SG11201507155TA - Substrate position aligner - Google Patents
Substrate position alignerInfo
- Publication number
- SG11201507155TA SG11201507155TA SG11201507155TA SG11201507155TA SG11201507155TA SG 11201507155T A SG11201507155T A SG 11201507155TA SG 11201507155T A SG11201507155T A SG 11201507155TA SG 11201507155T A SG11201507155T A SG 11201507155TA SG 11201507155T A SG11201507155T A SG 11201507155TA
- Authority
- SG
- Singapore
- Prior art keywords
- substrate position
- position aligner
- aligner
- substrate
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/136—Associated with semiconductor wafer handling including wafer orienting means
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201361792705P | 2013-03-15 | 2013-03-15 | |
| PCT/US2014/017435 WO2014149340A1 (en) | 2013-03-15 | 2014-02-20 | Substrate position aligner |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201507155TA true SG11201507155TA (en) | 2015-10-29 |
Family
ID=51527676
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201507155TA SG11201507155TA (en) | 2013-03-15 | 2014-02-20 | Substrate position aligner |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US9218996B2 (en) |
| EP (1) | EP2973677B1 (en) |
| JP (1) | JP6842300B2 (en) |
| CN (1) | CN105051882B (en) |
| SG (1) | SG11201507155TA (en) |
| TW (1) | TWI633620B (en) |
| WO (1) | WO2014149340A1 (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20120110816A1 (en) * | 2010-11-08 | 2012-05-10 | The Boeing Company | Engine Loading System |
| JP6532800B2 (en) | 2015-10-21 | 2019-06-19 | 東芝メモリ株式会社 | Antireflection member and orienter device |
| WO2017091331A1 (en) * | 2015-11-23 | 2017-06-01 | Applied Materials, Inc. | On-board metrology (obm) design and implication in process tool |
| CN106683978B (en) * | 2016-12-23 | 2019-02-05 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Cleaning equipment chip idle pulley structure and application method after CMP |
| KR101756743B1 (en) * | 2016-12-30 | 2017-07-12 | 김태훈 | Buffer chamber unit for wafer fabricating equipment |
| JP6836913B2 (en) * | 2017-01-17 | 2021-03-03 | 東京エレクトロン株式会社 | Substrate processing equipment, substrate processing method, and storage medium |
| CN117157741A (en) * | 2021-03-03 | 2023-12-01 | 应用材料公司 | Drying system with integrated substrate alignment stage |
| CN116913825B (en) * | 2023-09-11 | 2023-12-22 | 深圳市星国华先进装备科技有限公司 | Multidirectional fault alarm equipment for wafer processing |
Family Cites Families (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3964957A (en) * | 1973-12-19 | 1976-06-22 | Monsanto Company | Apparatus for processing semiconductor wafers |
| JPS5666036A (en) * | 1979-11-05 | 1981-06-04 | Canon Inc | Wafer positioner |
| JPS6085536A (en) * | 1983-10-17 | 1985-05-15 | Hitachi Ltd | Wafer positioning device |
| US4887904A (en) * | 1985-08-23 | 1989-12-19 | Canon Kabushiki Kaisha | Device for positioning a semi-conductor wafer |
| US4765793A (en) * | 1986-02-03 | 1988-08-23 | Proconics International, Inc. | Apparatus for aligning circular objects |
| US4813840A (en) * | 1987-08-11 | 1989-03-21 | Applied Materials, Inc. | Method of aligning wafers and device therefor |
| US4952115A (en) * | 1988-02-29 | 1990-08-28 | Tel Sagami Limited | Wafer support device |
| JPH02178947A (en) * | 1988-12-29 | 1990-07-11 | Fujitsu Ltd | Notch aligning mechanism of semiconductor wafer |
| US5238354A (en) * | 1989-05-23 | 1993-08-24 | Cybeq Systems, Inc. | Semiconductor object pre-aligning apparatus |
