JPS53143564U - - Google Patents
Info
- Publication number
- JPS53143564U JPS53143564U JP1977049209U JP4920977U JPS53143564U JP S53143564 U JPS53143564 U JP S53143564U JP 1977049209 U JP1977049209 U JP 1977049209U JP 4920977 U JP4920977 U JP 4920977U JP S53143564 U JPS53143564 U JP S53143564U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1977049209U JPS53143564U (https=) | 1977-04-18 | 1977-04-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1977049209U JPS53143564U (https=) | 1977-04-18 | 1977-04-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS53143564U true JPS53143564U (https=) | 1978-11-13 |
Family
ID=28934372
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1977049209U Pending JPS53143564U (https=) | 1977-04-18 | 1977-04-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS53143564U (https=) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5240975A (en) * | 1975-09-24 | 1977-03-30 | Motorola Inc | Lead wire frame for semiconductor device |
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1977
- 1977-04-18 JP JP1977049209U patent/JPS53143564U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5240975A (en) * | 1975-09-24 | 1977-03-30 | Motorola Inc | Lead wire frame for semiconductor device |