FI20136180L - Vähennetyllä radiotaajuushäviöllä varustettu korkearesistiivinen piisubstraatti radiotaajuiselle integroidulle passiivilaitteelle - Google Patents
Vähennetyllä radiotaajuushäviöllä varustettu korkearesistiivinen piisubstraatti radiotaajuiselle integroidulle passiivilaitteelle Download PDFInfo
- Publication number
- FI20136180L FI20136180L FI20136180A FI20136180A FI20136180L FI 20136180 L FI20136180 L FI 20136180L FI 20136180 A FI20136180 A FI 20136180A FI 20136180 A FI20136180 A FI 20136180A FI 20136180 L FI20136180 L FI 20136180L
- Authority
- FI
- Finland
- Prior art keywords
- radio frequency
- silicon substrate
- passive device
- integrated passive
- high resistive
- Prior art date
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title 1
- 229910052710 silicon Inorganic materials 0.000 title 1
- 239000010703 silicon Substances 0.000 title 1
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07771—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card the record carrier comprising means for minimising adverse effects on the data communication capability of the record carrier, e.g. minimising Eddy currents induced in a proximate metal or otherwise electromagnetically interfering object
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/30—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by physical imperfections; having polished or roughened surface
- H01L29/32—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by physical imperfections; having polished or roughened surface the imperfections being within the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
- H01L21/02013—Grinding, lapping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
- H01L21/02024—Mirror polishing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
- H01L21/76251—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques
- H01L21/76256—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques using silicon etch back techniques, e.g. BESOI, ELTRAN
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/66—High-frequency adaptations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/04—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their crystalline structure, e.g. polycrystalline, cubic or particular orientation of crystalline planes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/16—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic System
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Priority Applications (10)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20136180A FI130149B (fi) | 2013-11-26 | 2013-11-26 | Vähennetyllä radiotaajuushäviöllä varustettu korkearesistiivinen piisubstraatti radiotaajuiselle integroidulle passiivilaitteelle |
US14/554,435 US9312345B2 (en) | 2013-11-26 | 2014-11-26 | High-resistive silicon substrate with a reduced radio frequency loss for a radio-frequency integrated passive device |
EP21169890.7A EP3872856A1 (en) | 2013-11-26 | 2014-11-26 | Manufacture method of a surface-passivated high-resistive silicon wafer for a radio-frequency intergrated passive device |
JP2016534197A JP6438024B2 (ja) | 2013-11-26 | 2014-11-26 | 高周波集積パッシブデバイス用の高周波損失を低下させた高抵抗シリコン基材 |
SG11201604259PA SG11201604259PA (en) | 2013-11-26 | 2014-11-26 | High-resistive silicon substrate with a reduced radio frequency loss for a radio-frequency integrated passive device |
PCT/FI2014/050910 WO2015079111A1 (en) | 2013-11-26 | 2014-11-26 | High-resistive silicon substrate with a reduced radio frequency loss for a radio-frequency integrated passive device |
