor chips placed in a face-to-face relation |
US4114177A (en) * | 1975-05-01 | 1978-09-12 | Bell Telephone Laboratories, Incorporated | Optically coupled device with diffusely reflecting enclosure |
US4012765A (en) * | 1975-09-24 | 1977-03-15 | Motorola, Inc. | Lead frame for plastic encapsulated semiconductor assemblies |
US4446375A (en) * | 1981-10-14 | 1984-05-01 | General Electric Company | Optocoupler having folded lead frame construction |
JPS6068678A (ja) * | 1983-09-26 | 1985-04-19 | Oki Electric Ind Co Ltd | 光結合半導体装置 |
US4694183A (en) * | 1985-06-25 | 1987-09-15 | Hewlett-Packard Company | Optical isolator fabricated upon a lead frame |
US4863806A (en) * | 1985-06-25 | 1989-09-05 | Hewlett-Packard Company | Optical isolator |
US4809054A (en) * | 1986-07-25 | 1989-02-28 | Kurt Waldner | Semiconductor lead frame |
US4818960A (en) * | 1987-04-06 | 1989-04-04 | Tdk Corporation | Composite part and method of manufacturing same |
JP2708320B2 (ja) * | 1992-04-17 | 1998-02-04 | 三菱電機株式会社 | マルチチップ型半導体装置及びその製造方法 |
JPH05327006A (ja) * | 1992-05-25 | 1993-12-10 | Sharp Corp | 光結合素子の製造方法 |
JP2927620B2 (ja) * | 1992-09-25 | 1999-07-28 | シャープ株式会社 | 光結合装置およびその製造方法 |
US5416871A (en) * | 1993-04-09 | 1995-05-16 | Sumitomo Electric Industries, Ltd. | Molded optical connector module |
JPH07254728A (ja) * | 1994-03-15 | 1995-10-03 | Sharp Corp | 光結合素子用リードフレーム |
JP3015265B2 (ja) * | 1994-12-14 | 2000-03-06 | シャープ株式会社 | 光結合素子用リードフレーム及びこれを用いた光結合素子の製造方法 |
JP3121517B2 (ja) * | 1995-04-26 | 2001-01-09 | シャープ株式会社 | 光結合素子用リードフレーム |
US5631192A (en) * | 1995-10-02 | 1997-05-20 | Motorola, Inc. | Semiconductor device on an opposed leadframe and method for making |
US7233056B1 (en) * | 1998-02-23 | 2007-06-19 | Micron Technology, Inc. | Chip scale package with heat spreader |
JP3839267B2 (ja) * | 2001-03-08 | 2006-11-01 | 株式会社ルネサステクノロジ | 半導体装置及びそれを用いた通信端末装置 |
JP4034062B2 (ja) * | 2001-10-25 | 2008-01-16 | シャープ株式会社 | 光結合装置のリードフレーム及び光結合装置の製造方法 |
JP3939554B2 (ja) * | 2002-01-15 | 2007-07-04 | シャープ株式会社 | 半導体用リードフレーム |
USD513608S1 (en) * | 2003-01-03 | 2006-01-17 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
TWI320228B (en) * | 2006-05-04 | 2010-02-01 | A structure of a lead-frame matrix of photoelectron devices | |
TWI307416B (en) * | 2006-05-05 | 2009-03-11 | Everlight Electronics Co Ltd | Method of manufacturing photo coupler |
TW200921880A (en) * | 2007-11-12 | 2009-05-16 | Orient Semiconductor Elect Ltd | Lead frame structure and applications thereof |
JP5875848B2 (ja) * | 2011-12-16 | 2016-03-02 | 株式会社東芝 | フォトカプラの製造方法及びフォトカプラ用リードフレームシート |
-
2007
- 2007-12-13 CN CN2007100326171A patent/CN101458366B/zh active Active
-
2008
- 2008-05-21 US US12/153,543 patent/US8390102B2/en active Active
- 2008-07-04 JP JP2008004590U patent/JP3144891U/ja not_active Expired - Lifetime
-
2013
- 2013-03-04 US US13/783,698 patent/US8853837B2/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0213105A2 (en) * | 1985-08-14 | 1987-03-04 | Quaestus Corporation | Method for assembling an optoisolator and leadframe therefor |
US6571040B2 (en) * | 2000-07-06 | 2003-05-27 | Corning Incorporated | Multiple planar complex optical devices and the process of manufacturing the same |
CN1612362A (zh) * | 2003-10-30 | 2005-05-04 | 夏普株式会社 | 制造引线架的方法以及使用这种引线架的光耦合器件 |
CN101029954A (zh) * | 2006-02-28 | 2007-09-05 | 住友电气工业株式会社 | 引线框架、使用引线框架的光耦合部件、以及光耦合部件的制造方法 |
Also Published As
Publication number | Publication date |
---|---|
JP3144891U (ja) | 2008-09-18 |
CN101458366A (zh) | 2009-06-17 |
US8853837B2 (en) | 2014-10-07 |
US20130175679A1 (en) | 2013-07-11 |
US20090152002A1 (en) | 2009-06-18 |
US8390102B2 (en) | 2013-03-05 |
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Legal Events
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: LITE-ON TECHNOLOGY (CHANGZHOU) CO., LTD. Free format text: FORMER OWNER: SILITEK ELECTRONIC (GUANGZHOU) CO., LTD. Effective date: 20131108 Owner name: GUANGBAO ELECTRIC UANGZHOU) CO., LTD. GUANGBAO SC Free format text: FORMER OWNER: GUANGBAO SCIENCE + TECHNOLOGY CO., LTD. Effective date: 20131108 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 510663 GUANGZHOU, GUANGDONG PROVINCE TO: 213166 CHANGZHOU, JIANGSU PROVINCE |
|
TR01 | Transfer of patent right |
Effective date of registration: 20131108 Address after: 213166 Wujin high tech Industrial Development Zone, Jiangsu Province, Yang Lake Road, No. 88 Patentee after: LITE-ON TECHNOLOGY (CHANGZHOU) CO., LTD. Patentee after: Lite-On Electronic (Guangzhou) Co., Ltd. Patentee after: Lite-On Technology Corporation Address before: 510663 Guangzhou science and Technology Development Zone, Guangzhou City, Guangdong Province Science City West Road, No. 25 Patentee before: Xuli Electronics (Guangzhou) Co., Ltd. Patentee before: Lite-On Technology Corporation |