| EP0435057A1 (en) * | 1989-12-20 | 1991-07-03 | Nitto Denko Corporation | A wafer shape detecting method |
| US5183378A (en) * | 1990-03-20 | 1993-02-02 | Tokyo Electron Sagami Limited | Wafer counter having device for aligning wafers |
| US5194743A (en) * | 1990-04-06 | 1993-03-16 | Nikon Corporation | Device for positioning circular semiconductor wafers |
| JP2559076B2 (en) * | 1990-06-28 | 1996-11-27 | キヤノン株式会社 | Pre-alignment device |
| JPH0785471B2 (en) * | 1990-10-16 | 1995-09-13 | 信越半導体株式会社 | Etching equipment |
| JP2868645B2 (en) * | 1991-04-19 | 1999-03-10 | 東京エレクトロン株式会社 | Wafer transfer device, wafer inclination detecting method, and wafer detecting method |
| US5513948A (en) * | 1991-05-17 | 1996-05-07 | Kensington Laboratories, Inc. | Universal specimen prealigner |
| US5340437A (en) * | 1993-10-08 | 1994-08-23 | Memc Electronic Materials, Inc. | Process and apparatus for etching semiconductor wafers |
| US6225012B1 (en) * | 1994-02-22 | 2001-05-01 | Nikon Corporation | Method for positioning substrate |
| JPH0817898A (en) * | 1994-06-24 | 1996-01-19 | Fujitsu Ltd | Alignment method and its device |
| JPH08288370A (en) * | 1995-04-11 | 1996-11-01 | Canon Inc | Wafer position aligner |
| JP3468056B2 (en) * | 1997-09-23 | 2003-11-17 | 東京エレクトロン株式会社 | Substrate detection device |
| JP3610426B2 (en) * | 1998-06-04 | 2005-01-12 | 東京エレクトロン株式会社 | Substrate attitude control device |
| TW412817B (en) * | 1998-06-19 | 2000-11-21 | Matsushita Electric Ind Co Ltd | A bump bonding apparatus and method |
| KR100364601B1 (en) * | 2000-09-19 | 2002-12-16 | 삼성전자 주식회사 | Wafer flat zone aligner |
| JP2002164418A (en) * | 2000-11-24 | 2002-06-07 | Ses Co Ltd | Apparatus for positioning wafer |
| JP2002289674A (en) * | 2001-03-26 | 2002-10-04 | Tokyo Electron Ltd | Apparatus and method for aligning notched part of substrate |
| CH713466B1 (en) * | 2001-07-12 | 2018-08-15 | Murata Machinery Ltd | Apparatus and method for the harmonized positioning of wafer wafers. |
| WO2003043077A1 (en) * | 2001-11-14 | 2003-05-22 | Rorze Corporation | Wafer positioning method and apparatus, processing system, and method for positioning wafer seat rotating axis of wafer positioning apparatus |
| JP2006156599A (en) * | 2004-11-26 | 2006-06-15 | Sekisui Chem Co Ltd | Wafer processing method and processing apparatus |
| JP2010239060A (en) * | 2009-03-31 | 2010-10-21 | Tokyo Electron Ltd | Method for appointing orientation flat, apparatus for detecting orientation flat, and program for appointing orientation flat |
-
2014
- 2014-02-20 EP EP14770295.5A patent/EP2973677B1/en active Active
- 2014-02-20 JP JP2016500313A patent/JP6842300B2/en active Active
- 2014-02-20 SG SG11201507155TA patent/SG11201507155TA/en unknown
- 2014-02-20 WO PCT/US2014/017435 patent/WO2014149340A1/en active Application Filing
- 2014-02-20 CN CN201480017510.8A patent/CN105051882B/en active Active
- 2014-03-03 US US14/195,343 patent/US9218996B2/en active Active
- 2014-03-05 TW TW103107455A patent/TWI633620B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| EP2973677A1 (en) | 2016-01-20 |
| JP2016512924A (en) | 2016-05-09 |
| WO2014149340A1 (en) | 2014-09-25 |
| TW201448102A (en) | 2014-12-16 |
| CN105051882B (en) | 2019-01-18 |
| JP6842300B2 (en) | 2021-03-17 |
| EP2973677A4 (en) | 2016-11-16 |
| CN105051882A (en) | 2015-11-11 |
| US9218996B2 (en) | 2015-12-22 |
| US20140271085A1 (en) | 2014-09-18 |
| EP2973677B1 (en) | 2022-10-05 |
| TWI633620B (en) | 2018-08-21 |
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