TW103141015A TWI638454B (zh) | 2013-11-26 | 2014-11-26 | 用於射頻整合式被動元件之具有減低射頻損失之高阻値矽基板 |
KR1020167016583A KR102284688B1 (ko) | 2013-11-26 | 2014-11-26 | 무선주파수 집적 수동소자용의 무선주파수 손실이 감소된 고저항 실리콘 기판 |
EP14866142.4A EP3075007A4 (en) | 2013-11-26 | 2014-11-26 | High-resistive silicon substrate with a reduced radio frequency loss for a radio-frequency integrated passive device |
CN201480064496.7A CN105993072B (zh) | 2013-11-26 | 2014-11-26 | 用于射频集成无源器件的具有降低的射频损耗的高电阻硅衬底 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20136180A FI130149B (fi) | 2013-11-26 | 2013-11-26 | Vähennetyllä radiotaajuushäviöllä varustettu korkearesistiivinen piisubstraatti radiotaajuiselle integroidulle passiivilaitteelle |
Publications (2)
Publication Number | Publication Date |
---|---|
FI20136180L true FI20136180L (fi) | 2015-05-27 |
FI130149B FI130149B (fi) | 2023-03-15 |
Family
ID=53181953
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FI20136180A FI130149B (fi) | 2013-11-26 | 2013-11-26 | Vähennetyllä radiotaajuushäviöllä varustettu korkearesistiivinen piisubstraatti radiotaajuiselle integroidulle passiivilaitteelle |
Country Status (9)
Country | Link |
---|---|
US (1) | US9312345B2 (fi) |
EP (2) | EP3872856A1 (fi) |
JP (1) | JP6438024B2 (fi) |
KR (1) | KR102284688B1 (fi) |
CN (1) | CN105993072B (fi) |
FI (1) | FI130149B (fi) |
SG (1) | SG11201604259PA (fi) |
TW (1) | TWI638454B (fi) |
WO (1) | WO2015079111A1 (fi) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE112016002435T5 (de) * | 2015-05-29 | 2018-02-22 | Analog Devices Inc. | Galliumnitridapparat mit einer an Fangstellen reichen Region |
CN105261586B (zh) * | 2015-08-25 | 2018-05-25 | 上海新傲科技股份有限公司 | 带有电荷陷阱和绝缘埋层衬底的制备方法 |
EP3580776B1 (en) * | 2017-02-10 | 2021-04-28 | GlobalWafers Co., Ltd. | Methods for assessing semiconductor structures |
FR3066858B1 (fr) * | 2017-05-23 | 2019-06-21 | Soitec | Procede pour minimiser une distorsion d'un signal dans un circuit radiofrequence |
CN109103582A (zh) * | 2018-08-29 | 2018-12-28 | 河海大学常州校区 | 薄膜体声波谐振器结构的纳米机械声学天线及制造方法 |
FI129826B (fi) * | 2020-10-08 | 2022-09-15 | Okmetic Oy | Hybridisubstraattirakenteelle tarkoitetun korkearesistiivisen piikiekon valmistusmenetelmä |
US20220115226A1 (en) * | 2020-10-08 | 2022-04-14 | Okmetic Oy | Manufacture method of a high-resistivity silicon handle wafer for a hybrid substrate structure |
TWI761255B (zh) * | 2021-07-08 | 2022-04-11 | 環球晶圓股份有限公司 | 晶圓及晶圓的製造方法 |
US20230245922A1 (en) * | 2022-01-17 | 2023-08-03 | Psemi Corporation | Methods for simultaneous generation of a trap-rich layer and a box layer |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5559359A (en) * | 1994-07-29 | 1996-09-24 | Reyes; Adolfo C. | Microwave integrated circuit passive element structure and method for reducing signal propagation losses |
US6388290B1 (en) * | 1998-06-10 | 2002-05-14 | Agere Systems Guardian Corp. | Single crystal silicon on polycrystalline silicon integrated circuits |
KR20060118437A (ko) * | 2003-09-26 | 2006-11-23 | 위니베르시트카솔리끄드루뱅 | 저항손을 감소시키는 다층 반도체 구조의 제조 방법 |
US7936043B2 (en) * | 2006-03-17 | 2011-05-03 | Sychip Inc. | Integrated passive device substrates |
US8378384B2 (en) | 2007-09-28 | 2013-02-19 | Infineon Technologies Ag | Wafer and method for producing a wafer |
US7868419B1 (en) * | 2007-10-18 | 2011-01-11 | Rf Micro Devices, Inc. | Linearity improvements of semiconductor substrate based radio frequency devices |
CN101447417A (zh) * | 2007-11-27 | 2009-06-03 | 上海华虹Nec电子有限公司 | 高电阻多晶硅形成方法 |
US20090236689A1 (en) | 2008-03-24 | 2009-09-24 | Freescale Semiconductor, Inc. | Integrated passive device and method with low cost substrate |
JP2009252822A (ja) * | 2008-04-02 | 2009-10-29 | Sumco Corp | シリコンウェーハ及びその製造方法 |
FR2933233B1 (fr) * | 2008-06-30 | 2010-11-26 | Soitec Silicon On Insulator | Substrat de haute resistivite bon marche et procede de fabrication associe |
JP5922860B2 (ja) * | 2009-06-19 | 2016-05-24 | 株式会社Sumco | 高抵抗シリコンウェーハの製造方法 |
JP2010219210A (ja) | 2009-03-16 | 2010-09-30 | Renesas Electronics Corp | 半導体装置およびその製造方法 |
FR2953640B1 (fr) * | 2009-12-04 | 2012-02-10 | S O I Tec Silicon On Insulator Tech | Procede de fabrication d'une structure de type semi-conducteur sur isolant, a pertes electriques diminuees et structure correspondante |
US8492868B2 (en) * | 2010-08-02 | 2013-07-23 | International Business Machines Corporation | Method, apparatus, and design structure for silicon-on-insulator high-bandwidth circuitry with reduced charge layer |
FR2967812B1 (fr) * | 2010-11-19 | 2016-06-10 | S O I Tec Silicon On Insulator Tech | Dispositif electronique pour applications radiofrequence ou de puissance et procede de fabrication d'un tel dispositif |
US8536021B2 (en) * | 2010-12-24 | 2013-09-17 | Io Semiconductor, Inc. | Trap rich layer formation techniques for semiconductor devices |
US8481405B2 (en) * | 2010-12-24 | 2013-07-09 | Io Semiconductor, Inc. | Trap rich layer with through-silicon-vias in semiconductor devices |
JP6004285B2 (ja) * | 2010-12-24 | 2016-10-05 | クォルコム・インコーポレイテッド | 半導体デバイスのためのトラップリッチ層 |
US20120235283A1 (en) | 2011-03-16 | 2012-09-20 | Memc Electronic Materials, Inc. | Silicon on insulator structures having high resistivity regions in the handle wafer |
US8536035B2 (en) * | 2012-02-01 | 2013-09-17 | International Business Machines Corporation | Silicon-on-insulator substrate and method of forming |
US20150014795A1 (en) * | 2013-07-10 | 2015-01-15 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Surface passivation of substrate by mechanically damaging surface layer |
-
2013
- 2013-11-26 FI FI20136180A patent/FI130149B/fi not_active Application Discontinuation
-
2014
- 2014-11-26 TW TW103141015A patent/TWI638454B/zh active
- 2014-11-26 KR KR1020167016583A patent/KR102284688B1/ko active IP Right Grant
- 2014-11-26 JP JP2016534197A patent/JP6438024B2/ja active Active
- 2014-11-26 WO PCT/FI2014/050910 patent/WO2015079111A1/en active Application Filing
- 2014-11-26 EP EP21169890.7A patent/EP3872856A1/en active Pending
- 2014-11-26 SG SG11201604259PA patent/SG11201604259PA/en unknown
- 2014-11-26 CN CN201480064496.7A patent/CN105993072B/zh active Active
- 2014-11-26 US US14/554,435 patent/US9312345B2/en active Active
- 2014-11-26 EP EP14866142.4A patent/EP3075007A4/en not_active Ceased
Also Published As
Publication number | Publication date |
---|---|
US9312345B2 (en) | 2016-04-12 |
JP2016541118A (ja) | 2016-12-28 |
EP3075007A4 (en) | 2017-06-07 |
JP6438024B2 (ja) | 2018-12-19 |
EP3075007A1 (en) | 2016-10-05 |
US20150145105A1 (en) | 2015-05-28 |
TW201535716A (zh) | 2015-09-16 |
KR20160089448A (ko) | 2016-07-27 |
FI130149B (fi) | 2023-03-15 |
CN105993072A (zh) | 2016-10-05 |
SG11201604259PA (en) | 2016-07-28 |
KR102284688B1 (ko) | 2021-08-02 |
TWI638454B (zh) | 2018-10-11 |
WO2015079111A1 (en) | 2015-06-04 |
EP3872856A1 (en) | 2021-09-01 |
CN105993072B (zh) | 2019-03-01 |
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